公开(公告)号：US09972636B2

公开(公告)日：2018-05-15

申请号：US15626395

申请日：2017-06-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Won Kim ,  Seung Hyun Lim ,  Chang Seok Kang ,  Young Woo Park ,  Dae Hoon Bae ,  Dong Seog Eun ,  Woo Sung Lee ,  Jae Duk Lee ,  Jae Woo Lim ,  Hanmei Choi

IPC: H01L27/115 ,  H01L27/11565 ,  H01L27/11519 ,  H01L27/11524 ,  H01L27/11556 ,  H01L27/11529 ,  H01L27/1157 ,  H01L27/11582 ,  H01L27/11573 ,  H01L29/04

CPC classification number: H01L27/11565 ,  H01L27/11519 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/11529 ,  H01L27/11556 ,  H01L27/11568 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11582 ,  H01L28/00 ,  H01L29/04

Abstract: A memory device includes a plurality of channel regions that each extend in a direction perpendicular to an upper surface of a substrate, a plurality of gate electrode layers and a plurality of insulating layers stacked on the substrate adjacent the channel regions, each of the gate electrodes extending different lengths, and a plurality of dummy channel regions adjacent first ends of the plurality of gate electrode layers, wherein the substrate includes a substrate insulating layer formed below the plurality of dummy channel regions.

公开(公告)号：US10153292B2

公开(公告)日：2018-12-11

申请号：US15907667

申请日：2018-02-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Won Kim ,  Seung Hyun Lim ,  Chang Seok Kang ,  Young Woo Park ,  Dae Hoon Bae ,  Dong Seog Eun ,  Woo Sung Lee ,  Jae Duk Lee ,  Jae Woo Lim ,  Hanmei Choi

IPC: H01L27/11556 ,  H01L27/11565 ,  H01L27/11582 ,  H01L27/11521 ,  H01L27/11568 ,  H01L27/11519 ,  H01L27/11524 ,  H01L27/11529 ,  H01L27/1157 ,  H01L27/11573 ,  H01L29/04 ,  H01L49/02

Abstract: A memory device includes a plurality of channel regions that each extend in a direction perpendicular to an upper surface of a substrate, a plurality of gate electrode layers and a plurality of insulating layers stacked on the substrate adjacent the channel regions, each of the gate electrodes extending different lengths, and a plurality of dummy channel regions adjacent first ends of the plurality of gate electrode layers, wherein the substrate includes a substrate insulating layer formed below the plurality of dummy channel regions.

公开(公告)号：US09716104B2

公开(公告)日：2017-07-25

申请号：US14987835

申请日：2016-01-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong Won Kim ,  Seung Hyun Lim ,  Chang Seok Kang ,  Young Woo Park ,  Dae Hoon Bae ,  Dong Seog Eun ,  Woo Sung Lee ,  Jae Duk Lee ,  Jae Woo Lim ,  HanMei Choi

IPC: H01L27/115 ,  H01L27/11582 ,  H01L27/11556 ,  H01L27/11521 ,  H01L27/11568

CPC classification number: H01L27/11565 ,  H01L27/11519 ,  H01L27/11521 ,  H01L27/11524 ,  H01L27/11529 ,  H01L27/11556 ,  H01L27/11568 ,  H01L27/1157 ,  H01L27/11573 ,  H01L27/11582 ,  H01L28/00 ,  H01L29/04

Abstract: A memory device includes a plurality of channel regions that each extend in a direction perpendicular to an upper surface of a substrate, a plurality of gate electrode layers and a plurality of insulating layers stacked on the substrate adjacent the channel regions, each of the gate electrodes extending different lengths, and a plurality of dummy channel regions adjacent first ends of the plurality of gate electrode layers, wherein the substrate includes a substrate insulating layer formed below the plurality of dummy channel regions.