公开(公告)号：US20230257884A1

公开(公告)日：2023-08-17

申请号：US18137062

申请日：2023-04-20

Applicant: SAMSUNG ELECTRONICS CO, LTD. ,  INTOPS CO, LTD.

Inventor： Chunghyo JUNG ,  Wonjun KO ,  Hyein PARK ,  Yongsub LEE ,  Jaedeok LIM ,  Bumjin CHO ,  Chiyoung YOON ,  Keunha KIM ,  Kyungha KOO ,  Hongki MOON

IPC: C23C18/20 ,  H05K5/02 ,  B23C3/30 ,  C23C18/16

CPC classification number: C23C18/2013 ,  H05K5/0247 ,  B23C3/30 ,  C23C18/1651 ,  C23C18/1689 ,  B23K26/364

Abstract: The present disclosure provides electronic device and methods of manufacturing the electronic devices. In some embodiments, the electronic device includes an outer housing at least partially forming an exterior of the electronic device, a trench including at least one valley and at least one peak, a first conductive member, and a coating layer laminated on the outer housing and disposed on the first conductive member. Each of the at least one valley is concave with respect to a surface of the outer housing. Each of the at least one peak is convex with respect to the surface of the outer housing and has a partially removed end. The trench is plated with the first conductive member.

公开(公告)号：US20210274637A1

公开(公告)日：2021-09-02

申请号：US17262973

申请日：2019-07-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yonghwa KIM ,  Min PARK ,  Dongil SON ,  Hyunwoo SIM ,  Jaedeok LIM ,  Chunghyo JUNG ,  Seungbum CHOI

IPC: H05K1/02

Abstract: According to various embodiments, an electronic device may include a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a middle plate disposed in the space between the first plate and the second plate in parallel with the second plate, a first Printed Circuit Board (PCB) disposed in a space between the second plate and the middle plate, a first electronic component mounted on the first PCB between the first PCB and the middle plate, a first heat transfer structure disposed between the first electronic component and the middle plate, a second electronic component including a first surface disposed in the space and spaced apart from the first PCB, a second surface facing away from the first surface, and a side face substantially perpendicular to the first surface or the second surface, and a second heat transfer structure. The second heat transfer structure may include a first thermal conductive layer including a first portion attached to the first surface or the second surface, and a second portion extending from the first portion toward the middle plate and at least partially having a thermal conductive path between the second electronic component and the middle plate, and a second electrical conductive layer including a third portion attached to the first portion so that the third portion constructs an electromagnetic shielding structure for the second electric component. Other various embodiments may also be possible.

公开(公告)号：US20210161039A1

公开(公告)日：2021-05-27

申请号：US17060785

申请日：2020-10-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Chunghyo JUNG ,  Jaedeok LIM ,  Hyein PARK ,  Jaehyoung YOU

IPC: H05K9/00 ,  H05K7/20 ,  H05K5/00 ,  H05K1/02

Abstract: An electronic device is provided. The electronic device includes a circuit board, at least one electric component disposed on one surface of the circuit board, a shield can mounted on the one surface of the circuit board, with the at least one electric component received in the shield can, and including at least one opening formed in an area corresponding to the at least one electric component, a shielding sheet disposed in at least a portion of the shield can and blocking at least a portion of the at least one opening, and a heat transfer member disposed in contact between the at least one electric component and the shielding sheet. The shielding sheet includes a flexible structure.

公开(公告)号：US20230297133A1

公开(公告)日：2023-09-21

申请号：US18321993

申请日：2023-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gihoon LEE ,  Jaedeok LIM ,  Dongyup LEE ,  Jeonggyu JO ,  Woosung CHUN

IPC: G06F1/16

CPC classification number: G06F1/1616 ,  G06F1/1677 ,  G06F1/1681

Abstract: An electronic device includes a display which is foldable at a folding region of the display, a housing which is foldable together with the display, the housing including a first housing and a second housing, and a sensor which is on the first housing and detects a magnetic field, and a hinge structure which corresponds to the folding region of the display, is foldable together with the display and hingedly connects the first housing and the second housing to each other, the hinge structure including a magnet which is slidable along the first housing. Folding of the hinge structure includes folding of the housing together with folding of the display and sliding of the magnet relative to the sensor.

公开(公告)号：US20230046690A1

公开(公告)日：2023-02-16

申请号：US17885910

申请日：2022-08-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sangil PARK ,  Jungchul AN ,  Myeongsu OH ,  Jaedeok LIM ,  Gyuyeong CHO

IPC: G06F3/041 ,  H04M1/02

Abstract: According to various embodiments of the disclosure, an electronic device may include: a hinge plate coupled at least in part between a first support including a first magnet and a second support including a second magnet, a first housing coupled at least in part to a first side of the hinge plate through the first support, a second housing coupled at least in part to a second side of the hinge plate through the second support and configured to be foldable with the first housing through the hinge plate, and a flexible display supported on the first and second supports and configured to be foldable. The flexible display may include: a display panel; a support plate disposed on a lower surface of the display panel; a first digitizer and a second digitizer disposed on a lower surface of the support plate spaced apart from each other through a second gap; a first-first shielding member comprising a magnetic shielding material and a first-second shielding member comprising a magnetic shielding material disposed on lower surfaces of the first and second digitizers spaced apart from each other through a third gap; a first metal plate and a second metal plate disposed on lower surfaces of the first-first and first-second shielding members spaced apart from each other through a fourth gap; a third-first shielding member comprising a magnetic shielding material disposed on an upper surface of a first magnetization region of the first support in a first space between the first metal plate and the first support, and a third-second shielding member comprising a magnetic shielding material spaced apart from the third-first shielding member through a sixth gap and disposed on an upper surface of a second magnetization region of the second support in a second space between the second metal plate and the second support; and a fourth-first shielding member comprising a magnetic shielding material disposed on an upper surface of the third-first shielding member and surrounding at least a portion of the third-first shielding member through the sixth gap, and a fourth-second shielding member comprising a magnetic shielding material spaced apart from the fourth-first shielding member through the sixth gap, disposed on an upper surface of the third-second shielding member, and surrounding at least a portion of the third-second shielding member through the sixth gap.

公开(公告)号：US20200018657A1

公开(公告)日：2020-01-16

申请号：US16506251

申请日：2019-07-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunwoo SIM ,  Seongjun KIM ,  Yonghwa KIM ,  Dongil SON ,  Jaedeok LIM ,  Seungbum CHOI

IPC: G01L1/22 ,  H05K1/02 ,  G06F3/045

Abstract: An electronic device for detecting pressure is provided. The electronic device includes a printed circuit board (PCB) including at least one element or circuit pattern for driving the electronic device, at least one electrode pattern formed to detect a pressure in the wiring layer included in the PCB, an elastic member arranged to be at least partially overlapped with the electrode pattern, and a pressure sensor circuit electrically connected to the electrode pattern included in the PCB. The pressure sensor circuit is configured to apply a voltage to the electrode pattern and measure intensity of the pressure based on a change in the voltage applied to the electrode pattern.

公开(公告)号：US20240429256A1

公开(公告)日：2024-12-26

申请号：US18828337

申请日：2024-09-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gwangho CHOI ,  Hyein PARK ,  Jaedeok LIM

IPC: H01L27/146 ,  H04N23/56 ,  H04N23/57

Abstract: An electronic device according to an embodiment of the disclosure includes an upper structure that forms at least a portion of an exterior of the electronic device, a sensor module including a light emitting unit and a light receiving unit spaced apart from each other on a surface thereof that faces in a first direction and faces the upper structure, and a shielding structure that has a thin film form and surrounds at least a portion of the surface of the sensor module that faces in the first direction, the first direction being a direction in which the light emitting unit emits light. The upper structure is spaced apart from a surface of the shielding structure that faces in the first direction. The shielding structure includes a shielding film layer, a lusterless layer, and a diffuse reflection layer stacked on the sensor module in the first direction. The diffuse reflection layer is formed of a mixture of a plurality of silica particles and a binder and includes, on a surface of the diffuse reflection layer, a plurality of raised parts having a mountain shape, the width of which is decreased in the first direction.

公开(公告)号：US20240224410A1

公开(公告)日：2024-07-04

申请号：US18432920

申请日：2024-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jeongseok LEE ,  Hyein PARK ,  Jaedeok LIM

IPC: H05K1/02

CPC classification number: H05K1/0218 ,  H05K1/0215 ,  H05K2201/0112 ,  H05K2201/0707 ,  H05K2201/10151 ,  H05K2201/2054

Abstract: An electronic device according to an embodiment includes a printed circuit board including a ground pad, an optical sensor disposed on the printed circuit board, and a shielding member covering the optical sensor. The shielding member includes a first adhesive layer attached on the optical sensor and the ground pad, a first shielding layer electrically connected to the ground pad and disposed on the first adhesive layer, and a first cover layer disposed on the first shielding layer, the first cover layer including a plurality of first particles configured to reflect or scatter light, a plurality of second particles configured to absorb the light, and a binder covering the plurality of first particles and the plurality of second particles.

公开(公告)号：US20230140971A1

公开(公告)日：2023-05-11

申请号：US18149497

申请日：2023-01-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangil PARK ,  Myeongsil PARK ,  Juwan PARK ,  Hyein PARK ,  Jaehyoung YOU ,  Shinhyuk YOON ,  Jaedeok LIM ,  Gyuyeong CHO ,  Seungbum CHOI ,  Hyunju HONG

IPC: G06F1/16 ,  H01F7/02

CPC classification number: G06F1/1679 ,  G06F1/1652 ,  G06F1/1656 ,  G06F1/1681 ,  H01F7/0278 ,  G06F1/1616

Abstract: An electronic device is provided. The electronic device includes a foldable housing which has a hinge structure including a first housing and a second housing, the first housing is connected to the hinge structure and includes a first surface facing a first direction, a second surface facing a second direction opposite the first direction, and a first side surrounding the space between the first second surface, and the second housing is connected to the hinge structure and includes a third surface facing a third direction, a fourth surface facing a fourth direction opposite the third direction, and a second side, the first surface facing the third surface when the electronic device is in a folded state, and the third direction being the same as the first direction when the electronic device is in an unfolded state, a flexible display extending from the first and third surface, and a magnet array.

公开(公告)号：US20230004193A1

公开(公告)日：2023-01-05

申请号：US17929599

申请日：2022-09-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyuyeong CHO ,  Jaedeok LIM ,  Jongsoo SUNG ,  Gunbae LIM ,  Dusun CHOI

IPC: G06F1/16 ,  G06F3/044 ,  H05K1/18 ,  H05K9/00

Abstract: An electronic device according to various embodiments disclosed in this document may include: a display panel; a recognition member disposed under the display panel and including a conductive pattern to recognize a signal from a pen input device; a first shielding member disposed under the recognition member; and a second shielding member disposed under the first shielding member and made of a material different than the first shielding member, wherein the second shielding member includes a component region corresponding to at least one electronic component disposed under the second shielding member, and wherein at least a portion of the second shielding member is removed from the component region.