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公开(公告)号:US11791381B2
公开(公告)日:2023-10-17
申请号:US18096663
申请日:2023-01-13
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soojin Jeong , Sunwook Kim , Junbeom Park , Seungmin Song
IPC: H01L29/08 , H01L27/088 , H01L29/16 , H01L29/78
CPC classification number: H01L29/0847 , H01L27/0886 , H01L29/1608 , H01L29/7854
Abstract: A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction parallel to an upper surface of the substrate, a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction, channels spaced apart from each other in a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure, a source/drain layer on a portion of the active pattern adjacent the gate structure, the source/drain layer contacting the channels, and a sacrificial pattern on an upper surface of each of opposite edges of the portion of the active pattern in the second direction, the sacrificial pattern contacting a lower portion of a sidewall of the source/drain layer and including silicon-germanium.
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公开(公告)号:US11699759B2
公开(公告)日:2023-07-11
申请号:US17545072
申请日:2021-12-08
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seungmin Song , Junbeom Park , Bongseok Suh , Junggil Yang
IPC: H01L29/78 , H01L29/66 , H01L29/423 , H01L21/8234 , H01L27/088
CPC classification number: H01L29/785 , H01L21/823431 , H01L27/0886 , H01L29/42392 , H01L29/66545 , H01L29/66795
Abstract: Integrated circuit devices including a fin shaped active region and methods of forming the same are provided. The devices may include a fin shaped active region, a plurality of semiconductor patterns on the fin shaped active region, a gate electrode on the plurality of semiconductor patterns, and source/drain regions on opposing sides of the gate electrode, respectively. The gate electrode may include a main gate portion extending on an uppermost semiconductor pattern and a sub-gate portion extending between two adjacent ones of the plurality of semiconductor patterns. The sub-gate portion may include a sub-gate center portion and sub-gate edge portions. In a horizontal cross-sectional view, a first width of the sub-gate center portion in a first direction may be less than a second width of one of the sub-gate edge portions in the first direction.
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公开(公告)号:US11417776B2
公开(公告)日:2022-08-16
申请号:US16715431
申请日:2019-12-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sujin Jung , Junbeom Park , Kihwan Kim , Sunguk Jang , Youngdae Cho
IPC: H01L29/06 , H01L29/66 , H01L29/423 , H01L29/786 , H01L21/02
Abstract: A semiconductor device, including a silicon on insulator (SOI) substrate is disclosed. The device may include gate structures formed on the SOI substrate and being spaced apart from each other in a horizontal direction, and a plurality of channels spaced apart from each other in a vertical direction. Each of the channels may extend through each of the gate structures in the horizontal direction. The device may include a seed layer and a source/drain region. The source/drain region may be connected to the channels, and each sidewall of the source/drain region in the horizontal direction may have a concave-convex shape. The device may include a protruding portion of the source/drain region formed between the gate structures that protrudes in the horizontal direction compared to a non-protruding portion of the source/drain region formed between the channels.
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公开(公告)号:US20250089299A1
公开(公告)日:2025-03-13
申请号:US18960679
申请日:2024-11-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junbeom Park , Sangsu Kim , Junggil Yang
IPC: H01L29/423 , H01L29/417
Abstract: A semiconductor device includes a first source/drain structure having a first length in a horizontal direction, as viewed in a planar cross-sectional view, the horizontal direction being perpendicular to a vertical direction, a second source/drain structure having a second length in the horizontal direction, as viewed in the planar cross-sectional view, the second length being less than the first length, channels extending between the first source/drain structure and the second source/drain structure, the channels being spaced apart from each other in the vertical direction, at least one sacrificial pattern between adjacent ones of the channels, and a trench penetrating the channels and the at least one sacrificial pattern.
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公开(公告)号:US12211942B2
公开(公告)日:2025-01-28
申请号:US17398504
申请日:2021-08-10
Applicant: Samsung Electronics Co., Ltd.
Inventor: Soojin Jeong , Myunggil Kang , Junggil Yang , Junbeom Park
IPC: H01L29/786 , H01L21/02 , H01L29/06 , H01L29/423 , H01L29/66
Abstract: A semiconductor device includes a first source/drain, a second source/drain isolated from direct contact with the first source/drain in a horizontal direction, a channel extending between the first source/drain and the second source/drain, a gate surrounding the channel, an upper inner spacer between the gate and the first source/drain and above the channel, and a lower inner spacer between the gate and the first source/drain and under the channel, in which the channel includes a base portion extending between the first source/drain and the second source/drain, an upper protrusion portion protruding upward from a top surface of the base portion, and a lower protrusion portion protruding downward from a bottom surface of the base portion, and a direction in which a top end of the upper protrusion portion is isolated from direct contact with a bottom end of the lower protrusion portion is oblique with respect to a vertical direction.
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公开(公告)号:US11557653B2
公开(公告)日:2023-01-17
申请号:US17345241
申请日:2021-06-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Soojin Jeong , Sunwook Kim , Junbeom Park , Seungmin Song
IPC: H01L29/08 , H01L29/78 , H01L29/16 , H01L27/088
Abstract: A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction parallel to an upper surface of the substrate, a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction, channels spaced apart from each other in a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure, a source/drain layer on a portion of the active pattern adjacent the gate structure, the source/drain layer contacting the channels, and a sacrificial pattern on an upper surface of each of opposite edges of the portion of the active pattern in the second direction, the sacrificial pattern contacting a lower portion of a sidewall of the source/drain layer and including silicon-germanium.
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公开(公告)号:US20200381562A1
公开(公告)日:2020-12-03
申请号:US16715431
申请日:2019-12-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sujin Jung , Junbeom Park , Kihwan Kim , Sunguk Jang , Youngdae Cho
IPC: H01L29/786 , H01L29/06 , H01L29/423 , H01L21/02 , H01L29/66
Abstract: A semiconductor device, including a silicon on insulator (SOI) substrate is disclosed. The device may include gate structures formed on the SOI substrate and being spaced apart from each other in a horizontal direction, and a plurality of channels spaced apart from each other in a vertical direction. Each of the channels may extend through each of the gate structures in the horizontal direction. The device may include a seed layer and a source/drain region. The source/drain region may be connected to the channels, and each sidewall of the source/drain region in the horizontal direction may have a concave-convex shape. The device may include a protruding portion of the source/drain region formed between the gate structures that protrudes in the horizontal direction compared to a non-protruding portion of the source/drain region formed between the channels.
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公开(公告)号:US12183796B2
公开(公告)日:2024-12-31
申请号:US17189615
申请日:2021-03-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Junbeom Park , Sangsu Kim , Junggil Yang
IPC: H01L29/423 , H01L29/417
Abstract: A semiconductor device includes a first source/drain structure having a first length in a horizontal direction, as viewed in a planar cross-sectional view, the horizontal direction being perpendicular to a vertical direction, a second source/drain structure having a second length in the horizontal direction, as viewed in the planar cross-sectional view, the second length being less than the first length, channels extending between the first source/drain structure and the second source/drain structure, the channels being spaced apart from each other in the vertical direction, at least one sacrificial pattern between adjacent ones of the channels, and a trench penetrating the channels and the at least one sacrificial pattern.
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公开(公告)号:US11227952B2
公开(公告)日:2022-01-18
申请号:US16743206
申请日:2020-01-15
Applicant: Samsung Electronics Co., Ltd.
Inventor: Seungmin Song , Junbeom Park , Bongseok Suh , Junggil Yang
IPC: H01L29/78 , H01L29/66 , H01L29/423 , H01L21/8234 , H01L27/088
Abstract: Integrated circuit devices including a fin shaped active region and methods of forming the same are provided. The devices may include a fin shaped active region, a plurality of semiconductor patterns on the fin shaped active region, a gate electrode on the plurality of semiconductor patterns, and source/drain regions on opposing sides of the gate electrode, respectively. The gate electrode may include a main gate portion extending on an uppermost semiconductor pattern and a sub-gate portion extending between two adjacent ones of the plurality of semiconductor patterns. The sub-gate portion may include a sub-gate center portion and sub-gate edge portions. In a horizontal cross-sectional view, a first width of the sub-gate center portion in a first direction may be less than a second width of one of the sub-gate edge portions in the first direction.
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公开(公告)号:US20210217848A1
公开(公告)日:2021-07-15
申请号:US16943103
申请日:2020-07-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Sangsu Kim , Junbeom Park , Junggil Yang
IPC: H01L29/10 , H01L29/786 , H01L29/423 , H01L29/06 , H01L29/66
Abstract: A semiconductor device including an active pattern on a substrate and extending lengthwise in a first direction parallel to an upper surface of the substrate; a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction; channels spaced apart from each other along a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure along the first direction; a source/drain layer on a portion of the active pattern adjacent to the gate structure in the first direction, the source/drain layer contacting the channels; inner spacers between the gate structure and the source/drain layer, the inner spacers contacting the source/drain layer; and channel connection portions between each of the inner spacers and the gate structure, the channel connection portions connecting the channels with each other.
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