公开(公告)号：US20240053391A1

公开(公告)日：2024-02-15

申请号：US18183446

申请日：2023-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Minho Kang ,  Hyungsun Ryu ,  Cheolmin Park ,  Jaemoo Choi

IPC: G01R27/08 ,  G01R35/00 ,  G01R31/28

CPC classification number: G01R27/08 ,  G01R35/005 ,  G01R31/2851

Abstract: An apparatus for testing an image sensor includes a load resistor, a first switch configured to be electrically connected to a first signal line of a device under test and a first end of the load resistor, a second switch configured to be electrically connected to a second signal line of the device under test and a second end of the load resistor, a first parametric measuring unit electrically connected to the first switch, and a second parametric measuring unit electrically connected to the second switch. At least one of the first parametric measuring unit and the second parametric unit is configured to correct an error of the load resistor during a testing operation of an output voltage of the device under test.

公开(公告)号：US20220238146A1

公开(公告)日：2022-07-28

申请号：US17483010

申请日：2021-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungsuk Woo ,  Changkyu Seol ,  Cheolmin Park ,  Sucheol Lee ,  Chanik Park

IPC: G11C7/22 ,  G11C7/16 ,  H01L25/065

Abstract: A high bandwidth memory system includes a motherboard; and a semiconductor package coupled to the motherboard. The semiconductor package includes a package substrate mounted on the motherboard and including signal lines providing a plurality of channels; a first semiconductor device mounted on the package substrate and including a first physical layer (PHY) circuit; and a second semiconductor device mounted on the package substrate and including a second PHY circuit. The first semiconductor device and the second semiconductor device exchange a data signal with each other through the plurality of channels, the data signal is a multilevel signal having M levels, where M is a natural number greater than 2, and the first PHY circuit compensates for distortion of the channels and performs digital signal processing to compensate for a mismatch between the channels.

公开(公告)号：US20220060358A1

公开(公告)日：2022-02-24

申请号：US17368459

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Minho Kang ,  Cheolmin Park

IPC: H04L25/49 ,  G09G3/20 ,  H04N5/06

Abstract: A receiver, which is compatible with a mobile industry processor interface (MIPI) C-PHY physical layer, includes a plurality of variable-gain amplifiers responsive to respective multi-level signals (e.g., 3-level signals), and a plurality of filters having variable cutoff frequencies. The plurality of filters are responsive to respective signals generated by the plurality of amplifiers. An array of comparators is provided, which is responsive to signals generated by the plurality of filters. A jitter detection circuit is provided, which is configured to set respective gains of the plurality of variable-gain amplifiers and respective cutoff frequencies of the plurality of filters (e.g., high-pass filters), in response to signals generated by the array of comparators.

公开(公告)号：US11631444B2

公开(公告)日：2023-04-18

申请号：US17483010

申请日：2021-09-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungsuk Woo ,  Changkyu Seol ,  Cheolmin Park ,  Sucheol Lee ,  Chanik Park

IPC: G11C7/22 ,  H01L25/065 ,  G11C7/16 ,  H01L27/108

Abstract: A high bandwidth memory system includes a motherboard; and a semiconductor package coupled to the motherboard. The semiconductor package includes a package substrate mounted on the motherboard and including signal lines providing a plurality of channels; a first semiconductor device mounted on the package substrate and including a first physical layer (PHY) circuit; and a second semiconductor device mounted on the package substrate and including a second PHY circuit. The first semiconductor device and the second semiconductor device exchange a data signal with each other through the plurality of channels, the data signal is a multilevel signal having M levels, where M is a natural number greater than 2, and the first PHY circuit compensates for distortion of the channels and performs digital signal processing to compensate for a mismatch between the channels.

公开(公告)号：US20240304637A1

公开(公告)日：2024-09-12

申请号：US18594964

申请日：2024-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sung-Yool CHOI ,  Seung Hun Han ,  Cheolmin Park ,  Hyeok Jun Jin

IPC: H01L27/146

CPC classification number: H01L27/1461 ,  H01L27/1463 ,  H01L27/14636 ,  H01L27/14696

Abstract: An image sensor includes: a semiconductor substrate including a top surface and a bottom surface; a two-dimensional (2D) material layer on the top surface of the semiconductor substrate and including molybdenum disulfide (MoS2); and a top absorber on a top surface of the 2D material layer and including graphene, wherein the semiconductor substrate includes silicon doped with a p-type impurity, the 2D material layer has n-type conductivity, and the semiconductor substrate and the 2D material layer are configured to form a p-n diode.

公开(公告)号：US11843487B2

公开(公告)日：2023-12-12

申请号：US17368459

申请日：2021-07-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Minho Kang ,  Cheolmin Park

IPC: H04L25/49 ,  H04N5/06 ,  G09G3/20

CPC classification number: H04L25/4917 ,  G09G3/2096 ,  H04N5/06

Abstract: A receiver, which is compatible with a mobile industry processor interface (MIPI) C-PHY physical layer, includes a plurality of variable-gain amplifiers responsive to respective multi-level signals (e.g., 3-level signals), and a plurality of filters having variable cutoff frequencies. The plurality of filters are responsive to respective signals generated by the plurality of amplifiers. An array of comparators is provided, which is responsive to signals generated by the plurality of filters. A jitter detection circuit is provided, which is configured to set respective gains of the plurality of variable-gain amplifiers and respective cutoff frequencies of the plurality of filters (e.g., high-pass filters), in response to signals generated by the array of comparators.

公开(公告)号：US20230362350A1

公开(公告)日：2023-11-09

申请号：US18071021

申请日：2022-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongkwan Lee ,  Minho Kang ,  Cheolmin Park ,  Hyungsun Ryu ,  Jaemoo Choi

IPC: H04N17/00 ,  H04N25/76

CPC classification number: H04N17/002 ,  H04N25/76

Abstract: An image sensor test system includes a test device configured to transmit an input signal and a control signal to at least one image sensor through a probe card, and an interface board configured to map the probe card and the test device to each other. The interface board includes a signal receiver configured to receive an image signal from the at least one image sensor, amplify the image signal, and output the image signal to the test device, and the signal receiver includes an operational amplifier configured to amplify the image signal, and a low-frequency attenuator connected to an output terminal of the operational amplifier.