Nonvolatile memory device and method of operating the same

    公开(公告)号:US12131789B2

    公开(公告)日:2024-10-29

    申请号:US17847545

    申请日:2022-06-23

    摘要: Aggressor memory cells connected to one or more aggressor wordlines are grouped into aggressor cell groups by performing a read operation with respect to the aggressor wordlines based on one or more grouping read voltages, where the aggressor wordlines are adjacent to a selected wordline corresponding to a read address among wordlines of a memory block. Selected memory cells connected to the selected wordline are grouped into a selected cell groups respectively corresponding to the aggressor cell groups. Group read conditions respectively corresponding to the selected cell groups are determined and group read operations are performed with respect to the plurality of selected cell groups based on the group read conditions. The read errors are reduced by grouping the selected memory cells into the selected cell groups according to the change of operation environments.

    Memory controller, memory device and storage device

    公开(公告)号:US11556415B2

    公开(公告)日:2023-01-17

    申请号:US17397321

    申请日:2021-08-09

    摘要: A memory device may determine cell count information from a threshold voltage distribution of memory cells and may determine a detection case based on the cell count information when an error in read data, received from the memory device performing a read operation is not corrected. A memory controller may control the memory device to execute a read operation using a development time determined in consideration of an offset voltage of a read voltage corresponding to the detection case. When an error in the read data is successfully corrected, the memory controller may update a table, stored in the memory controller, using a dynamic offset voltage obtained by inputting the cell count information to a machine learning model.

    Memory device and operating method of memory device

    公开(公告)号:US11475948B2

    公开(公告)日:2022-10-18

    申请号:US16999189

    申请日:2020-08-21

    IPC分类号: G11C11/00 G11C13/00 G11C11/56

    摘要: A memory device and a method of operating the same. The memory device includes a memory cell array including a plurality of memory cells disposed in an area where a plurality of word lines and a plurality of bit lines cross each other; a row decoder including row switches and configured to perform a selection operation on the plurality of word lines; a column decoder including column switches and configured to perform a selection operation on the plurality of bit lines; and a control logic configured to control, in a data read operation, a precharge operation to be performed on a selected word line in a word line precharge period, and to control a precharge operation to be performed on a selected bit line in a bit line precharge period; wherein a row switch connected to the selected word line is weakly turned on in the bit line precharge period.

    Electronic device and operation method thereof

    公开(公告)号:US10739992B2

    公开(公告)日:2020-08-11

    申请号:US14812346

    申请日:2015-07-29

    摘要: An electronic device and an operation method thereof are provided. The method includes displaying information on a touch screen of the electronic device by operating a first application, displaying user interface of a second application, detecting an input through the user interface, displaying at least one recommendation object corresponding to the input among the information on the touch screen, at least partly in response to the input, receiving an input of selecting at least one of the at least one recommendation object, and displaying the recommendation object on the user interface, in response to the selecting input.

    SEMICONDUCTOR PACKAGE HAVING REDISTRIBUTION STRUCTURE

    公开(公告)号:US20230154841A1

    公开(公告)日:2023-05-18

    申请号:US17823634

    申请日:2022-08-31

    IPC分类号: H01L23/498 H01L25/18

    摘要: A semiconductor package includes: a redistribution structure including a plurality of redistribution insulation layers, which are stacked, a plurality of redistribution line patterns on an upper surface and a lower surface of the plurality of redistribution insulation layers, and constituting a plurality of distribution layers at different vertical levels from each other, and a plurality of redistribution vias that penetrate at least one redistribution insulation layer of the plurality of redistribution insulation layers and are connected to some of the plurality of redistribution line patterns; and at least one semiconductor chip on the redistribution structure and electrically connected to the plurality of redistribution line patterns and the plurality of redistribution vias.