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17 条记录 (耗时 0.019 秒)

    Method of cutting liquid crystal display panel
    1.
    发明授权
    Method of cutting liquid crystal display panel 有权

    公开(公告)号：US10139683B2

    公开(公告)日：2018-11-27

    申请号：US14742400

    申请日：2015-06-17

    申请人： Samsung Display Co., Ltd.

    发明人： Min Su Kim ,  Jang-Hyun Kim ,  Tae Wook Kang ,  Tae Woon Cha

    IPC分类号： G02F1/1339 ,  G02F1/1333

    摘要： A mother substrate assembly according to an exemplary embodiment of the present invention includes: a first mother substrate and a second mother substrate formed with a plurality of unit liquid crystal panels; and a sealant formed between the first mother substrate and the second mother substrate and combining the mother substrates, wherein the sealant encloses a circumference of each unit liquid crystal panel, and includes a first irradiation line formed in the sealant, and a second irradiation line formed in the sealant of a side closer to the unit liquid crystal panel than the first irradiation line.

    CHIP BONDING APPARATUS AND CHIP BONDING METHOD
    2.
    发明申请
    CHIP BONDING APPARATUS AND CHIP BONDING METHOD 有权
    芯片接合装置和芯片接合方法

    公开(公告)号：US20160155719A1

    公开(公告)日：2016-06-02

    申请号：US14706752

    申请日：2015-05-07

    申请人： Samsung Display Co., Ltd.

    发明人： Seong Beom JEONG ,  Min Su Kim

    IPC分类号： H01L23/00

    CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/83048 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83851

    摘要： The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.

    摘要翻译： 用于芯片接合方法的芯片接合装置包括：加热单元，用于在第一温度下加热各向异性导电膜; 用于将集成电路芯片附接到各向异性导电膜的附接单元; 衬底就座的阶段; 芯片传送单元，用于移动和对准附着到基板上的各向异性导电膜的集成电路芯片; 以及结合头，其布置在所述平台上方，以在低于所述第一温度的第二温度下将所述集成电路芯片通过所述集成电路芯片的热压缩而将附着于所述各向异性导电膜的所述集成电路芯片接合到所述基板上。

    Decorative print member and display device including the same
    5.
    发明授权
    Decorative print member and display device including the same 有权

    公开(公告)号：US11554571B2

    公开(公告)日：2023-01-17

    申请号：US15842634

    申请日：2017-12-14

    申请人： Samsung Display Co., Ltd.

    发明人： Min Su Kim ,  Ji Young Wang

    IPC分类号： B32B3/30 ,  B41M3/00

    摘要： A decorative print member and a display device including the decorative print member are provided. The decorative print member includes a base layer, a first decorative print pattern disposed on the base layer, and a shielding layer disposed over the first decorative print pattern. The first decorative print pattern includes a first decorative print layer disposed on the base layer, and a second decorative print layer disposed on the first decorative print layer. The shielding layer covers upper and side surfaces of the second decorative print layer, and a side surface of the first decorative print layer protrudes outwardly from the side surface of the second decorative print layer and a side surface of the shielding layer.

    Chip bonding apparatus and chip bonding method
    9.
    发明授权
    Chip bonding apparatus and chip bonding method 有权
    芯片接合装置和芯片接合方法

    公开(公告)号：US09570417B2

    公开(公告)日：2017-02-14

    申请号：US14706752

    申请日：2015-05-07

    申请人： Samsung Display Co., Ltd.

    发明人： Seong Beom Jeong ,  Min Su Kim

    IPC分类号： H01L21/00 ,  H01L23/00

    CPC分类号： H01L24/83 ,  H01L24/75 ,  H01L2224/83048 ,  H01L2224/83091 ,  H01L2224/83121 ,  H01L2224/83851

    摘要： The chip bonding apparatus used in a chip bonding method includes a heating unit for heating an anisotropic conductive film at a first temperature; an attachment unit for attaching an integrated circuit chip to the anisotropic conductive film; a stage on which a substrate is seated; a chip transport unit for moving and aligning the integrated circuit chip that is attached to the anisotropic conductive film on the substrate; and a bonding head arranged above the stage to bond the integrated circuit chip that is attached to the anisotropic conductive film onto the substrate through thermo-compression of the integrated circuit chip onto the substrate at a second temperature that is lower than the first temperature.

    摘要翻译： 用于芯片接合方法的芯片接合装置包括：加热单元，用于在第一温度下加热各向异性导电膜; 用于将集成电路芯片附接到各向异性导电膜的附接单元; 衬底就座的阶段; 芯片传送单元，用于移动和对准附着到基板上的各向异性导电膜的集成电路芯片; 以及结合头，其布置在所述平台上方，以在低于所述第一温度的第二温度下将所述集成电路芯片通过所述集成电路芯片的热压缩而将附着于所述各向异性导电膜的所述集成电路芯片接合到所述基板上。