公开(公告)号：US20230268276A1

公开(公告)日：2023-08-24

申请号：US18061642

申请日：2022-12-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Hoon AHN ,  Kyung Seok OH ,  Seung-Heon LEE ,  Jun Hyuk LIM

IPC: H01L23/532 ,  H01L21/768 ,  H01L23/522

CPC classification number: H01L23/53295 ,  H01L21/76877 ,  H01L23/53223 ,  H01L23/5226 ,  H01L21/76826 ,  H01L21/7682 ,  H01L2221/1047

Abstract: There is provided a semiconductor device capable of improving the performance and reliability of a device. The semiconductor device may include a first interlayer insulating film containing therein a plurality of pores, a first line structure in the first interlayer insulating film, an inserted insulating film extending along and on a upper surface of the first interlayer insulating film and in contact with the first interlayer insulating film, a barrier insulating film in contact with the inserted insulating film and extending along an upper surface of the inserted insulating film and an upper surface of the first line structure, a second interlayer insulating film on the barrier insulating film and a second line structure disposed in the second interlayer insulating film and connected to the first line structure.

公开(公告)号：US20160267895A1

公开(公告)日：2016-09-15

申请号：US15066655

申请日：2016-03-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dae Young JEON ,  Yeon Su KIM ,  Yeong Min KIM ,  Jung Min PARK ,  Kyung Seok OH

IPC: G10H3/18 ,  G10H1/32 ,  G10H3/12

CPC classification number: G10H3/181 ,  G10H1/0016 ,  G10H1/32 ,  G10H3/125 ,  G10H3/146 ,  G10H2210/091 ,  G10H2220/121 ,  G10H2220/165 ,  G10H2220/365 ,  G10H2220/395 ,  G10H2220/401 ,  G10H2220/415 ,  G10H2220/441 ,  G10H2220/455 ,  G10H2220/525 ,  G10H2230/015

Abstract: An electronic device is provided. The electronic device includes an image sensor configured to sense a motion of a bow to the string instrument, a vibration sensor configured to sense a vibration generated by the string instrument, and a control module configured to determine a fingering position of a user with respect to the string instrument using the motion of the bow and the vibration.

Abstract translation: 提供电子设备。 该电子设备包括图像传感器，该图像传感器被配置为感测弓到弦乐器的运动，被配置为感测弦乐器产生的振动的振动传感器以及被配置为确定用户相对于 弦乐器使用弓的运动和振动。

公开(公告)号：US20150109803A1

公开(公告)日：2015-04-23

申请号：US14490475

申请日：2014-09-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Myoung Bo PARK ,  Kyung Seok OH ,  Ho Young SONG

IPC: H01L33/38 ,  F21K99/00 ,  F21V23/00 ,  H01L33/40 ,  H01L33/42

CPC classification number: H01L33/38 ,  H01L33/405 ,  H01L33/42 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor LED package includes a package body having first and second electrode structures and an LED chip connected to at least one of the first and second electrode structures using a wire. The LED chip includes a light emitting structure and first and second electrode parts. At least one of the first and second electrode parts includes a bonding electrode layer made of a material having the same composition as a material of the wire and bonded to the wire, and an uneven electrode layer disposed on the bonding electrode layer and having at least one through hole filled with the wire. The at least one through hole allows a top surface of the bonding electrode layer to be exposed therebelow.

Abstract translation: 半导体LED封装包括具有第一和第二电极结构的封装体和使用导线连接到第一和第二电极结构中的至少一个的LED芯片。 LED芯片包括发光结构和第一和第二电极部分。 第一电极部分和第二电极部分中的至少一个包括由与导线的材料组成相同的材料制成的接合电极层，并且接合到导线上，以及不平坦电极层，设置在接合电极层上并且至少具有 一个充满电线的通孔。 至少一个通孔允许接合电极层的顶表面暴露在其下面。