公开(公告)号：US20230362350A1

公开(公告)日：2023-11-09

申请号：US18071021

申请日：2022-11-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seongkwan Lee ,  Minho Kang ,  Cheolmin Park ,  Hyungsun Ryu ,  Jaemoo Choi

IPC: H04N17/00 ,  H04N25/76

CPC classification number: H04N17/002 ,  H04N25/76

Abstract: An image sensor test system includes a test device configured to transmit an input signal and a control signal to at least one image sensor through a probe card, and an interface board configured to map the probe card and the test device to each other. The interface board includes a signal receiver configured to receive an image signal from the at least one image sensor, amplify the image signal, and output the image signal to the test device, and the signal receiver includes an operational amplifier configured to amplify the image signal, and a low-frequency attenuator connected to an output terminal of the operational amplifier.

公开(公告)号：US12105146B2

公开(公告)日：2024-10-01

申请号：US18299265

申请日：2023-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Hyungsun Ryu ,  Kangmin Lee ,  Jaemoo Choi

IPC: G01R31/319 ,  G01R31/28

CPC classification number: G01R31/31926 ,  G01R31/2844

Abstract: A tester, which is adapted to test a device under test (DUT), includes a first plurality of signal analysis circuits configured to analyze signals generated by a plurality of DUTs, and a second plurality of signal processing units configured to process the signals analyzed by the first plurality of signal analysis circuits. A switch array is provided, which is electrically coupled between the first plurality of signal analysis circuits and the second plurality of signal processing units. The switch array is configured to electrically connect selected ones of the first plurality of signal analysis circuits with corresponding ones of the second plurality of signal processing units. The number of signal processing units within the second plurality may be less than a maximum number of DUTs that can be connected to the first plurality of signal analysis circuits when the tester is testing a plurality of the DUTs.

公开(公告)号：US20240085478A1

公开(公告)日：2024-03-14

申请号：US18299265

申请日：2023-04-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Hyungsun Ryu ,  Kangmin Lee ,  Jaemoo Choi

IPC: G01R31/319 ,  G01R31/28

CPC classification number: G01R31/31926 ,  G01R31/2844

Abstract: A tester, which is adapted to test a device under test (DUT), includes a first plurality of signal analysis circuits configured to analyze signals generated by a plurality of DUTs, and a second plurality of signal processing units configured to process the signals analyzed by the first plurality of signal analysis circuits. A switch array is provided, which is electrically coupled between the first plurality of signal analysis circuits and the second plurality of signal processing units. The switch array is configured to electrically connect selected ones of the first plurality of signal analysis circuits with corresponding ones of the second plurality of signal processing units. The number of signal processing units within the second plurality may be less than a maximum number of DUTs that can be connected to the first plurality of signal analysis circuits when the tester is testing a plurality of the DUTs.

公开(公告)号：US20240053391A1

公开(公告)日：2024-02-15

申请号：US18183446

申请日：2023-03-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Minho Kang ,  Hyungsun Ryu ,  Cheolmin Park ,  Jaemoo Choi

IPC: G01R27/08 ,  G01R35/00 ,  G01R31/28

CPC classification number: G01R27/08 ,  G01R35/005 ,  G01R31/2851

Abstract: An apparatus for testing an image sensor includes a load resistor, a first switch configured to be electrically connected to a first signal line of a device under test and a first end of the load resistor, a second switch configured to be electrically connected to a second signal line of the device under test and a second end of the load resistor, a first parametric measuring unit electrically connected to the first switch, and a second parametric measuring unit electrically connected to the second switch. At least one of the first parametric measuring unit and the second parametric unit is configured to correct an error of the load resistor during a testing operation of an output voltage of the device under test.

公开(公告)号：US20250138088A1

公开(公告)日：2025-05-01

申请号：US18671017

申请日：2024-05-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongkwan Lee ,  Minho Kang ,  Jongpill Park ,  Cheolmin Park ,  Jaemoo Choi

IPC: G01R31/317 ,  G01R1/073

Abstract: A probe card includes a plurality of power lines that are electrically connected to the plurality of DUTs, a plurality of ground lines that are electrically connected to the plurality of DUTs and to each other, and a plurality of power compensation circuits that are electrically connected to respective ones of the plurality of power lines and respective ones of the plurality of ground lines, where the plurality of power compensation circuits are configured to generate and provide a plurality of compensated power supply voltages to the respective ones of the plurality of power lines, and where the plurality of compensated power supply voltages are configured to inhibit a variation of a ground voltage of the respective ones of the plurality of ground lines.

公开(公告)号：US12074051B2

公开(公告)日：2024-08-27

申请号：US17713541

申请日：2022-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taehyoung Lee ,  Hohyun Lee ,  Jongmin Song ,  Young Yoon ,  Jaemoo Choi

IPC: H01L21/683 ,  B25J9/16 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/6833 ,  B25J9/1679 ,  B25J9/1697 ,  H01L21/67259 ,  H01L21/67742

Abstract: A teaching apparatus includes a chamber; an electrostatic chuck in the chamber, the electrostatic chuck including a sidewall surrounding a loading area; an aligner configured to be loaded onto the loading area of the electrostatic chuck; a vision sensor configured to obtain measurement data by measuring separation distances of separation regions between the aligner and the sidewall of the electrostatic chuck and to transmit the measurement data; a transfer robot configured to load the aligner onto a reference position of the loading area and to position the vision sensor above the electrostatic chuck; and controller configured to reset the reference position and to equalize the separation distances based on the measurement data transmitted from the vision sensor.