公开(公告)号：US20160293379A1

公开(公告)日：2016-10-06

申请号：US15084059

申请日：2016-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Souk Kim ,  Chung-sam Jun ,  Woo-seok Ko ,  Sang-Kil Lee ,  Kwang-il Shin ,  Yu-sin Yang ,  Min-chul Yoon

IPC: H01J37/22 ,  H01J37/20

CPC classification number: H01J37/222 ,  H01J37/20 ,  H01J37/28 ,  H01J2237/20214 ,  H01J2237/226 ,  H01J2237/2817

Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.

Abstract translation: 检查晶片的方法可以包括：将晶片装载到台上，所述晶片在其上具有多个管芯; 晶片的定位使得晶片上的多个电子束列分别面对晶片上的多个管芯中的每一个的部分区域; 通过使用电子束柱扫描多个管芯中的每一个的各个部分区域; 以及组合通过扫描所述部分区域获得的多个部分图像以提供管芯图像。

公开(公告)号：US10373796B2

公开(公告)日：2019-08-06

申请号：US15084059

申请日：2016-03-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Souk Kim ,  Chung-sam Jun ,  Woo-seok Ko ,  Sang-kil Lee ,  Kwang-il Shin ,  Yu-sin Yang ,  Min-chul Yoon

IPC: H01J37/20 ,  H01J37/22 ,  H01J37/28

Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.