公开(公告)号：US20190043813A1

公开(公告)日：2019-02-07

申请号：US16159290

申请日：2018-10-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sun-dae KIM ,  Hyung-gil BAEK ,  Yun-rae CHO ,  Nam-gyu BAEK

IPC: H01L23/00 ,  H01L23/58 ,  H01L21/78

Abstract: Provided is a semiconductor device including a semiconductor substrate including a main chip area and a scribe lane area adjacent to the main chip area, the scribe lane area including a first region adjacent to the main chip area and a second region adjacent to the first region; an insulating layer disposed on the semiconductor substrate; first embossing structures disposed on a first surface of the insulating layer in a first area of the insulating layer corresponding to the first region; second embossing structures disposed on the first surface of the insulating layer in a second area of the insulating layer corresponding to the second region; and dam structures provided in the first area of the insulating layer at positions corresponding to the first embossing structures, the dam structures extending in a direction perpendicular to a second surface of the insulating layer that is adjacent to the semiconductor substrate.

公开(公告)号：US20170064824A1

公开(公告)日：2017-03-02

申请号：US15232794

申请日：2016-08-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Young-jae KIM ,  Hyung-gil BAEK ,  Baik-woo LEE

IPC: H05K1/11 ,  H05K3/22 ,  H05K3/40 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/0219 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K1/183 ,  H05K3/0073 ,  H05K3/22 ,  H05K3/3452 ,  H05K3/4007 ,  H05K2201/0373 ,  H05K2201/0376 ,  H05K2201/09409 ,  H05K2201/09745 ,  H05K2201/0989 ,  H05K2203/1105 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A printed circuit board is provided. The printed circuit board comprises a base substrate comprising a chip mounting region on an upper surface thereof, a plurality of connection pad structures in the chip mounting region, and an extension pattern on the base substrate, spaced from each of two adjacent connection pad structures from among the plurality of connection pad structures, and extending along the two adjacent connection pad structures. Upper surfaces of the plurality of connection pad structures are positioned at a higher level than an upper surface of the extension pattern.

Abstract translation: 提供印刷电路板。 印刷电路板包括基底基板，该基板在其上表面上包括芯片安装区域，芯片安装区域中的多个连接焊盘结构以及基板上的延伸图案，与两个相邻的连接焊盘结构中的每一个间隔开 在多个连接焊盘结构中，并且沿着两个相邻的连接焊盘结构延伸。 多个连接垫结构的上表面位于比延伸图案的上表面更高的水平。