公开(公告)号：US11862603B2

公开(公告)日：2024-01-02

申请号：US17001978

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewook Kim ,  Jongho Lee ,  Jeongjoon Oh ,  Hyeon Hwang

IPC: H01L21/768 ,  H01L23/522 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/528 ,  H01L23/532 ,  H01L25/065

CPC classification number: H01L25/0652 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2225/06589

Abstract: A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

公开(公告)号：US20210159213A1

公开(公告)日：2021-05-27

申请号：US17001978

申请日：2020-08-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taewook Kim ,  Jongho Lee ,  Jeongjoon Oh ,  Hyeon Hwang

IPC: H01L25/065

Abstract: A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

公开(公告)号：US20250089179A1

公开(公告)日：2025-03-13

申请号：US18601190

申请日：2024-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyeon Hwang ,  Sangwon Lee

IPC: H05K3/34

Abstract: A ball attach tool may include a housing a valve module. The housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. The valve module may control a reduced pressure applied to the pick-up holes.

公开(公告)号：US20250014963A1

公开(公告)日：2025-01-09

申请号：US18763599

申请日：2024-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan Lee ,  Kundae Yeom ,  Hyeon Hwang

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a heat-dissipating structure on the first semiconductor chip, an adhesive layer between the first semiconductor chip and the heat-dissipating structure, a second semiconductor chip on the heat-dissipating structure, a molding film on the substrate and covering at least portions of the first semiconductor chip, the heat-dissipating structure, and the second semiconductor chip, and a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip, and the first hole may penetrate the molding film, the heat-dissipating structure, and the adhesive layer.