公开(公告)号：US20140011352A1

公开(公告)日：2014-01-09

申请号：US13728463

申请日：2012-12-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jong-Hyun CHOUNG ,  In-Bae KIM ,  Seon-Il KIM ,  Hong Sick PARK ,  Jae Woo JEONG ,  Gyu-Po KIM ,  Won-Guk SEO ,  Hyun-Cheol SHIN ,  Ki-Beom LEE ,  Sam-Young CHO ,  Seung-Yeon HAN

IPC: C23F1/18 ,  H01L21/48

CPC classification number: C23F1/18 ,  C23F1/26 ,  H01L21/4814

Abstract: A metal wire etchant including persulfate, a sulfonate, a fluorine compound, an azole-based compound, an organic acid, a nitrate, and a chlorine compound, and a method of making the same.

Abstract translation: 包括过硫酸盐，磺酸盐，氟化合物，唑类化合物，有机酸，硝酸盐和氯化合物的金属线蚀刻剂及其制备方法。

公开(公告)号：US20140097006A1

公开(公告)日：2014-04-10

申请号：US13874934

申请日：2013-05-01

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Hong-Sick PARK ,  Wang-Woo LEE ,  Bong-Kyun KIM ,  Jong-Hyun CHOUNG ,  Young-Woo PARK ,  Gyu-Po KIM ,  Won-Guk SEO ,  Hyun-Cheol SHIN ,  Seung-Yeon HAN ,  Ki-Beom LEE ,  Sam-Young CHO

IPC: H05K3/06 ,  H05K1/09

CPC classification number: H05K3/067 ,  H01L27/1225 ,  H01L27/124 ,  H01L29/458 ,  H01L29/4908 ,  H01L29/7869 ,  H05K1/09

Abstract: A wet etching composition usable for etching a copper-based wiring layer includes between about 40% by weight to about 60% by weight of phosphoric acid, between about 1% by weight to about 10% by weight of nitric acid, between about 3% by weight to about 15% by weight of acetic acid, between about 0.01% by weight to about 0.1% by weight of a copper-ion compound, between about 1% by weight to about 10% by weight of a nitric salt, between about 1% by weight to about 10% by weight of an acetic salt, and a remainder of water

Abstract translation: 可用于蚀刻铜基布线层的湿蚀刻组合物包括约40重量％至约60重量％的磷酸，约1重量％至约10重量％的硝酸，约3重量％ 至约15重量％的乙酸，约0.01重量％至约0.1重量％的铜离子化合物，约1重量％至约10重量％的硝酸盐之间，介于约 1重量％至约10重量％的乙酸盐，剩余的水

公开(公告)号：US20140295626A1

公开(公告)日：2014-10-02

申请号：US13964371

申请日：2013-08-12

Applicant: Samsung Display Co., Ltd.

Inventor： Hong-Sick PARK ,  Young-Jun KIM ,  Young-Woo PARK ,  Wang-Woo LEE ,  Won-Guk SEO ,  Sam-Young CHO ,  Seung-Yeon HAN ,  Gyu-Po KIM ,  Hyun-Cheol SHIN ,  Ki-Beom LEE

IPC: C23F1/18 ,  H01L27/12 ,  H01L21/28 ,  H01L21/67

CPC classification number: C23F1/18 ,  H01L21/67075 ,  H01L27/124 ,  H01L27/1259 ,  H01L29/4908 ,  H01L29/66969 ,  H01L29/78633 ,  H01L29/7869

Abstract: An etchant composition includes about 25 percent by weight to about 35 percent by weight of phosphoric acid, about 3 percent by weight to about 9 percent by weight of nitric acid, about 10 percent by weight to about 20 percent by weight of acetic acid, about 5 percent by weight to about 10 percent by weight of a nitrate, about 6 percent by weight to about 15 percent by weight of a sulfonic acid, about 1 percent by weight to about 5 percent by weight of an amine compound including a carboxyl group, about 0.1 percent by weight to about 1 percent by weight of a water-soluble amino acid, about 0.01 percent by weight to about 1 percent by weight of an azole compound, and water.

Abstract translation: 蚀刻剂组合物包括约25重量％至约35重量％的磷酸，约3重量％至约9重量％的硝酸，约10重量％至约20重量％的乙酸，约 5重量％至10重量％的硝酸盐，约6重量％至约15重量％的磺酸，约1重量％至约5重量％的包含羧基的胺化合物， 约0.1重量％至约1重量％的水溶性氨基酸，约0.01重量％至约1重量％的唑化合物和水。