公开(公告)号：US20180356349A1

公开(公告)日：2018-12-13

申请号：US15867070

申请日：2018-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Ho Rim ,  YU SIN YANG ,  CHUNG SAM JUN ,  YUN JUNG JEE

IPC: G01N21/95 ,  H01L21/66 ,  H01L21/67

CPC classification number: G01N21/9501 ,  H01L21/67288 ,  H01L22/12

Abstract: A method of testing can include providing a first beam having a first focal length and a second beam having a second focal length that is less than the first focal length to a stage region to provide a first reflected beam and a second reflected beam from the stage region. The first reflected beam can be detected among the first reflected beam and the second reflected beam reflected from the stage region. The second reflected beam can be detected among the first reflected beam and the second reflected beam reflected from the stage region. A first image can be generated from the first reflected beam and a second image can be generated from the second reflected beam. The first image and the second image can be combined to provide a 3D image.

公开(公告)号：US20170160341A1

公开(公告)日：2017-06-08

申请号：US15286626

申请日：2016-10-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JAE WAN HONG ,  JEONG HOI KIM ,  YU SIN YANG ,  SANG KIL LEE ,  CHUNG SAM JUN

IPC: G01R31/28 ,  G01R1/04

CPC classification number: G01R31/2891 ,  G01R1/0416 ,  G01R1/06705

Abstract: An apparatus for exchanging a probe includes a stacker configured to receive a probe and to align the probe, a probe connector connected to the probe, and a laser alignment unit including a light emitter and a light receiver. The light emitter is configured to emit a laser beam to the probe, and the light receiver is configured to detect the laser beam reflected by the probe. The laser alignment unit is configured to detect when the probe is properly aligned on the probe connector using the light receiver, and the laser alignment unit is configured to stop moving the stacker when it is detected that the probe is properly aligned.

公开(公告)号：US20180106731A1

公开(公告)日：2018-04-19

申请号：US15672696

申请日：2017-08-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： MIN HO RIM ,  MYUNG SU OH ,  JUNG SOO KIM ,  YU SIN YANG ,  CHUNG SAM JUN ,  YUN JUNG JEE

IPC: G01N21/95 ,  G01N21/956

CPC classification number: G01N21/9501 ,  G01N21/956 ,  G01N21/95623 ,  G01N2201/066

Abstract: A semiconductor device inspecting apparatus includes a light source for emitting light to a semiconductor pattern. The semiconductor pattern includes a structure that reflects the light from the light source. The semiconductor device inspecting apparatus further includes an objective optical system disposed in a path of the reflected light from the semiconductor pattern, and a first noise filter disposed in a path of the reflected light having passed through the objective optical system, the first noise filter including at least one bar pattern that filters a diffraction noise of the light. The semiconductor device inspecting apparatus additionally includes a second noise filter disposed in a path of the filtered light from the first noise filter, the second noise filter including an outer frame surrounding a central portion. The semiconductor device inspecting apparatus further includes a first photodetector detecting the light having passed through the second noise filter.

公开(公告)号：US20170162363A1

公开(公告)日：2017-06-08

申请号：US15286678

申请日：2016-10-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JIN KWAN KIM ,  MIN KOOK KIM ,  JUNG SOO KIM ,  YU SIN YANG ,  CHUNG SAM JUN

IPC: H01J37/22 ,  H01J37/28

CPC classification number: H01J37/222 ,  G01N23/2251 ,  G01N2223/418 ,  G01N2223/423 ,  H01J37/244 ,  H01J37/28 ,  H01J2237/0473 ,  H01J2237/226 ,  H01J2237/24485 ,  H01J2237/2803 ,  H01J2237/2804 ,  H01J2237/2805 ,  H01J2237/2806

Abstract: A structure analysis method using a scanning electron microscope includes irradiating a sample with an electron beam having a first landing energy to obtain a first image at a first depth of the sample and accelerating the electron beam to have a second landing energy higher than the first landing energy to obtain a second image at a second depth of the sample.