Sputtering device and method of forming layer using the same
    3.
    发明授权
    Sputtering device and method of forming layer using the same 有权
    溅射装置及其形成方法

    公开(公告)号:US09410234B2

    公开(公告)日:2016-08-09

    申请号:US14670403

    申请日:2015-03-26

    CPC classification number: C23C14/044 H01J37/34 H01J37/3447

    Abstract: Provided are a sputtering device and a method of forming a layer using the same.The method of forming a layer using the sputtering device includes: placing a substrate within a chamber; depositing target particles emitted from a target, which faces the substrate, on the substrate using a sputtering process; and horizontally moving a plurality of shield rods, which are installed in a shield mask disposed between the substrate and the target and are separated from each other along a first direction, during the sputtering process.

    Abstract translation: 提供溅射装置和使用其形成层的方法。 使用溅射装置形成层的方法包括:将基板放置在室内; 使用溅射工艺将从面向衬底的靶发射的靶颗粒沉积在衬底上; 并且水平移动多个屏蔽杆,其安装在设置在基板和靶之间的屏蔽掩模中,并且在溅射过程期间沿着第一方向彼此分离。

    Thin film transistor array panel and organic light emitting diode display including the same

    公开(公告)号:US10734461B2

    公开(公告)日:2020-08-04

    申请号:US16250642

    申请日:2019-01-17

    Abstract: An exemplary embodiment of the present invention provides a thin film transistor array panel and an organic light emitting diode display including the same including a substrate, a semiconductor disposed on the substrate, a first gate insulation layer disposed on the semiconductor, and a first diffusion barrier layer disposed on the first gate insulation layer. A second diffusion barrier layer is disposed on a lateral surface of the first diffusion barrier layer. A first gate electrode is disposed on the first diffusion barrier layer. A source electrode and a drain electrode are connected to the semiconductor. The first diffusion barrier layer comprises a metal, and the second diffusion barrier layer comprises a metal oxide including the metal.

Patent Agency Ranking