SEMICONDUCTOR MEMORY DEVICES
    1.
    发明公开

    公开(公告)号:US20240324182A1

    公开(公告)日:2024-09-26

    申请号:US18470537

    申请日:2023-09-20

    CPC classification number: H10B12/482 H10B12/0335 H10B12/315

    Abstract: A semiconductor device includes a substrate that includes an active pattern, a bit line structure that crosses the active pattern, a storage node contact electrically connected to the active pattern next to the bit line structure, a spacer structure between a side surface of the bit line structure and the storage node contact, an upper surface of the spacer structure is at a vertical level lower than an upper surface of the bit line structure, an insulating pattern on the spacer structure, and a landing pad structure electrically connected to the storage node contact and on the spacer structure and the bit line structure. The landing pad structure include a first side surface in contact with the spacer structure, a second side surface in contact with the bit line structure, and a third side surface in contact with the insulating pattern.

    METHOD AND DEVICE FOR OPERATING TRIGGER BETWEEN ELECTRONIC DEVICES AND JACK ACCESSORY SUPPORTING THE SAME
    3.
    发明申请
    METHOD AND DEVICE FOR OPERATING TRIGGER BETWEEN ELECTRONIC DEVICES AND JACK ACCESSORY SUPPORTING THE SAME 审中-公开
    用于操作电子设备之间的触发器和支持其的插座附件的方法和装置

    公开(公告)号:US20160034410A1

    公开(公告)日:2016-02-04

    申请号:US14813952

    申请日:2015-07-30

    CPC classification number: G06F13/385 G06F13/28 G06F13/4022

    Abstract: A trigger operation method of an electronic device is provided. The trigger operation method includes when a trigger jack device is connected to a jack interface, configuring trigger execution information on the basis of at least one of sharing configuration information related to a task in progress, configuration change information, and communication connection configuration information, and recording the trigger execution information in the trigger jack device connected to the jack interface.

    Abstract translation: 提供一种电子设备的触发操作方法。 触发操作方法包括当触发插孔装置连接到插座接口时,基于与正在进行的任务相关的共享配置信息,配置改变信息和通信连接配置信息中的至少一个配置触发执行信息,以及 将触发执行信息记录在连接到插孔接口的触发插孔设备中。

    METHOD OF FABRICATING A SEMICONDUCTOR DEVICE

    公开(公告)号:US20240162096A1

    公开(公告)日:2024-05-16

    申请号:US18416585

    申请日:2024-01-18

    CPC classification number: H01L22/12 H01L21/31144

    Abstract: A method of fabricating a semiconductor device is disclosed. The method may include forming a parent pattern, forming an upper thin film on the parent pattern, forming a child pattern on the upper thin film, measuring a diffraction light from the parent and child patterns to obtain an intensity difference curve of the diffraction light versus its wavelength, and performing an overlay measurement process on the parent and child patterns using the diffraction light, which has the same wavelength as a peak of the intensity difference curve located near a peak of reflectance of the parent and child patterns, to obtain an overlay measurement value.

    Electronic device for displaying plurality of application execution screens, and method related thereto

    公开(公告)号:US12190132B2

    公开(公告)日:2025-01-07

    申请号:US18116654

    申请日:2023-03-02

    Abstract: An electronic device includes: a foldable display; a processor operationally coupled with the display; and a memory operationally coupled with the processor, wherein the memory stores instructions that, when executed, cause the processor to: detect a screen layout state of the foldable display based on at least one of a folding angle of the foldable display, a rotation angle of the foldable display, a mounting state of the electronic device, or a gripped state of the electronic device; determine a plurality of applications for execution, based on the detected screen layout state; determine a plurality of regions of the foldable display on which the plurality of applications are to be displayed, based on the detected screen layout state; and display execution screens of the plurality of applications on the plurality of regions.

    SEMICONDUCTOR DEVICE
    8.
    发明申请

    公开(公告)号:US20240414909A1

    公开(公告)日:2024-12-12

    申请号:US18442363

    申请日:2024-02-15

    Abstract: A semiconductor device includes an active pattern on a substrate; a gate structure extending through an upper portion of the active pattern; a bit line structure on a central portion of the active pattern; a lower contact plug on each of opposite end portions of the active pattern; and an upper contact plug structure on the lower contact plug. The upper contact plug structure includes a first upper contact plug and a second upper contact plug on the first upper contact plug. The second upper contact plug contacts the first upper contact plug. The first upper contact plug includes a first metal pattern and a barrier pattern covering a lower surface and a sidewall of the first metal pattern. An upper surface of the bit line structure contacts a lower surface of the second upper contact plug and does not contact the barrier pattern.

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