公开(公告)号：US09076881B2

公开(公告)日：2015-07-07

申请号：US14171048

申请日：2014-02-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yun-Hyeok Im ,  Jong-Yeon Kim ,  Tae-Je Cho ,  Un-Byoung Kang

IPC: H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L24/81 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05572 ,  H01L2224/06181 ,  H01L2224/11001 ,  H01L2224/13025 ,  H01L2224/13075 ,  H01L2224/13099 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Provided are a bump structure includes a first bump and a second bump, a semiconductor package including the same, and a method of manufacturing the same. The bump structure includes: first bump provided on a connection pad of a substrate, the first bump including a plurality of nano-wires extending from the connection pad and a body connecting end portions of the plurality of nano-wires; and a second bump provided on the body of the first bump.

Abstract translation: 提供一种凸块结构，包括第一凸块和第二凸块，包括该凸块的半导体封装及其制造方法。 凸块结构包括：设置在基板的连接焊盘上的第一凸块，所述第一凸块包括从所述连接焊盘延伸的多个纳米线和连接所述多个纳米线的端部的主体; 以及设置在第一凸块的主体上的第二凸块。