公开(公告)号：US11953983B2

公开(公告)日：2024-04-09

申请号：US17885216

申请日：2022-08-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byungchul Kim ,  Kiseok Kim ,  Mingyu Kim ,  Jaemin Oh ,  Sanghyun Lee

IPC: G06F11/00 ,  G06F9/4401 ,  G06F11/07

CPC classification number: G06F11/0793 ,  G06F9/441 ,  G06F11/073

Abstract: The present disclosure refers to apparatuses and methods for initializing electronic devices. An electronic device according to various embodiments includes a memory, and a processor operatively connected to the memory. The processor is configured to record, in the memory, software binaries received from an external device during a download mode. The processor is further configured to, when the download mode has ended, perform booting in a normal mode using a bootloader based on a determination indicating that a predetermined software binary is present among the software binaries recorded in the memory, and perform booting in a recovery mode using the bootloader based on the determination indicating that the predetermined software binary is absent from among the software binaries recorded in the memory.

公开(公告)号：US20250132202A1

公开(公告)日：2025-04-24

申请号：US18816416

申请日：2024-08-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seokkyu Lee ,  Wonbin Shin ,  Kiseok Kim ,  Jihye Shim ,  Jeonggi Jin

IPC: H01L21/768

Abstract: A method of manufacturing a semiconductor package with a semiconductor chip including an active surface and an inactive surface opposite to the active surface is presented. The method includes attaching, to the active surface, a film structure including an insulating layer and a first seed layer contacting the insulating layer. A via hole is formed by penetrating the insulating layer and the first seed layer followed by a descumming the insulating layer and the first seed layer in which the via hole is formed. A second seed layer is formed on the insulating layer and on the first seed layer on which the descum process was performed. A photoresist pattern on the second seed layer enables forming a conductive via by filling both a space defined by the via hole with a conductive material and by filling a space defined by the photoresist pattern with the conductive material.

公开(公告)号：US20240194582A1

公开(公告)日：2024-06-13

申请号：US18523970

申请日：2023-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seokkyu Lee ,  Jihye Shim ,  Kiseok Kim ,  Wonbin Shin

IPC: H01L23/498 ,  H01L23/31

CPC classification number: H01L23/49894 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/08 ,  H01L2224/08235

Abstract: A semiconductor package includes a redistribution substrate having a first surface and a second surface opposite to each other, and including a plurality of first photosensitive insulating layers and a plurality of redistribution layers disposed among the plurality of first photosensitive insulating layers; at least one semiconductor chip disposed on the first surface of the redistribution substrate and including a plurality of contact pads electrically connected to the plurality of redistribution layers; a protective insulating layer including a second photosensitive insulating layer disposed on the second surface of the redistribution substrate and having a plurality of contact holes, and a non-photosensitive insulating layer disposed on an outer surface of the second photosensitive insulating layer and an internal sidewall of each of the plurality of contact holes; and a plurality of under bump metallurgy (UBM) connectors each having a UBM pad disposed on the protective insulating layer and a UBM via disposed in a respective contact hole of the plurality of contact holes and electrically connected to the plurality of redistribution layers.

公开(公告)号：US20250167153A1

公开(公告)日：2025-05-22

申请号：US18932984

申请日：2024-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Okseon Yoon ,  Jinyoung Kim ,  Jiyoung Yoon ,  Kiseok Kim ,  Jihye Shim

IPC: H01L23/00 ,  G03F7/028

Abstract: A method of forming a redistribution pad, the method including forming a hole exposing a redistribution pattern in a redistribution insulating layer and forming a photoresist composition on a surface of the redistribution insulating layer and filling the hole. The photoresist composition including at least one first photoinitiator and at least one first crosslinking agent that cause a crosslinking reaction by a first light and at least one second photoinitiator and at least one second crosslinking agent that cause a crosslinking reaction by a second light having a different wavelength from the first light. The method further includes irradiating the first light to the photoresist composition, forming a photoresist pattern having a pattern hole using the photoresist composition to which the first light is irradiated, irradiating the second light to the photoresist pattern, and forming the redistribution pad using the photoresist pattern to which the second light is irradiated.

公开(公告)号：US20250125205A1

公开(公告)日：2025-04-17

申请号：US18674416

申请日：2024-05-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinwoo Park ,  Kiseok Kim ,  Jinyoung Kim ,  Jihye Shim

IPC: H01L23/29 ,  H01L23/00 ,  H01L23/31 ,  H01L23/48

Abstract: A semiconductor package includes a first semiconductor chip including first pads, a second semiconductor chip including second pads in contact with the first pads, and through-electrodes electrically connected to the second pads and extending to a rear surface opposite to the front surface, a dielectric layer covering at least portions of the respective first and second semiconductor chips and having an inner surface facing the first and second semiconductor chips and an outer surface opposite the inner surface, and bump structures on a portion of the outer surface of the dielectric layer and electrically connected to the through-electrodes. The dielectric layer includes inorganic particles, and polymer chains bonded to at least one sides of the respective inorganic particles and connected toward the inner surface and the outer surface via the inorganic particles.