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公开(公告)号:US20180309052A1
公开(公告)日:2018-10-25
申请号:US16018700
申请日:2018-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Shinhee HAN , Kiseok SUH , KyungTae NAM , Woojin KIM , Kwangil SHIN , Minkyoung JOO , Gwanhyeob KOH
CPC classification number: H01L43/12 , G11C11/161 , G11C11/1657 , G11C11/1659 , G11C11/1673 , G11C11/1675 , H01L27/226 , H01L27/228 , H01L43/02 , H01L43/08 , H01L43/10
Abstract: A method of fabricating a magnetic memory device includes forming an interlayered insulating layer on a substrate, forming a landing pad to pass through the interlayered insulating layer, forming a protection insulating layer on the interlayered insulating layer to cover a top surface of the landing pad, forming a bottom electrode to pass through the protection insulating layer and through the interlayered insulating layer, forming a magnetic tunnel junction layer on the protection insulating layer; and patterning the magnetic tunnel junction layer to form a magnetic tunnel junction pattern on the bottom electrode.
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公开(公告)号:US20240324240A1
公开(公告)日:2024-09-26
申请号:US18478318
申请日:2023-09-29
Applicant: Samsung Electronics Co., Ltd.
Inventor: Hyungjong JEONG , Seung Pil KO , Kyounghun RYU , Byoungjae BAE , Kwangil SHIN
Abstract: A magnetic memory device may include a substrate, a lower interconnection line on the substrate, a data storage structure on the lower interconnection line, and a lower contact plug between the lower interconnection line and the data storage structure and extended in a first direction perpendicular to a top surface of the substrate to connect the lower interconnection line to the data storage structure. An upper portion of the lower contact plug may have a first width in a second direction parallel to the top surface of the substrate, and a lower portion of the lower contact plug may have a second width in the second direction. The first width may be larger than the second width.
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