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公开(公告)号:US12125687B2
公开(公告)日:2024-10-22
申请号:US17709613
申请日:2022-03-31
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Youngdo Kim , Sungyong Lim , Daewon Kang , Sungyeol Kim , Sangki Nam , Myunggeun Song , Byungkook Cho , Hyeoncheol Jin , Jonghun Pi
IPC: H01J37/32 , H01L21/683
CPC classification number: H01J37/32715 , H01J37/32183 , H01J37/32935 , H01J2237/24564 , H01J2237/3341 , H01L21/6833
Abstract: A semiconductor processing system includes: a semiconductor processing chamber including an electrostatic chuck disposed in a chamber housing, and a first power supplier for supplying first radio frequency (RF) power to an internal electrode disposed in the electrostatic chuck; a voltage measuring device for measuring a voltage corresponding to the first RF power to output a digital signal; and a control device for outputting an interlock control signal to the semiconductor processing chamber, when it is determined that the voltage increases to be within a predetermined reference range based on the digital signal. The electrostatic chuck is configured to enable a wafer to be seated on a surface of the electrostatic chuck.
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公开(公告)号:US20250046587A1
公开(公告)日:2025-02-06
申请号:US18636099
申请日:2024-04-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Taehyun Kim , Chansoo Kang , Minju Kim , Daewon Kang , Dougyong Sung , Jungmo Yang , Sejin Oh
Abstract: The present disclosure relates to plasma diagnostic devices. An example plasma diagnostic device includes a pinhole through which a first optical signal passes, an optical device in which the first optical signal is incident and the first optical signal is converted into a second optical signal, a filter configured to filter the second optical signal and to output a third optical signal of a specific wavelength band, and a sensor configured to monitor a distribution of the first optical signal, the second optical signal, and the third optical signal.
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公开(公告)号:US20250085445A1
公开(公告)日:2025-03-13
申请号:US18633031
申请日:2024-04-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Chansoo Kang , Daewon Kang , Minju Kim , Tae-Hyun Kim , Sang Ki Nam , Dougyong Sung , Jungmo Yang , Sejin Oh , Keonhee Lim , Junho Im
Abstract: A substrate processing apparatus includes a process chamber providing a process space, a stage located in the process chamber and configured to support a substrate, a window coupled to a side of the process chamber, and a scintillator layer coupled to one side surface of the window. The scintillator layer covers a portion of the one side surface of the window which is less than the full window surface. A second surface corresponding to another portion of the one side surface of the window is exposed. Light emitted by a plasma in the process space passes through the window and is collected by an optical system and analyzed. Ultraviolet light passing through the scintillator is converted to longer wavelength, generally visible, light. Comparing the light passing through the bare window with the light passing through the scintillator layer enables analysis of the plasma.
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公开(公告)号:US11940620B2
公开(公告)日:2024-03-26
申请号:US17508224
申请日:2021-10-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Changsoon Lim , Youngdo Kim , Daewon Kang , Chansoo Kang , Hoonseop Kim , Sangki Nam , Youngduk Suh , Donghyub Lee , Jonghun Pi
CPC classification number: G02B27/0006 , B08B7/0035 , B08B7/04 , G01N33/0027 , G03F7/70033 , G03F7/7085 , G03F7/70925 , G06T7/001
Abstract: A method of cleaning a collector of an extreme ultraviolet light source system includes introducing the collector separated from the extreme ultraviolet light source system into a chamber; capturing an optical image of a reflective surface of the collector; measuring a contamination level of the reflective surface by comparing the optical image with a prestored standard image; performing a first cleaning operation if the contamination level exceeds a preset first reference value, the first cleaning operation including cleaning the reflective surface by spraying dry ice particles onto the reflective surface; and performing a second cleaning operation if the contamination level is less than or equal to the preset first reference value. The second cleaning operation includes cleaning the reflective surface by radiating atmospheric plasma onto the reflective surface and measuring a microcontamination level and a damage level of the reflective surface.
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公开(公告)号:US20230109672A1
公开(公告)日:2023-04-13
申请号:US17850257
申请日:2022-06-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Changsoon Lim , Youngdo Kim , Daewon Kang , Chansoo Kang , Kyunghyun Kim , Sangki Nam , Kyunjin Lee , Sungho Jang , Jonghun Pi
IPC: H01J37/32
Abstract: An apparatus includes first and second VI sensors, an optical sensor, and an arcing detector. The first VI sensor is disposed in a power filter or on a power supply line connected to a heater disposed in a lower electrode of a process chamber in which a plasma process is performed. The first VI sensor senses a harmonic generated from a first power supply supplying power to the lower electrode and outputs a first signal. The optical sensor senses an intensity of light generated from the process chamber and outputs a second signal. The second VI sensor is disposed on a power supply line connected to an upper electrode and senses a harmonic generated from a second power supply supplying power to the upper electrode and outputs a third signal. The arcing detector determines whether arcing occurs based on one or more of the first, second, and third signals.
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