公开(公告)号：US20240314930A1

公开(公告)日：2024-09-19

申请号：US18490678

申请日：2023-10-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Alan GARA ,  Young-Jun HONG ,  Eric Richard BORCH ,  Casey THIELEN

IPC: H05K1/14 ,  H04L49/00 ,  H05K7/14

CPC classification number: H05K1/14 ,  H04L49/70 ,  H05K7/1445 ,  H05K2201/044

Abstract: A computing system with connecting boards. In some embodiments, the computing system includes a first compute board, a second compute board, and a first connecting board connected to the first compute board and to the second compute board. The first compute board and the second compute board may include a plurality of compute elements. The first compute board, the second compute board, and the first connecting board may include a first plurality of switches including a first switch connected to a first compute element of the plurality of compute elements and a second switch connected to a second compute element of the plurality of compute elements. The first connecting board may include a first conductor, the first conductor being a conductor of a first data connection between the first switch and the second switch.

公开(公告)号：US20240314089A1

公开(公告)日：2024-09-19

申请号：US18474178

申请日：2023-09-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eric Richard BORCH

IPC: H04L49/111 ,  H04L45/302 ,  H04L47/2441

CPC classification number: H04L49/111 ,  H04L45/306 ,  H04L47/2441

Abstract: A multi-node computing system. In some embodiments, the system includes: a first board and a second board. The first board may include a first switch, a second switch, a memory, and a compute element. The second board may include a first switch, a second switch, a memory, and a compute element. The first switch of the first board may be connected to the first switch of the second board and to the compute element of the first board. The first switch of the second board may be connected to the first switch of the first board and to the compute element of the second board. The second switch of the first board may be connected to the second switch of the second board and to the compute element of the first board.

公开(公告)号：US20240311323A1

公开(公告)日：2024-09-19

申请号：US18232819

申请日：2023-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Eric Richard BORCH ,  Casey Glenn THIELEN ,  Alan GARA ,  Young Jun HONG

IPC: G06F13/40 ,  G06F11/34

CPC classification number: G06F13/4022 ,  G06F11/3495

Abstract: Embodiments disclose methods, systems and devices including a plurality of connectors, a plurality of switches, and a plurality of compute elements. Each of the plurality of compute elements may be connected to each of the plurality of switches. In some embodiments, a first subset of the plurality of switches may be directly connected to a first subset of the plurality of the connectors in a fanout mechanism, and a second subset of the plurality of switches may be directly connected to a second subset of the plurality of the connectors in a similar fanout mechanism.