公开(公告)号：US11968775B2

公开(公告)日：2024-04-23

申请号：US17326267

申请日：2021-05-20

Applicant: Samsung Display Co., Ltd.

Inventor： Yeon Sun Na ,  Min Soo Choi

IPC: H05K1/02 ,  H01L25/18 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/0245 ,  H01L25/18 ,  H05K1/0225 ,  H05K1/148 ,  H05K1/189 ,  H05K2201/049 ,  H05K2201/0723 ,  H05K2201/09727 ,  H05K2201/10128

Abstract: An embodiment of a printed circuit board includes a first insulating layer, a metal layer disposed above the first insulating layer, a second insulating layer disposed above the metal layer, and signal lines disposed above the second insulating layer, the signal lines extending in a first direction and having line widths in a second direction perpendicular to the first direction. The metal layer has open areas overlapping the signal lines in a third direction perpendicular to the first and second directions. In another embodiment, the open areas are replaced with metal meshes.

公开(公告)号：US09754804B2

公开(公告)日：2017-09-05

申请号：US15164228

申请日：2016-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jeong Hun Go ,  Yeon Sun Na ,  Jeong Mo Nam ,  Hyun Seok Hong

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/54 ,  H01L21/48 ,  H01L21/52 ,  H01L23/18 ,  H01L23/498

CPC classification number: H01L21/54 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/52 ,  H01L23/18 ,  H01L23/49811 ,  H01L23/49838

Abstract: A method of mounting an electronic device includes: preparing a printed circuit board including a base substrate, connection pads disposed on the base substrate and spaced apart from each other, and a solder resist including contact holes exposing a portion of the connection pads; disposing preliminary bumps on the exposed portion of the connection pads via the contact holes; disposing under-fill patterns in areas between the preliminary bumps on the solder resist; disposing an electronic device on the preliminary bumps and the under-fill patterns; and mounting the electronic device onto the printed circuit board by reflowing the preliminary bumps and the under-fill patterns. The disposing of the under-fill patterns may include: providing an under-fill film including a base film having openings spaced apart from each other, and the under-fill patterns disposed within the openings; applying pressure to the under-fill film; and removing the base film from the under-fill film.