TRANSMITTER, MEMORY DEVICE AND SEMICONDUCTOR DEVICE INCLUDING THE TRANSMITTER

    公开(公告)号:US20240203466A1

    公开(公告)日:2024-06-20

    申请号:US18230776

    申请日:2023-08-07

    IPC分类号: G11C7/10 H03K19/017

    摘要: A transmitter configured to receive first to N-th data in parallel and sequentially output the first to N-th data in response to first to N-th clock signals having different phases from each other, where N is an integer of at least 2, the transmitter including first to N-th data selectors including a first data selector and a second data selector in correspondence to the first to N-th data, each of the first to N-th data selectors being configured to perform a logical operation on one of the first to N-th data and the first to N-th clock signals and output a plurality of data selection signals, a first pre-driver in correspondence to at least two data selectors among the first to N-th data selectors, the first pre-driver being configured to receive the plurality of data selection signals from the at least two data selectors.

    SEMICONDUCTOR PACKAGE
    3.
    发明申请

    公开(公告)号:US20220399316A1

    公开(公告)日:2022-12-15

    申请号:US17677453

    申请日:2022-02-22

    摘要: Disclosed is a semiconductor package comprising an interposer substrate having first and second surfaces opposite each other and including a wiring layer adjacent to the first surface, a semiconductor chip on the first surface of the interposer substrate, a passivation layer on the first surface of the interposer substrate and covering the semiconductor chip, and redistribution patterns in the passivation layer and connected to the semiconductor chip. The semiconductor chip has third and fourth surfaces opposite to each other. The third surface of the semiconductor chip faces the first surface of the interposer substrate. The redistribution patterns are connected to the fourth surface of the semiconductor chip. The semiconductor chip includes chip pads adjacent to the third surface and chip through electrodes connected to the chip pads. Each of the chip pads is directly bonded to a corresponding one of wiring patterns in the wiring layer.

    ELECTRONIC DEVICE SUPPORTING AVATAR RECOMMENDATION AND DOWNLOAD

    公开(公告)号:US20200264738A1

    公开(公告)日:2020-08-20

    申请号:US16747936

    申请日:2020-01-21

    摘要: An electronic device and method are disclosed. The electronic device includes: an input circuitry, a display, a camera, a communication circuitry, a processor operatively connected to the input circuitry, the display, the camera, and the communication circuitry, and a memory operatively connected to the processor. The processor implements the method, including display, on the display, one or more images depicting characters selectable as avatars, detect via the input circuitry a selection of a character as an avatar, set the selected character as the avatar, replacing an object included in an image captured by the camera, and display, on the display, one or more icons representing one or more packages including a first package associated with the selected character, based on identification information for the selected character.

    ELECTRONIC DEVICE PERFORMING RESCHEDULING OVER WIRELESS CHANNEL AND METHOD FOR CONTROLLING SAME

    公开(公告)号:US20220141680A1

    公开(公告)日:2022-05-05

    申请号:US17474399

    申请日:2021-09-14

    摘要: According to various embodiments, an electronic device may include a communication circuit operably coupled with an external electronic device and at least one processor, wherein the at least one processor may be configured to determine one or more target-wake-time (TWT) parameters of at least one TWT service period based on at least one of the amount of data transmitted to the external electronic device, an amount of data received from the external electronic device, or a bandwidth, wherein at least one data frame is transmitted or received between the electronic device and the external electronic device during the at least one TWT service period; identify quality of service (QoS) for the at least one data frame transmitted or received during the at least one TWT service period; change at least one TWT parameter among the one or more TWT parameters based on the identified QoS; and control the communication circuit to transmit or receive at least one next data frame during the a next TWT service period based on the changed at least one TWT parameter.

    SEMICONDUCTOR PACKAGE
    7.
    发明申请

    公开(公告)号:US20220037261A1

    公开(公告)日:2022-02-03

    申请号:US17349174

    申请日:2021-06-16

    摘要: A semiconductor package including a redistribution substrate including an insulating layer and redistribution patterns in the insulating layer may be provided. Each of the redistribution patterns may include a via portion, a pad portion vertically overlapping the via portion, and a line portion extending from the pad portion. The via portion, the pad portion, and the line portion may be connected to each other to form a single object. A level of a bottom surface of the pad portion may be lower than a level of a bottom surface of the line portion. A width of the line portion may have a largest value at a level between a top surface of the line portion and the bottom surface of the line portion.

    SEMICONDUCTOR PACKAGE DEVICE
    8.
    发明申请

    公开(公告)号:US20220020714A1

    公开(公告)日:2022-01-20

    申请号:US17204313

    申请日:2021-03-17

    摘要: A semiconductor package device may include a redistribution substrate and a semiconductor chip on a top surface of the redistribution substrate. The redistribution substrate may include an under-bump pattern, which includes including a body portion and a protruding portion extended from the body portion to form a single object, an insulating layer covering a side surface of the body portion, and an outer coupling terminal on the protruding portion. The body portion may have a first diameter in a first direction parallel to the top surface of the redistribution substrate, and the protruding portion may have a second diameter in the first direction, which is smaller than the first diameter. A top surface of the protruding portion may be parallel to the first direction, and a side surface of the protruding portion may be inclined at an angle to a top surface of the body portion.

    ELECTRONIC DEVICE AND METHOD FOR OPERATING ACCESS POINT INFORMATION BY ELECTRONIC DEVICE

    公开(公告)号:US20200154348A1

    公开(公告)日:2020-05-14

    申请号:US16680712

    申请日:2019-11-12

    摘要: An electronic device is disclosed herein. The electronic device includes a display, at least one wireless communication circuit configured to perform Wi-Fi wireless communication with at least one access point (AP) and/or at least one external electronic device, a processor operatively connected to the display and the wireless communication circuit, and a memory operatively connected to the processor, wherein the memory stores instructions executable by the processor to cause the electronic device to: execute Wi-Fi scanning and receive a first signal from the at least one AP by the wireless communication circuit, receive a second signal from the at least one external electronic device by the wireless communication circuit, the second signal including information related to the at least one AP, determine a wireless communication channel state of the AP based at least partially on the first signal and the second signal, and control the display to display a graphic user interface (GUI) including an object indicating the determined wireless communication channel state.