公开(公告)号：US20250014963A1

公开(公告)日：2025-01-09

申请号：US18763599

申请日：2024-07-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan Lee ,  Kundae Yeom ,  Hyeon Hwang

IPC: H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L25/18

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a heat-dissipating structure on the first semiconductor chip, an adhesive layer between the first semiconductor chip and the heat-dissipating structure, a second semiconductor chip on the heat-dissipating structure, a molding film on the substrate and covering at least portions of the first semiconductor chip, the heat-dissipating structure, and the second semiconductor chip, and a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip, and the first hole may penetrate the molding film, the heat-dissipating structure, and the adhesive layer.

公开(公告)号：US10008488B2

公开(公告)日：2018-06-26

申请号：US15489031

申请日：2017-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongkwan Lee ,  Kundae Yeom ,  Jongho Lee ,  Hogeon Song

IPC: H01L25/18 ,  H01L21/48 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10

CPC classification number: H01L25/18 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/105 ,  H01L2224/16141 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00012

Abstract: In one embodiment, the semiconductor module includes a module substrate and a first substrate mounted on and electrically connected to a first surface of the module substrate. The first substrate has one or more first electrical connectors of the semiconductor module, and the first substrate electrically connecting the first electrical connector to the module substrate.