公开(公告)号：US09190401B2

公开(公告)日：2015-11-17

申请号：US14286454

申请日：2014-05-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choong-Bin Yim ,  Seung-Kon Mok ,  Jin-Woo Park ,  Dae-Young Choi ,  Mi-Yeon Kim

IPC: H01L21/44 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L25/50 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01029 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Semiconductor package includes a first semiconductor package including a first printed circuit board, and a first semiconductor device mounted on the first printed circuit board, and a second semiconductor package stacked on the first semiconductor package, and including a second printed circuit board and a second semiconductor device mounted on the second printed circuit board. The semiconductor package includes at least one first through electrode electrically connecting the second semiconductor package to the first printed circuit board through the first semiconductor device.

Abstract translation: 半导体封装包括第一半导体封装，包括第一印刷电路板和安装在第一印刷电路板上的第一半导体器件，以及堆叠在第一半导体封装上的第二半导体封装，并且包括第二印刷电路板和第二半导体 装置安装在第二印刷电路板上。 半导体封装包括至少一个第一通孔，其通过第一半导体器件将第二半导体封装电连接到第一印刷电路板。