Semiconductor devices
    1.
    发明授权

    公开(公告)号:US11791381B2

    公开(公告)日:2023-10-17

    申请号:US18096663

    申请日:2023-01-13

    CPC classification number: H01L29/0847 H01L27/0886 H01L29/1608 H01L29/7854

    Abstract: A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction parallel to an upper surface of the substrate, a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction, channels spaced apart from each other in a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure, a source/drain layer on a portion of the active pattern adjacent the gate structure, the source/drain layer contacting the channels, and a sacrificial pattern on an upper surface of each of opposite edges of the portion of the active pattern in the second direction, the sacrificial pattern contacting a lower portion of a sidewall of the source/drain layer and including silicon-germanium.

    Semiconductor devices
    3.
    发明授权

    公开(公告)号:US11417776B2

    公开(公告)日:2022-08-16

    申请号:US16715431

    申请日:2019-12-16

    Abstract: A semiconductor device, including a silicon on insulator (SOI) substrate is disclosed. The device may include gate structures formed on the SOI substrate and being spaced apart from each other in a horizontal direction, and a plurality of channels spaced apart from each other in a vertical direction. Each of the channels may extend through each of the gate structures in the horizontal direction. The device may include a seed layer and a source/drain region. The source/drain region may be connected to the channels, and each sidewall of the source/drain region in the horizontal direction may have a concave-convex shape. The device may include a protruding portion of the source/drain region formed between the gate structures that protrudes in the horizontal direction compared to a non-protruding portion of the source/drain region formed between the channels.

    SEMICONDUCTOR DEVICE
    4.
    发明申请

    公开(公告)号:US20250089299A1

    公开(公告)日:2025-03-13

    申请号:US18960679

    申请日:2024-11-26

    Abstract: A semiconductor device includes a first source/drain structure having a first length in a horizontal direction, as viewed in a planar cross-sectional view, the horizontal direction being perpendicular to a vertical direction, a second source/drain structure having a second length in the horizontal direction, as viewed in the planar cross-sectional view, the second length being less than the first length, channels extending between the first source/drain structure and the second source/drain structure, the channels being spaced apart from each other in the vertical direction, at least one sacrificial pattern between adjacent ones of the channels, and a trench penetrating the channels and the at least one sacrificial pattern.

    Semiconductor devices
    5.
    发明授权

    公开(公告)号:US12211942B2

    公开(公告)日:2025-01-28

    申请号:US17398504

    申请日:2021-08-10

    Abstract: A semiconductor device includes a first source/drain, a second source/drain isolated from direct contact with the first source/drain in a horizontal direction, a channel extending between the first source/drain and the second source/drain, a gate surrounding the channel, an upper inner spacer between the gate and the first source/drain and above the channel, and a lower inner spacer between the gate and the first source/drain and under the channel, in which the channel includes a base portion extending between the first source/drain and the second source/drain, an upper protrusion portion protruding upward from a top surface of the base portion, and a lower protrusion portion protruding downward from a bottom surface of the base portion, and a direction in which a top end of the upper protrusion portion is isolated from direct contact with a bottom end of the lower protrusion portion is oblique with respect to a vertical direction.

    Semiconductor devices
    6.
    发明授权

    公开(公告)号:US11557653B2

    公开(公告)日:2023-01-17

    申请号:US17345241

    申请日:2021-06-11

    Abstract: A semiconductor device includes an active pattern on a substrate, the active pattern extending in a first direction parallel to an upper surface of the substrate, a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction, channels spaced apart from each other in a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure, a source/drain layer on a portion of the active pattern adjacent the gate structure, the source/drain layer contacting the channels, and a sacrificial pattern on an upper surface of each of opposite edges of the portion of the active pattern in the second direction, the sacrificial pattern contacting a lower portion of a sidewall of the source/drain layer and including silicon-germanium.

    SEMICONDUCTOR DEVICES
    7.
    发明申请

    公开(公告)号:US20200381562A1

    公开(公告)日:2020-12-03

    申请号:US16715431

    申请日:2019-12-16

    Abstract: A semiconductor device, including a silicon on insulator (SOI) substrate is disclosed. The device may include gate structures formed on the SOI substrate and being spaced apart from each other in a horizontal direction, and a plurality of channels spaced apart from each other in a vertical direction. Each of the channels may extend through each of the gate structures in the horizontal direction. The device may include a seed layer and a source/drain region. The source/drain region may be connected to the channels, and each sidewall of the source/drain region in the horizontal direction may have a concave-convex shape. The device may include a protruding portion of the source/drain region formed between the gate structures that protrudes in the horizontal direction compared to a non-protruding portion of the source/drain region formed between the channels.

    Semiconductor device
    8.
    发明授权

    公开(公告)号:US12183796B2

    公开(公告)日:2024-12-31

    申请号:US17189615

    申请日:2021-03-02

    Abstract: A semiconductor device includes a first source/drain structure having a first length in a horizontal direction, as viewed in a planar cross-sectional view, the horizontal direction being perpendicular to a vertical direction, a second source/drain structure having a second length in the horizontal direction, as viewed in the planar cross-sectional view, the second length being less than the first length, channels extending between the first source/drain structure and the second source/drain structure, the channels being spaced apart from each other in the vertical direction, at least one sacrificial pattern between adjacent ones of the channels, and a trench penetrating the channels and the at least one sacrificial pattern.

    Integrated circuit devices and methods of manufacturing the same

    公开(公告)号:US11227952B2

    公开(公告)日:2022-01-18

    申请号:US16743206

    申请日:2020-01-15

    Abstract: Integrated circuit devices including a fin shaped active region and methods of forming the same are provided. The devices may include a fin shaped active region, a plurality of semiconductor patterns on the fin shaped active region, a gate electrode on the plurality of semiconductor patterns, and source/drain regions on opposing sides of the gate electrode, respectively. The gate electrode may include a main gate portion extending on an uppermost semiconductor pattern and a sub-gate portion extending between two adjacent ones of the plurality of semiconductor patterns. The sub-gate portion may include a sub-gate center portion and sub-gate edge portions. In a horizontal cross-sectional view, a first width of the sub-gate center portion in a first direction may be less than a second width of one of the sub-gate edge portions in the first direction.

    SEMICONDUCTOR DEVICES
    10.
    发明申请

    公开(公告)号:US20210217848A1

    公开(公告)日:2021-07-15

    申请号:US16943103

    申请日:2020-07-30

    Abstract: A semiconductor device including an active pattern on a substrate and extending lengthwise in a first direction parallel to an upper surface of the substrate; a gate structure on the active pattern, the gate structure extending in a second direction parallel to the upper surface of the substrate and crossing the first direction; channels spaced apart from each other along a third direction perpendicular to the upper surface of the substrate, each of the channels extending through the gate structure along the first direction; a source/drain layer on a portion of the active pattern adjacent to the gate structure in the first direction, the source/drain layer contacting the channels; inner spacers between the gate structure and the source/drain layer, the inner spacers contacting the source/drain layer; and channel connection portions between each of the inner spacers and the gate structure, the channel connection portions connecting the channels with each other.

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