公开(公告)号：US20240399538A1

公开(公告)日：2024-12-05

申请号：US18583285

申请日：2024-02-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seonmin YUN ,  Hyuntae LEE ,  Youngho JUNG ,  Keon-Woo KIM ,  Sung Yong PARK ,  Junyoung CHOI ,  Hoseop CHOI

IPC: B24B53/017

Abstract: A pad conditioner comprising: a disk holder that is rotatable; a frame on the disk holder; a lifting and lowering support member that is between the frame and the disk holder; a posture adjusting member that is between the lifting and lowering support member and the frame and has a thickness, wherein the posture adjusting member is capable of varying the thickness; a posture sensor that is configured to detect a height of the lifting and lowering support member; and a controller that is configured to vary the thickness of the posture adjusting member according to a signal received from the posture sensor.

公开(公告)号：US20190295843A1

公开(公告)日：2019-09-26

申请号：US16294453

申请日：2019-03-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Beomjin YOO ,  Minhyoung KIM ,  Wonhyuk JANG ,  Hoseop CHOI ,  Jeongmin BANG ,  KyuHee HAN

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/268

Abstract: Disclosed are a method for cleaning a substrate, an apparatus for cleaning a substrate, and a method for fabricating a semiconductor device using the same. The method may include cleaning a substrate in a wet process, providing a supercritical fluid onto the substrate to remove moisture from the substrate, and cleaning the substrate in a dry process to remove defect particles from a substrate, which are produced by the supercritical fluid.

公开(公告)号：US20250135600A1

公开(公告)日：2025-05-01

申请号：US18906603

申请日：2024-10-04

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngtaek KIM ,  Domin KIM ,  Sungyong PARK ,  Chansoo PARK ,  Kyoungwhan OH ,  Jaemin JUNG ,  Hoseop CHOI

IPC: B24B37/27 ,  B24B37/015

Abstract: A polishing head may include a substrate carrier detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier includes a flexible membrane, wherein the flexible membrane includes a main thin film having a first surface to be in contact with the substrate and a second surface opposite to the first surface and a plurality of vertical thin films extending from the main thin film in a vertical direction to define a plurality of pressurizing chambers that are divided along a radial direction about a central axis; a plurality of temperature elements disposed under the plurality of pressurizing chambers in the main thin film and configured to apply local heat to the substrate; and a plurality of pressure elements respectively disposed on the plurality of temperature elements in the main thin film and configured to apply local pressure to the main thin film.

公开(公告)号：US20240208005A1

公开(公告)日：2024-06-27

申请号：US18226873

申请日：2023-07-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jubong LEE ,  Jongsu KIM ,  Sungyong PARK ,  Bongki PARK ,  Eunsun PARK ,  Hyunjoon PARK ,  Hoseop CHOI

IPC: B24B53/017 ,  B24B37/005 ,  B24B37/04

CPC classification number: B24B53/017 ,  B24B37/005 ,  B24B37/04

Abstract: A cleaner for a CMP apparatus includes a cleaning body, a plurality of cleaning nozzles, a vision system and a controller. The cleaning body may be arranged under a polishing head of the CMP apparatus configured to hold a substrate. The cleaning body may be configured to receive a cleaning solution for cleaning the polishing head. The cleaning nozzles may be arranged at the cleaning body to inject the cleaning solutions to the polishing head. The vision system may photograph the polishing head to which the cleaning solution may be injected to obtain an image of the polishing head. The controller may individually control amounts of the cleaning solutions injected from the cleaning nozzles based on the image of the polishing head. Thus, a scratch caused by a defect may not be generated at the substrate.