APPARATUS FOR MONITORING PROCESS CHAMBER
    1.
    发明申请

    公开(公告)号:US20190164731A1

    公开(公告)日:2019-05-30

    申请号:US16262024

    申请日:2019-01-30

    Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.

    PLASMA ETCHING APPARATUS AND METHOD FOR OPERATING THE SAME

    公开(公告)号:US20230120474A1

    公开(公告)日:2023-04-20

    申请号:US17750653

    申请日:2022-05-23

    Abstract: A plasma etching apparatus may include a first source electrode, a first bias electrode, and a second bias electrode configured to generate a plasma by supplying energy to a process gas injected into a chamber; and a controller. The controller may be configured to supply a first high-frequency RF power, a first low-frequency RF power, and a second low-frequency RF power to the chamber during a first period from a first time to a second time; ramp down and turn off the first high-frequency RF power to the chamber during a second period from the second time to a third time; and ramp down and turn off the first low-frequency RF power to the chamber during a third period from the second time to a fourth time different from the third time. The third period may be smaller than ½ of the first period and greater than the second period.

    SEMICONDUCTOR MANUFACTURING DEVICE AND METHOD OF OPERATING THE SAME

    公开(公告)号:US20190006150A1

    公开(公告)日:2019-01-03

    申请号:US15864529

    申请日:2018-01-08

    Abstract: A semiconductor manufacturing device includes a plasma chamber, a source power supply, and first and second bias power supplies. The source power supply applies a first source voltage to the plasma chamber at a first time and a second source voltage to the plasma chamber at a second time. The first bias power supply applies a first turn-on voltage to the plasma chamber at the first time and a first turn-off voltage to the plasma chamber at the second time. The second bias power supply applies a second turn-off voltage to the plasma chamber at the first time and a second turn-on voltage to the plasma chamber at the second time. The plasma chamber forms plasmas of different conditions from a gas mixture in the plasma chamber based on the source, turn-on, and turn-off voltages.

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