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1.
公开(公告)号:US20240178201A1
公开(公告)日:2024-05-30
申请号:US18433201
申请日:2024-02-05
Applicant: Samsung Display Co., LTD.
Inventor: Jun Bo SIM , Duk Ki KIM , Yong Hwi KIM , Hyo Jin KO , Chang Hee LEE , Chan Woo JOO , Jae Kook HA , Na Mi HONG
IPC: H01L25/075 , B82B3/00 , C09D11/322 , C09D11/38 , C09D11/50 , H01L27/12 , H01L33/24 , H01L33/38 , H01L33/44 , H01L33/62
CPC classification number: H01L25/0753 , B82B3/0052 , C09D11/322 , C09D11/38 , C09D11/50 , H01L27/1214 , H01L33/24 , H01L33/38 , H01L33/44 , H01L33/62 , H01L2933/0066
Abstract: A light-emitting element ink, a display device, and a method of fabricating the display device are provided. The light-emitting element ink includes a light-emitting element solvent, light-emitting elements dispersed in the light-emitting element solvent, each of the light-emitting elements including a plurality of semiconductor layers and an insulating film that surrounds parts of outer surfaces of the semiconductor layers, and a surfactant dispersed in the light-emitting element solvent, the surfactant including a fluorine-based and/or a silicon-based surfactant.
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公开(公告)号:US20220037559A1
公开(公告)日:2022-02-03
申请号:US17319602
申请日:2021-05-13
Applicant: Samsung Display Co., LTD.
Inventor: Hyo Jin KO , Duk Ki KIM , Jun Bo SIM , Na Mi HONG , Yong Hwi KIM , Chang Hee LEE , Jae Kook HA
Abstract: A light emitting element ink comprises a light emitting element solvent, a light emitting element dispersed in the light emitting element solvent, the light emitting element including a plurality of semiconductor layers, and an insulating film surrounding outer surfaces of the plurality of semiconductor layers, and a thickener dispersed in the light emitting element solvent, wherein the thickener includes a compound represented by Chemical Structural Formula 1 as a polyol-based compound capable of forming a hydrogen bond with the light emitting element solvent or another thickener, and the thickener has a boiling point in a range of about 200° C. to about 450° C.
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公开(公告)号:US20150268412A1
公开(公告)日:2015-09-24
申请号:US14473734
申请日:2014-08-29
Applicant: Samsung Display Co., Ltd.
Inventor: Lu Ly LEE , Yong Hwi KIM , Dong Hyeon LEE , Seung Hwa HA
IPC: F21V8/00
CPC classification number: G02B6/0091 , G02B6/0083
Abstract: A backlight assembly comprises: a receptacle; a support frame; and a light source module. The support frame is arranged on one side of the receptacle. The light source module is accommodated in the support frame and includes a printed circuit board and light sources. The support frame includes: a bottom portion; a side wall portion; a cover portion; a gap holding portion; and an insertion groove. The side wall portion extends from the bottom portion. The cover portion extends from the side wall portion to an inside. The gap holding portion extends from an end portion of the cover portion in a direction of the bottom portion. The printed circuit board is partially inserted into the insertion groove to be arranged on the upper surface of the bottom portion. The light sources are surrounded by the side wall portion, the cover portion, and the gap holding portion.
Abstract translation: 背光组件包括:容器; 支撑框架 和光源模块。 支撑架布置在容器的一侧。 光源模块容纳在支撑框架中,并且包括印刷电路板和光源。 支撑框架包括:底部; 侧壁部分; 盖部分; 间隙保持部; 和插入槽。 侧壁部分从底部延伸。 盖部从侧壁部延伸到内侧。 间隙保持部从盖部的端部沿着底部的方向延伸。 印刷电路板部分地插入到插入槽中以布置在底部的上表面上。 光源被侧壁部分,盖部分和间隙保持部分包围。
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公开(公告)号:US20210391308A1
公开(公告)日:2021-12-16
申请号:US17241943
申请日:2021-04-27
Applicant: Samsung Display Co., Ltd.
Inventor: Jun Bo SIM , Duk Ki KIM , Yong Hwi KIM , Hyo Jin KO , Chang Hee LEE , Chan Woo JOO , Jae Kook HA , Na Mi HONG
IPC: H01L25/075 , H01L27/12 , H01L33/24 , H01L33/38 , H01L33/44 , H01L33/62 , B82B3/00 , C09D11/50 , C09D11/322 , C09D11/38 , C09D11/037
Abstract: A light-emitting element ink, a display device, and a method of fabricating the display device are provided. The light-emitting element ink includes a light-emitting element solvent, light-emitting elements dispersed in the light-emitting element solvent, each of the light-emitting elements including a plurality of semiconductor layers and an insulating film that surrounds parts of outer surfaces of the semiconductor layers, and a surfactant dispersed in the light-emitting element solvent, the surfactant including a fluorine-based and/or a silicon-based surfactant.
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5.
公开(公告)号:US20150219964A1
公开(公告)日:2015-08-06
申请号:US14307633
申请日:2014-06-18
Applicant: Samsung Display Co. Ltd.
Inventor: Se Ki PARK , Su Chang RYU , Jae Sang LEE , Yong Hwi KIM
IPC: G02F1/1335
CPC classification number: G02F1/133608 , G02F1/133605 , G02F1/133606 , G02F2001/133314 , G02F2001/133328
Abstract: A backlight unit includes a light source portion configured to provide light to a display panel, a reflection sheet arranged on a lower part of the light source portion, a mold frame accommodating the light source portion, and a support frame which supports the mold frame and includes a bottom portion, first and second side wall portions which extend upward from both end sides of the bottom portion and face each other, a ceiling portion which extends in a horizontal direction from an upper end of the first side wall portion, and a slant portion slanted downward from an end part of the ceiling portion and having one end that comes in contact with the end part of the ceiling portion and the other end that comes in contact with an upper end of the second side wall portion.
Abstract translation: 背光单元包括被配置为向显示面板提供光的光源部,布置在光源部的下部的反射片,容纳光源部的模架,以及支撑模框的支撑框架, 包括底部,从底部的两端侧向上延伸并彼此面对的第一和第二侧壁部分,从第一侧壁部分的上端沿水平方向延伸的顶部和倾斜的 部分从顶部的端部向下倾斜,并且具有与顶部的端部接触的一端和与第二侧壁部的上端接触的另一端。
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6.
公开(公告)号:US20220093817A1
公开(公告)日:2022-03-24
申请号:US17476993
申请日:2021-09-16
Applicant: Samsung Display Co., LTD.
Inventor: Hyo Jin KO , Duk Ki KIM , Yong Hwi KIM , Jun Bo SIM , Na Mi HONG , Jong Hyuk KANG , Gyu Bong KIM , Hoi Lim KIM , Sae Na YUN , Chang Hee LEE , Hyun Deok IM , Eun A CHO , Jae Kook HA
IPC: H01L33/00 , H01L27/15 , H01L33/24 , H01L33/38 , H01L33/44 , B82B3/00 , C09D11/52 , C09D11/50 , C09D11/033
Abstract: An ink includes a solvent, and light-emitting elements dispersed in the solvent, each of the light-emitting elements comprising semiconductor layers and an insulating film partially surrounding outer surfaces of the semiconductor layers, wherein the solvent has Hansen solubility parameters of a polarity parameter between about 4 and about 9 and a hydrogen bonding parameter between about 6 and about 11.
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