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公开(公告)号:US20190164731A1
公开(公告)日:2019-05-30
申请号:US16262024
申请日:2019-01-30
Applicant: Samsung Electronics Co., Ltd.
Inventor: Protopopov VLADIMIR , Ki Ho HWANG , Doug Yong SUNG , Se Jin OH , Kul INN , Sung Ho JANG , Yun Kwang JEON
Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.
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公开(公告)号:US20230120474A1
公开(公告)日:2023-04-20
申请号:US17750653
申请日:2022-05-23
Applicant: Samsung Electronics Co., Ltd.
Inventor: Nam Kyun KIM , Seung Bo SHIM , Doug Yong SUNG , Seung Han BAEK , Ju Ho LEE
IPC: H01J37/32
Abstract: A plasma etching apparatus may include a first source electrode, a first bias electrode, and a second bias electrode configured to generate a plasma by supplying energy to a process gas injected into a chamber; and a controller. The controller may be configured to supply a first high-frequency RF power, a first low-frequency RF power, and a second low-frequency RF power to the chamber during a first period from a first time to a second time; ramp down and turn off the first high-frequency RF power to the chamber during a second period from the second time to a third time; and ramp down and turn off the first low-frequency RF power to the chamber during a third period from the second time to a fourth time different from the third time. The third period may be smaller than ½ of the first period and greater than the second period.
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公开(公告)号:US20190006150A1
公开(公告)日:2019-01-03
申请号:US15864529
申请日:2018-01-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seung Bo SHIM , Myung Sun CHOI , Nam Jun KANG , Doug Yong SUNG , Sang Min JEONG , Peter Byung H HAN
IPC: H01J37/32 , H01L21/67 , H01L21/3065
Abstract: A semiconductor manufacturing device includes a plasma chamber, a source power supply, and first and second bias power supplies. The source power supply applies a first source voltage to the plasma chamber at a first time and a second source voltage to the plasma chamber at a second time. The first bias power supply applies a first turn-on voltage to the plasma chamber at the first time and a first turn-off voltage to the plasma chamber at the second time. The second bias power supply applies a second turn-off voltage to the plasma chamber at the first time and a second turn-on voltage to the plasma chamber at the second time. The plasma chamber forms plasmas of different conditions from a gas mixture in the plasma chamber based on the source, turn-on, and turn-off voltages.
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公开(公告)号:US20170213710A1
公开(公告)日:2017-07-27
申请号:US15260910
申请日:2016-09-09
Applicant: Samsung Electronics Co., Ltd.
Inventor: Protopopov VLADIMIR , Ki Ho HWANG , Doug Yong SUNG , Se Jin OH , Kul INN , Sung Ho JANG , Yun Kwang JEON
CPC classification number: H01J37/32935 , H01J37/32715 , H01J37/32972 , H04N5/2252
Abstract: An apparatus for monitoring an interior of a process chamber including a process chamber including a chamber body and a view port defined in the chamber body, a cover section including a pinhole in one end, the cover section disposed to correspond to an end portion of the view port, the cover section having a first length in a direction toward a center point of the process chamber, and a sensing unit inserted into the view port to monitor the interior of the process chamber through the pinhole, a region in the process chamber to be sensed by the sensing unit determined based on the first length may be provided.
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