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公开(公告)号：US20220104356A1
公开(公告)日：2022-03-31
申请号：US17487673
申请日：2021-09-28
发明人： Bongkyu MIN , Taewoo KIM , Jinyong PARK , Hyelim YUN , Hyeongju LEE , Sanghoon PARK , Jiseon HAN
IPC分类号： H05K1/14 , H05K1/11 , H04M1/02 , H01L23/528
摘要： The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
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公开(公告)号：US20240339391A1
公开(公告)日：2024-10-10
申请号：US18745592
申请日：2024-06-17
发明人： Yunoh CHI , Sanghoon PARK , Wonseob KIM , Yongjae SONG , Kyungho LEE
IPC分类号： H01L23/498 , H01L21/48 , H05K1/14
CPC分类号： H01L23/49827 , H01L21/486 , H01L23/49838 , H05K1/14 , H05K2201/10378
摘要： An electronic device according to various embodiments of the disclosure may include: a first printed circuit board; a second printed circuit board; and an interposer having one surface on which the first printed circuit board is disposed and the other surface on which the second printed circuit board is disposed, wherein the interposer includes: a first via including a first via hole and a first plating layer; a second via including a second via hole having a diameter being increased toward a direction getting away from the first via and a second plating layer coming in contact with the first plating layer, and disposed at one end of the first via; a third via hole having a diameter being increased toward the direction getting away from the first via and a third plating layer coming in contact with the first plating layer.
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公开(公告)号：US20220256705A1
公开(公告)日：2022-08-11
申请号：US17728363
申请日：2022-04-25
发明人： Sangwon HA , Seyoung JANG , Sungjin KIM , Sanghoon PARK , Kyungho LEE , Younoh CHI
IPC分类号： H05K1/14 , H01L25/065
摘要： An electronic device is provided that includes a first circuit board including a first electronic component and a second electronic component disposed on a side of the first circuit board, a second circuit board spaced apart from the first circuit board and having a side facing the side of the first circuit board on which the first electronic component and the second electronic component are disposed, a first interposer disposed between the first circuit board and the second circuit board to form an inner space between the first circuit board and the second circuit board, and a second interposer disposed between the first circuit board and the second circuit board to divide the inner space into a first region and a second region, and wherein the first interposer and the second interposer electrically connect the first circuit board to the second circuit board.
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公开(公告)号：US20230403795A1
公开(公告)日：2023-12-14
申请号：US18456153
申请日：2023-08-25
发明人： Sangwon HA , Subyung KANG , Sanghoon PARK , Soohyun SEO , Yongjin WOO , Yeomoon YOON
IPC分类号： H05K1/14
CPC分类号： H05K1/145 , H05K1/144 , H01L2023/4087
摘要： An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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公开(公告)号：US20230387598A1
公开(公告)日：2023-11-30
申请号：US18446906
申请日：2023-08-09
发明人： Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
CPC分类号： H01Q9/0457 , H01Q9/0414 , H01Q21/065
摘要： The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An antenna structure of a wireless communication system is provided. The antenna structure includes a first radiator, a first printed circuit board (PCB) in which the first radiator is arranged, a plurality of second radiators, a second PCB in which the plurality of second radiators are arranged, and a frame structure, wherein the frame structure is arranged such that an air layer is formed between the first PCB and the second PCB, and the plurality of second radiators can include a first metal patch arranged in a region corresponding to the first radiator, and a plurality of second metal patches arranged to be separated from the first metal patch so as to be fed by coupling.
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公开(公告)号：US20230163488A1
公开(公告)日：2023-05-25
申请号：US18152311
申请日：2023-01-10
发明人： Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
摘要： An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号：US20220069924A1
公开(公告)日：2022-03-03
申请号：US17415385
申请日：2019-12-26
发明人： Byungchul KIM , Sanghoon PARK , Seungtae KO , Seungku HAN , Youngju LEE
摘要： The present invention relates to a communication technique for converging IoT technology with a 5G communication system for supporting a higher data transmission rate beyond a 4G system, and a system therefor. The present disclosure may be applied to an intelligent service (for example, a smart home, a smart building, a smart city, a smart car or connected car, health care, digital education, retail business, a security and safety-related service, etc.) on the basis of 5G communication technology and IoT-related technology. The present invention provides a device for testing an antenna module, the device comprising: a seating unit which has seated thereon a first antenna module comprising a plurality of antenna elements; a second antenna module which comprises a plurality of antenna elements and is disposed so as to face the seating unit so as to be capable of emitting a radio wave toward the first antenna module; and a control unit which is electrically connected to the second antenna module and tests the performance of the first antenna module by controlling the second antenna module by grouping each antenna element of the second antenna module into at least one antenna element group.
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公开(公告)号：US20240120636A1
公开(公告)日：2024-04-11
申请号：US18218369
申请日：2023-07-05
发明人： Sangyoon LEE , Junsig KUM , Sanghoon PARK , Seungtae KO , Jungyub LEE
摘要： An electronic device includes an antenna board configured for massive MIMO. The antenna board is coupled to a filter board using signal contacts with elasticity and ground contacts with elasticity. The configuration of the signal contacts and the ground contacts permits a satisfactory accumulated tolerance in terms of component precision.
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9.发明公开公开(公告)号：US20230361451A1
公开(公告)日：2023-11-09
申请号：US18208349
申请日：2023-06-12
发明人： Sanghoon PARK , Juneseok LEE , Dohyuk HA , Jungyub LEE , Jinsu HEO , Youngju LEE
CPC分类号： H01Q1/246 , H01Q1/1271 , H01Q1/42
摘要： The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. Disclosed is a cover device configured to protect an antenna device embedded in an electronic device to radiate a beam of an ultra-high frequency band, the cover device including: a cover frame including a window area corresponding to a radiation area of the antenna device; and a functional structure disposed in the window area on the cover frame and having a stacked structure comprising one or more functional layers.
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公开(公告)号：US20230231296A1
公开(公告)日：2023-07-20
申请号：US18186554
申请日：2023-03-20
发明人： Bumhee LEE , Yoongeon KIM , Seungho CHOI , Sanghoon PARK , Seokmin LEE , Youngju LEE , Joon HUH
CPC分类号： H01Q1/2283 , H01Q21/065 , H01Q21/0087
摘要： The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a data transmission rate higher than that of a 4th generation (4G) communication system such as long term evolution (LTE). An electronic device including an antenna in a wireless communication system is provided. The electronic device includes a radiator, a body, and a feeding circuit for transmitting a signal, wherein the radiator is coupled to at least a part of the body, the feeding circuit is coupled to the body to support the body, and the radiator is disposed to be spaced apart from the feeding circuit to form an air gap.
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