公开(公告)号：US09269620B2

公开(公告)日：2016-02-23

申请号：US13710586

申请日：2012-12-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung Tae Ok ,  Hak Hwan Kim ,  Ho Sun Paek ,  Kwon Joong Kim

IPC: H01L23/498 ,  H01L21/768 ,  H01L23/48 ,  H01L23/485 ,  H01L23/00

CPC classification number: H01L21/76892 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05023 ,  H01L2224/05171 ,  H01L2224/05568 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/1132 ,  H01L2224/11849 ,  H01L2224/13006 ,  H01L2224/13007 ,  H01L2224/13012 ,  H01L2224/13016 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/05552

Abstract: A bump manufacturing method may be provided. The bump manufacturing method may include forming a bump on an electrode pad included in a semiconductor device, and controlling a shape of the bump by reflowing the bump formed on the semiconductor device under an oxygen atmosphere.

Abstract translation: 可以提供凸块制造方法。 凸块制造方法可以包括在包括在半导体器件中的电极焊盘上形成凸块，并且通过在氧气氛下回流形成在半导体器件上的凸块来控制凸块的形状。

公开(公告)号：US10964852B2

公开(公告)日：2021-03-30

申请号：US16223990

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung You ,  Ho Sun Paek ,  Ho Young Song ,  Jun Bum Lee

IPC: H01L33/00 ,  H01L33/50 ,  H01L33/40 ,  H01L33/26 ,  H01L33/10 ,  H05B45/00

Abstract: A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

公开(公告)号：US10685939B2

公开(公告)日：2020-06-16

申请号：US16243363

申请日：2019-01-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Sung You ,  Yun Tae Hwang ,  Ho Young Song ,  Won Hoe Koo ,  Jae Chul Kim ,  Ho Sun Paek

IPC: H01L25/075 ,  F21V23/00 ,  H01L33/54 ,  F21V29/70 ,  H01L33/60 ,  H01L33/50 ,  F21Y115/10 ,  H01L33/62 ,  H05B45/20

Abstract: A white LED module includes a circuit board, at least one first LED light source on the circuit board and emitting a first white light having a first color temperature, at least one second LED light source on the circuit board and emitting a second white light having a second color temperature, higher than the first color temperature, a wiring structure in the circuit board to selectively drive the at least one first LED light source and the at least one second LED light source, and a transparent encapsulant on the circuit board, to cover the at least one first LED light source and the at least one second LED light source. The transparent encapsulant includes a transparent resin and a light-scattering powder in the transparent resin.

公开(公告)号：US20190371768A1

公开(公告)日：2019-12-05

申请号：US16243363

申请日：2019-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung YOU ,  Yun Tae Hwang ,  Ho Young Song ,  Won Hoe Koo ,  Jae Chul Kim ,  Ho Sun Paek

IPC: H01L25/075 ,  F21V23/00

Abstract: A white LED module includes a circuit board, at least one first LED light source on the circuit board and emitting a first white light having a first color temperature, at least one second LED light source on the circuit board and emitting a second white light having a second color temperature, higher than the first color temperature, a wiring structure in the circuit board to selectively drive the at least one first LED light source and the at least one second LED light source, and a transparent encapsulant on the circuit board, to cover the at least one first LED light source and the at least one second LED light source. The transparent encapsulant includes a transparent resin and a light-scattering powder in the transparent resin.

公开(公告)号：US20190293242A1

公开(公告)日：2019-09-26

申请号：US16180271

申请日：2018-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mi Hyae Park ,  Ho Sun Paek ,  Jae Sung You ,  Chul Soo Yoon ,  Young Mook Lim

IPC: F21K9/232 ,  F21V23/06 ,  H01L25/075 ,  H01L23/538 ,  H01L33/50 ,  H01L33/56 ,  H01L33/62

Abstract: An LED module includes a flexible substrate having a first surface on which a circuit pattern is disposed and a second surface opposing the first surface, and having a light transmittance of 80% or more; a plurality of LED chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength converter covering the plurality of LED chips, and surrounding the flexible substrate.