公开(公告)号：US09793424B2

公开(公告)日：2017-10-17

申请号：US14705278

申请日：2015-05-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Keun-yeong Cho ,  Ho-chul Ji

IPC: H01L31/0232 ,  H01L27/146 ,  H01L31/0216 ,  H01L31/105 ,  H01L31/0352 ,  G02B6/42

CPC classification number: H01L31/02327 ,  G02B6/124 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4209 ,  H01L27/14607 ,  H01L27/14627 ,  H01L27/14629 ,  H01L31/02161 ,  H01L31/035281 ,  H01L31/105

Abstract: A photoelectric conversion device includes a substrate having a first surface and a second surface that is an opposite side of the first surface, wherein one of the first and second surfaces is a light incidence surface, a photodiode (PD) formed in the first surface of the substrate, a reflective layer formed on one of the first and second surfaces of the substrate, which is the opposite side of the light incidence surface, and a microlens formed on the light incidence surface of the substrate.

公开(公告)号：US09939596B2

公开(公告)日：2018-04-10

申请号：US15257038

申请日：2016-09-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Ho-chul Ji ,  Keun-yeong Cho ,  In-sung Joe

IPC: G02B6/42 ,  G02B6/12

CPC classification number: G02B6/4251 ,  G02B6/12004 ,  G02B6/34 ,  G02B6/4214 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4292 ,  H01L2224/16225

Abstract: An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.

公开(公告)号：US11747556B2

公开(公告)日：2023-09-05

申请号：US17706443

申请日：2022-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-hye Kim ,  Keun-yeong Cho ,  Ho-chul Ji

IPC: G02B6/12 ,  G02B6/124

CPC classification number: G02B6/12004 ,  G02B6/124 ,  G02B2006/12061 ,  G02B2006/12107 ,  G02B2006/12121 ,  G02B2006/12123

Abstract: An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.

公开(公告)号：US20220221646A1

公开(公告)日：2022-07-14

申请号：US17706443

申请日：2022-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-hye Kim ,  Keun-yeong Cho ,  Ho-chul Ji

IPC: G02B6/12 ,  G02B6/124

Abstract: An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.

公开(公告)号：US11287570B2

公开(公告)日：2022-03-29

申请号：US16565076

申请日：2019-09-09

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jung-hye Kim ,  Keun-yeong Cho ,  Ho-chul Ji

IPC: G02B6/12 ,  G02B6/124

Abstract: An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.