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1.
公开(公告)号:US11004677B2
公开(公告)日:2021-05-11
申请号:US16103116
申请日:2018-08-14
发明人: Dong Kyun Ko , Woo Jin Kim , In Kyo Kim , Keun Hee Park , Suk Won Jung
IPC分类号: H01L21/02 , H01L21/28 , H01L23/522 , H01J37/32 , C23C16/455 , C23C16/40 , C23C16/517
摘要: A method and a device for forming a highly dielectric metal oxide layer. The method includes repeatedly causing a plasma-off period and a plasma-on period while an organic metal compound and an oxidizing agent are continuously injected into a chamber. One cycle includes one plasma-off period and one plasma-on period. During the plasma-off period, a physical and chemical adsorption layer including an organic metal compound and a plurality of atomic layers is formed on a substrate. During the plasma-on period, a metal oxide layer that is thicker than two atomic layers is formed by a chemical reaction of metal atoms in the physical and chemical adsorption layer and oxygen atoms in the oxidizing agent.
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公开(公告)号:US10679858B2
公开(公告)日:2020-06-09
申请号:US16163629
申请日:2018-10-18
发明人: Dong Kyun Ko , Woo Jin Kim , Myung Soo Huh , In Kyo Kim , Keun Hee Park
IPC分类号: H01L21/28 , C23C16/448 , C23C16/452 , C23C16/455 , H01L29/51
摘要: A deposition apparatus includes a chamber, a susceptor that supports a substrate in the chamber, an upper electrode facing the susceptor, a showerhead defining a gas inlet space between the upper electrode and the susceptor, a metal source storage to store a metal source supplied to the chamber, a vaporizer to vaporize the metal source, a first gas source to supply a first gas to move the metal source toward the vaporizer, a second gas source to supply a second gas to move the metal source in the vaporizer toward the chamber, a third gas source connected to the chamber to supply a third gas into a reaction space defined between the susceptor and the upper electrode such that the third gas reacts with the metal source, and a fourth gas source connected to the chamber to supply a fourth gas used to clean an inside of the chamber.
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公开(公告)号:US09809880B2
公开(公告)日:2017-11-07
申请号:US14444231
申请日:2014-07-28
发明人: Choel Min Jang , In Kyo Kim , Suk Won Jung , Myung Soo Huh
IPC分类号: C23C16/00 , C23C16/44 , C23C16/455 , C23C16/54
CPC分类号: C23C16/45546 , C23C16/45502 , C23C16/45527 , C23C16/45548 , C23C16/45578 , C23C16/545
摘要: An atomic layer deposition apparatus includes a first base plate on which a seat portion is defined to allow a substrate to be seated thereon, a second base plate disposed opposite to the first base plate, a first gas nozzle portion arranged on the second base plate, a second gas nozzle portion arranged on the second base plate to be spaced apart from the first gas nozzle portion and substantially parallel to the first gas nozzle portion, and a gas storage portion connected to the first gas nozzle portion and the second gas nozzle portion.
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