公开(公告)号：US20210305477A1

公开(公告)日：2021-09-30

申请号：US17343182

申请日：2021-06-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin HONG ,  Gyuhwa Kim ,  Jeonggen Yoon ,  Tackmo Lee ,  Gyun Heo ,  Youngjun Moon ,  Kyungwoon Jang

IPC: H01L33/62 ,  H01L27/12 ,  H01L25/16

Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.

公开(公告)号：US11107841B2

公开(公告)日：2021-08-31

申请号：US16503035

申请日：2019-07-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungwoon Jang ,  Wonsoon Park ,  Dongmyung Son ,  Sangmin Shin ,  Changjoon Lee ,  Youngki Jung ,  Seongphil Cho ,  Gyun Heo ,  Soonmin Hong

IPC: H01L27/12 ,  H01L25/16

Abstract: A display panel is provided. The display panel according to an embodiment includes a thin film transistor glass substrate, a plurality of micro light emitting diodes (LEDs) arranged on one surface of the thin film transistor glass substrate, and a plurality of side wirings formed at an edge of the thin film transistor glass substrate to electrically connect the one surface of the thin film transistor glass substrate to an opposite surface to the one surface.

公开(公告)号：US20210005796A1

公开(公告)日：2021-01-07

申请号：US16914863

申请日：2020-06-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sungyong Min ,  Byunghoon Lee ,  Changjoon Lee ,  Kyungwoon Jang ,  Changkyu Chung

IPC: H01L33/56 ,  H01L33/00 ,  H01L27/15 ,  H01L33/62

Abstract: A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.

公开(公告)号：US11646400B2

公开(公告)日：2023-05-09

申请号：US17343182

申请日：2021-06-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soonmin Hong ,  Gyuhwa Kim ,  Jeonggen Yoon ,  Tackmo Lee ,  Gyun Heo ,  Youngjun Moon ,  Kyungwoon Jang

IPC: H01L33/62 ,  H01L27/12 ,  H01L25/16

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L27/1262 ,  H01L2933/0066

Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.

公开(公告)号：US20210005588A1

公开(公告)日：2021-01-07

申请号：US16901561

申请日：2020-06-15

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changkyu Chung ,  Kyungwoon Jang ,  Changjoon Lee

IPC: H01L25/16 ,  H01L21/683 ,  H01L33/62 ,  H01L25/075

Abstract: A method of manufacturing a micro light emitting diode (LED) display module includes stacking a connecting layer onto a transfer substrate on which a micro LED is disposed; positioning the transfer substrate above a display substrate, in which a plurality of thin-film transistors are formed, so that the micro LED faces the display substrate; transferring, to the display substrate, the micro LED and a connecting member that is in contact with the micro LED and is separated from the connecting layer by using a laser transfer method; and heating the micro LED and compressing the micro LED against the display substrate to bond the micro LED to the display substrate by the connecting member.

公开(公告)号：US11888101B2

公开(公告)日：2024-01-30

申请号：US17259681

申请日：2019-07-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngki Jung ,  Jinho Kim ,  Dongmyung Son ,  Sangmin Shin ,  Changjoon Lee ,  Kyungwoon Jang ,  Seongphil Cho ,  Gyun Heo ,  Soonmin Hong

IPC: H01L33/62

CPC classification number: H01L33/62

Abstract: A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.

公开(公告)号：US11362249B2

公开(公告)日：2022-06-14

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu Chung ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/58 ,  H01L33/48 ,  H01L33/00 ,  G09G3/32

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

公开(公告)号：US20210111324A1

公开(公告)日：2021-04-15

申请号：US16991133

申请日：2020-08-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Changjoon Lee ,  Kwangrae Jo ,  Sungyong Min ,  Wonsoon Park ,  Kyungwoon Jang ,  Daesuck Hwang

IPC: H01L33/62 ,  G09G3/32 ,  H01L27/15 ,  H01L33/58 ,  H01L33/00 ,  H01L33/48

Abstract: A method of manufacturing a display module includes forming a driving circuit layer on a substrate, the driving circuit layer including a plurality of driving circuits and a plurality of electrode pads electronically connected with the plurality of driving circuits; forming an adhesive layer on the driving circuit layer; transferring each of a plurality of light emitting diodes (LEDs) onto a respective area of the adhesive layer corresponding to a respective one of the plurality of electrode pads; and forming a black matrix layer on the adhesive layer, between the plurality of LEDs.

公开(公告)号：US20240274754A1

公开(公告)日：2024-08-15

申请号：US18621969

申请日：2024-03-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungyong MIN ,  Kyungwoon Jang ,  Jinyoung Kim ,  Changkyu Chung

IPC: H01L33/38 ,  H01L25/16 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L25/167 ,  H01L33/42 ,  H01L2933/0016

Abstract: A display module is provided and includes a driving substrate; first electrodes on the driving substrate, and light-emitting diodes (LEDs) including: semi-conductor layers; second electrodes respectively corresponding to the first electrodes; protrusions on each of the second electrodes; and metal layers on the protrusions, each of the metal layers connected to one of the second electrodes. The display module further includes a non-conductive film layer between the driving substrate and the LEDs. The first electrodes and the second electrodes are connected by the metal layers.

公开(公告)号：US20230290919A1

公开(公告)日：2023-09-14

申请号：US18139691

申请日：2023-04-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Changkyu CHUNG ,  Sungyong Min ,  Kyungwoon Jang ,  Kwangrae Jo

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/20

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L33/20 ,  H01L2933/0066

Abstract: A display module includes a substrate, a plurality of substrate electrode pads provided on the substrate, and a plurality of micro light-emitting diodes (LEDs) connected to the plurality of substrate electrode pads, where each of the plurality of substrate electrode pads includes a first region in which a plurality of contact protrusions are formed, and a second region configured to be connected with a repair micro LED.