公开(公告)号：US20160143554A1

公开(公告)日：2016-05-26

申请号：US14947640

申请日：2015-11-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Se-hoon LIM ,  Jun-hyung PARK ,  Hee-jae JO ,  Jang-beom YANG ,  Jae-min JUNG ,  Eun-mi OH ,  Jong-ho CHOI ,  Jun-ho KOH ,  Chang-Hyun LEE ,  Yong-hyun LIM ,  Hae-in CHUN

IPC: A61B5/0478 ,  A61B5/00 ,  A61B5/04

Abstract: An apparatus for measuring bioelectrical signals is provided. The apparatus includes a sensor electrode, a sensor support, and a main body. The sensor electrode has a tapering portion that narrows toward one end and a protruding portion that extends from the one end of the tapering portion, contacts a body part, and senses bioelectrical signals. The sensor support maintains the contact between the sensor electrode and the body part. The main body is connected to the sensor support and is wearable on a living body.

Abstract translation: 提供了一种用于测量生物电信号的装置。 该装置包括传感器电极，传感器支架和主体。 传感器电极具有朝向一端变窄的锥形部分和从锥形部分的一端延伸的突出部分接触主体部分并感测生物电信号。 传感器支撑件保持传感器电极和主体部分之间的接触。 主体连接到传感器支架上，可在生物体上穿戴。

公开(公告)号：US20180125386A1

公开(公告)日：2018-05-10

申请号：US15577752

申请日：2016-04-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Se-hoon LIM ,  Hee-jae JO ,  Jun-hyung PARK ,  Jang-beom YANG ,  Jae-min JUNG ,  Jun-ho KOH ,  Chang-hyun LEE ,  Yong-hyun LIM

IPC: A61B5/0478 ,  G06F3/01 ,  A61B5/00

CPC classification number: A61B5/0478 ,  A61B5/0006 ,  A61B5/04012 ,  A61B5/048 ,  A61B5/7207 ,  A61B5/7282 ,  A61B2562/046 ,  G06F3/015

Abstract: Disclosed are a brainwave sensor unit and a brainwave measurement apparatus using the same. The brainwave sensor unit includes first and second contact electrodes located on a supporter, the first contact electrode obtains a brainwave signal from a living body, and the second contact electrode is spaced apart and electrically insulated from the first contact electrode and is grounded.

公开(公告)号：US20170287814A1

公开(公告)日：2017-10-05

申请号：US15479856

申请日：2017-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-woo KIM ,  Jae-min JUNG ,  Ji-yong PARK ,  Jeong-kyu HA ,  Woon-bae KIM

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L23/29 ,  H01L23/488 ,  H01L23/4922 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/143 ,  H01L2924/186

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.