-
公开(公告)号：US09939596B2
公开(公告)日：2018-04-10
申请号：US15257038
申请日：2016-09-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ho-chul Ji , Keun-yeong Cho , In-sung Joe
CPC classification number: G02B6/4251 , G02B6/12004 , G02B6/34 , G02B6/4214 , G02B6/4269 , G02B6/4281 , G02B6/4292 , H01L2224/16225
Abstract: An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.
-
公开(公告)号：US20170123173A1
公开(公告)日：2017-05-04
申请号：US15257038
申请日：2016-09-06
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ho-chul Ji , Keun-yeong CHO , In-sung JOE
CPC classification number: G02B6/4251 , G02B6/12004 , G02B6/34 , G02B6/4214 , G02B6/4269 , G02B6/4281 , G02B6/4292 , H01L2224/16225
Abstract: An optical integrated circuit (IC) package includes an optical IC including an optical IC substrate, an optical IC including an optical IC substrate, an electrical integrated circuit device (EICD) on the optical IC substrate, at least one optical device spaced apart from the EICD on the optical IC substrate, an optical interface on a first side of the optical IC substrate, an electrical interface located on a second side of the optical IC substrate, and an encapsulation member configured to encapsulate the optical IC, the EICD, the at least one optical device, the optical interface, and the electrical interface.
-
公开(公告)号：US08929693B2
公开(公告)日：2015-01-06
申请号：US13787918
申请日：2013-03-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Dong-jae Shin , Hyun-il Byun , Kwang-hyun Lee , Kwan-sik Cho , Ho-chul Ji , Jung-hyung Pyo , Kyoung-ho Ha
CPC classification number: G02B6/12 , G02B6/4207 , G02B6/4214 , G02B6/428 , G02B6/43 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311
Abstract: A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection.
Abstract translation: 一种半导体封装和包括该半导体封装的半导体器件。 半导体封装包括：封装衬底; 多个连接元件，其设置在所述封装基板上; 以及半导体芯片，其包括至少一个光输入/输出元件，所述至少一个光输入/输出元件相对于垂直于所述封装基板的底面的方向以光输入/输出角度向/从外部发送/接收光信号，并且是 通过多个连接电连接到封装衬底。
-
公开(公告)号：US11747556B2
公开(公告)日：2023-09-05
申请号：US17706443
申请日：2022-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-hye Kim , Keun-yeong Cho , Ho-chul Ji
CPC classification number: G02B6/12004 , G02B6/124 , G02B2006/12061 , G02B2006/12107 , G02B2006/12121 , G02B2006/12123
Abstract: An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.
-
Patent Agency Ranking
公开(公告)号：US20220221646A1
公开(公告)日：2022-07-14
申请号：US17706443
申请日：2022-03-28
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-hye Kim , Keun-yeong Cho , Ho-chul Ji
Abstract: An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.
-
公开(公告)号：US11287570B2
公开(公告)日：2022-03-29
申请号：US16565076
申请日：2019-09-09
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jung-hye Kim , Keun-yeong Cho , Ho-chul Ji
Abstract: An integrated circuit (IC) device includes an optical IC substrate, a local trench inside the optical IC substrate, and a photoelectronic element including a photoelectric conversion layer buried inside the local trench. The photoelectric conversion layer is buried inside the local trench in the optical IC substrate to form the photoelectronic element. Thus, the IC device may inhibit warpage of the optical IC substrate.
-
公开(公告)号：US09793424B2
公开(公告)日：2017-10-17
申请号：US14705278
申请日：2015-05-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Keun-yeong Cho , Ho-chul Ji
IPC: H01L31/0232 , H01L27/146 , H01L31/0216 , H01L31/105 , H01L31/0352 , G02B6/42
CPC classification number: H01L31/02327 , G02B6/124 , G02B6/42 , G02B6/4206 , G02B6/4209 , H01L27/14607 , H01L27/14627 , H01L27/14629 , H01L31/02161 , H01L31/035281 , H01L31/105
Abstract: A photoelectric conversion device includes a substrate having a first surface and a second surface that is an opposite side of the first surface, wherein one of the first and second surfaces is a light incidence surface, a photodiode (PD) formed in the first surface of the substrate, a reflective layer formed on one of the first and second surfaces of the substrate, which is the opposite side of the light incidence surface, and a microlens formed on the light incidence surface of the substrate.
-
公开(公告)号：US09070815B2
公开(公告)日：2015-06-30
申请号：US13924487
申请日：2013-06-21
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Kwang-hyun Lee , Dong-jae Shin , Ho-chul Ji
IPC: G02F1/01 , G02B26/00 , G02F1/03 , G02B26/08 , G02F1/035 , G02F1/295 , H01L31/105 , G02F1/015 , G02F1/025 , G02F1/225
CPC classification number: H01L31/105 , G02F1/015 , G02F1/025 , G02F1/2257
Abstract: A photonic device is provided. The photonic device includes: a semiconductor layer including first and second regions; an insulating layer covering the semiconductor layer; and first and second plugs extending to pass through the insulating layer and electrically connected to the corresponding first and second regions. The first plug is in a rectifying contact with the first region, and the second plug is in an ohmic contact with the second region.
Abstract translation: 提供了光子器件。 光子器件包括：包括第一和第二区域的半导体层; 覆盖半导体层的绝缘层; 并且第一和第二插塞延伸以穿过绝缘层并电连接到相应的第一和第二区域。 第一插头与第一区域整流接触，第二插头与第二区域欧姆接触。
-
公开(公告)号：US20130330035A1
公开(公告)日：2013-12-12
申请号：US13787918
申请日：2013-03-07
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dong-Jae Shin , Hyun-il Byun , Kwang-hyun Lee , Kwan-sik Cho , Ho-chul Ji , Jung-hyung Pyo , Kyoung-ho Ha
IPC: G02B6/12
CPC classification number: G02B6/12 , G02B6/4207 , G02B6/4214 , G02B6/428 , G02B6/43 , H01L2224/16225 , H01L2924/15174 , H01L2924/15311
Abstract: A semiconductor package and a semiconductor device including the same. The semiconductor package includes: a package substrate; a plurality of connection elements that are disposed on the package substrate; and a semiconductor chip that includes at least one optical input/output element that transmits/receives an optical signal to/from the outside at an optical input/output angle with respect to a direction perpendicular to a bottom surface of the package substrate, and is electrically connected to the package substrate through the plurality of connection
Abstract translation: 一种半导体封装和包括该半导体封装的半导体器件。 半导体封装包括：封装衬底; 多个连接元件，其设置在所述封装基板上; 以及半导体芯片，其包括至少一个光输入/输出元件，所述至少一个光输入/输出元件相对于垂直于所述封装基板的底面的方向以光输入/输出角度向/从外部发送/接收光信号，并且是 通过多个连接电连接到封装衬底
-
-
-
-
-
-
-
-
Search Results
9
records
(took 0.017 seconds)
