公开(公告)号：US20160204314A1

公开(公告)日：2016-07-14

申请号：US14973996

申请日：2015-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Tae HWANG ,  Il Woo PARK ,  Young Sim O ,  Daseul YU ,  Jae Sung YOU ,  Chang Bun YOON

IPC: H01L33/46 ,  H01L33/48 ,  H01L33/58 ,  H01L33/50 ,  H01L33/38

CPC classification number: H01L33/46 ,  H01L33/486 ,  H01L33/505 ,  H01L2224/16225 ,  H01L2933/0041

Abstract: A light emitting diode (LED) package includes: a package substrate having a first electrode structure and a second electrode structure; an LED chip disposed above a first surface of the package substrate and having a first electrode attached to the first electrode structure and a second electrode attached to the second electrode structure; a reflective layer disposed above the first surface of the package substrate to be separated from the LED chip, having a thickness less than a thickness of the LED chip, and configured to reflect light emitted from the LED chip to a given direction, wherein the wavelength converter has an upper surface substantially parallel to the first surface of the package substrate and a side surface inclined towards the upper surface of the wavelength converter.

Abstract translation: 发光二极管（LED）封装包括：具有第一电极结构和第二电极结构的封装基板; LED芯片，其设置在所述封装基板的第一表面上方，并且具有附接到所述第一电极结构的第一电极和附着到所述第二电极结构的第二电极; 反射层，设置在所述封装基板的与所述LED芯片分离的所述第一表面之上，所述反射层的厚度小于所述LED芯片的厚度，并且被配置为将从所述LED芯片发射的光反射到给定方向，其中所述波长 转换器具有基本上平行于封装衬底的第一表面的上表面和朝向波长转换器的上表面倾斜的侧表面。

公开(公告)号：US20190326480A1

公开(公告)日：2019-10-24

申请号：US16223990

申请日：2018-12-18

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung YOU ,  Ho Sun PAEK ,  Ho Young SONG ,  Jun Bum LEE

IPC: H01L33/50 ,  H01L33/40 ,  H05B33/08 ,  H01L33/10 ,  H01L33/26

Abstract: A light emitting diode (LED) module includes: a flexible substrate having a first surface on which a circuit pattern is disposed, and a second surface opposite the first surface; a plurality of light emitting diode (LED) chips mounted on the first surface of the flexible substrate, and electrically connected to the circuit pattern; an insulating reflective layer disposed on the first surface of the flexible substrate, and covering a portion of the circuit pattern; first and second connection terminals disposed at both ends of the flexible substrate, and connected to the circuit pattern; and a wavelength conversion layer covering the plurality of LED chips and surrounding the flexible substrate in a cross-sectional view.

公开(公告)号：US20140299906A1

公开(公告)日：2014-10-09

申请号：US14310664

申请日：2014-06-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hak Hwan KIM ,  Min Jung KIM ,  Kyung Mi MOON ,  Jong Sup SONG ,  Jae Sung YOU ,  Ill Heoung CHOI ,  Cheol Jun YOO

IPC: H01L33/62 ,  H01L33/50

CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L33/505 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92144 ,  H01L2224/97 ,  H01L2924/15153 ,  H01L2933/0041 ,  H01L2924/00014 ,  H01L2224/83

Abstract: A manufacturing method of a light emitting diode (LED) and a manufacturing method of an LED module are provided. The manufacturing method of the LED may include manufacturing a plurality of LED chips, manufacturing a phosphor pre-form including a plurality of mounting areas for mounting the plurality of LED chips, applying an adhesive inside the phosphor pre-form, mounting each of the plurality of LED chips in each of the plurality of mounting areas, and cutting the phosphor pre-form to which the plurality of LED chips are mounted, into units including individual LED chips.

Abstract translation: 提供了一种发光二极管（LED）的制造方法和LED模块的制造方法。 LED的制造方法可以包括制造多个LED芯片，制造包括多个用于安装多个LED芯片的多个安装区域的荧光体预成型件，在磷光体预成型件内部施加粘合剂，安装多个LED芯片 的多个安装区域中的每一个中的LED芯片，并且将安装有多个LED芯片的荧光体预成型件切割成包括各个LED芯片的单元。

公开(公告)号：US20190371768A1

公开(公告)日：2019-12-05

申请号：US16243363

申请日：2019-01-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jae Sung YOU ,  Yun Tae Hwang ,  Ho Young Song ,  Won Hoe Koo ,  Jae Chul Kim ,  Ho Sun Paek

IPC: H01L25/075 ,  F21V23/00

Abstract: A white LED module includes a circuit board, at least one first LED light source on the circuit board and emitting a first white light having a first color temperature, at least one second LED light source on the circuit board and emitting a second white light having a second color temperature, higher than the first color temperature, a wiring structure in the circuit board to selectively drive the at least one first LED light source and the at least one second LED light source, and a transparent encapsulant on the circuit board, to cover the at least one first LED light source and the at least one second LED light source. The transparent encapsulant includes a transparent resin and a light-scattering powder in the transparent resin.