公开(公告)号：US20170041856A1

公开(公告)日：2017-02-09

申请号：US15229053

申请日：2016-08-04

Applicant: Samsung Electronics Co., Ltd

Inventor： Byoung-Joo Kim ,  Dong-Hoon Kim ,  Yong-Wook Kim ,  Dong-Ouk Moon ,  Tai-Ho Choi

IPC: H04W48/10 ,  H04W4/02 ,  H04W4/00

CPC classification number: H04W48/10 ,  H04L67/16 ,  H04L67/18 ,  H04W4/023 ,  H04W4/029 ,  H04W4/80 ,  H04W84/18

Abstract: An electronic device implements a method for providing a service in the electronic device. The electronic device includes a communication module configured to provide short-range wireless communication, and a control module. The control module is configured to broadcast a service request for a service by short-range wireless communication through the communication module. The control module is configured to receive service information corresponding to the service from at least one external electronic device receiving the service request, and to execute at least one function related to the service based on at least one piece of the service information.

Abstract translation: 电子设备实现在电子设备中提供服务的方法。 电子设备包括配置为提供短距离无线通信的通信模块和控制模块。 控制模块被配置为通过通信模块通过短距离无线通信广播服务的服务请求。 所述控制模块被配置为从至少一个接收所述服务请求的外部电子设备接收对应于所述服务的服务信息，并且基于所述服务信息的至少一个来执行与所述服务相关的至少一个功能。

公开(公告)号：US10075896B2

公开(公告)日：2018-09-11

申请号：US15178655

申请日：2016-06-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongwook Kim ,  Dong-Hoon Kim ,  Byoung-Joo Kim ,  Dongouk Moon ,  Tai Ho Choi

IPC: H04W40/24 ,  G06Q30/02 ,  H04W4/021 ,  H04L29/08 ,  H04M1/725 ,  H04W4/80

CPC classification number: H04W40/244 ,  G06Q30/0241 ,  H04L67/303 ,  H04M1/72583 ,  H04W4/021 ,  H04W4/80

Abstract: A method for use in an electronic device includes: receiving, from a server, beacon information including a first function information. The first function information is associated with a first function, and the first function is executed in response to detecting that a beacon signal that is received from a beacon transmitter matches beacon information.

公开(公告)号：US11061052B2

公开(公告)日：2021-07-13

申请号：US16368493

申请日：2019-03-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Hoon Lee ,  Byoung-Joo Kim ,  Mi-Rye Lee ,  Hwang-Jin Yeo ,  Tae-Jong Lee

IPC: G01R1/067 ,  G01R31/26 ,  G01R1/073

Abstract: A probe includes a probe body for providing an object with a test signal; a tip arranged on an end of the probe body to make contact with the object; and an alignment key protruded from a side of the probe body.

公开(公告)号：US20130323864A1

公开(公告)日：2013-12-05

申请号：US13761157

申请日：2013-02-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae-Bum Mo ,  Byoung-Joo Kim ,  Jin-Su Kim

IPC: H01L21/66 ,  G01R31/26

CPC classification number: H01L22/14 ,  G01R31/2601 ,  G01R31/2891 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method of manufacturing a semiconductor device including a substrate is disclosed. The method includes: providing the substrate on a wafer chuck; positioning a probe card having probe needles above the substrate; positioning a tester head above the probe card; using a sensor included in the tester head, measuring a deformation of the probe card; using a variable load device included in the tester head, adjusting the deformation of the probe card based on the measured deformation; and testing the substrate using the adjusted probe card.

Abstract translation: 公开了一种制造包括衬底的半导体器件的方法。 该方法包括：将基板设置在晶片卡盘上; 将具有探针的探针卡定位在基底上方; 将测试头放在探针卡上方; 使用包含在测试头中的传感器，测量探针卡的变形; 使用包含在测试头中的可变负载装置，根据测量的变形调整探针卡的变形; 并使用调整后的探针卡测试基板。