公开(公告)号：US20130260554A1

公开(公告)日：2013-10-03

申请号：US13905375

申请日：2013-05-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeeyong Kim ,  Woonkyung Lee ,  Sunggil Kim ,  Jin-Kyu Kang ,  Jung-Hwan Lee ,  Bonyoung Koo ,  Kihyun Hwang ,  Byoungsun Ju ,  Jintae Noh

IPC: H01L21/768 ,  H01L21/28

CPC classification number: H01L27/11526 ,  H01L21/28 ,  H01L21/76841 ,  H01L23/48 ,  H01L23/535 ,  H01L27/11521 ,  H01L27/11568 ,  H01L27/11573 ,  H01L29/4958 ,  H01L29/78 ,  H01L29/788 ,  H01L29/7883 ,  H01L29/792 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Provided are a semiconductor device and a method of manufacturing the semiconductor device. The semiconductor device includes a charge storage pattern formed on a substrate; a dielectric pattern formed on the charge storage pattern; a first conductive pattern including silicon doped with a first impurity of a first concentration, the first conductive pattern being disposed on the dielectric pattern; and a second conductive pattern including metal silicide doped with a second impurity of a second concentration, the second conductive pattern being disposed on the first conductive pattern. The first concentration may be higher than the second concentration.

Abstract translation: 提供半导体器件和制造半导体器件的方法。 半导体器件包括形成在衬底上的电荷存储图案; 形成在电荷存储图案上的电介质图案; 第一导电图案，包括掺杂有第一浓度的第一杂质的硅，所述第一导电图案设置在所述电介质图案上; 以及第二导电图案，其包括掺杂有第二浓度的第二杂质的金属硅化物，所述第二导电图案设置在所述第一导电图案上。 第一浓度可能高于第二浓度。