公开(公告)号：US09558993B2

公开(公告)日：2017-01-31

申请号：US14072882

申请日：2013-11-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaehwang Sim ,  Jaeho Min ,  Jaehan Lee ,  Keonsoo Kim

IPC: H01L21/033 ,  H01L21/311 ,  H01L21/768 ,  H01L21/3213 ,  H01L21/308 ,  H01L23/528 ,  H01L27/115

CPC classification number: H01L21/76802 ,  H01L21/0334 ,  H01L21/0337 ,  H01L21/3081 ,  H01L21/311 ,  H01L21/31144 ,  H01L21/32139 ,  H01L21/76816 ,  H01L23/528 ,  H01L27/11521 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A pattern structure in a semiconductor device includes an extending line and a pad connected with an end portion of the extending line. The pad may have a width that is larger than a width of the extending line. The pad includes a protruding portion extending from a lateral portion of the pad. The pattern structure may be formed by simplified processes and may be employed in various semiconductor devices requiring minute patterns and pads.

Abstract translation: 半导体器件中的图案结构包括延伸线和与延伸线的端部连接的焊盘。 垫可以具有大于延伸线的宽度的宽度。 垫包括从垫的侧部延伸的突出部分。 图案结构可以通过简化的工艺形成，并且可以用于需要微小图案和焊盘的各种半导体器件中。