公开(公告)号：US20230290121A1

公开(公告)日：2023-09-14

申请号：US18319089

申请日：2023-05-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Mijin PARK ,  Moohyun KIM ,  Jihyun YEON ,  Jongwon LEE

IPC: G06V10/764 ,  G06V20/52 ,  G06V20/40 ,  G06V10/44 ,  G06T3/40

CPC classification number: G06V10/764 ,  G06V20/52 ,  G06V20/44 ,  G06V10/443 ,  G06T3/40

Abstract: An electronic device is provided. The electronic device includes a communication circuit configured to transmit and receive data to and from an external device, a memory, and a processor, wherein the processor may store a user pattern in the memory based on first sensing information detected during a first time period by at least one of an external camera device or an external Internet of things (IoT) device, detect occurrence of an irregular event based on second sensing information detected during a second time period by the external camera device or the external IoT device and the stored user pattern, match the irregular event that occurs with a plurality of images photographed by the external camera device, and determine priorities of the plurality of images based on a matching result.

公开(公告)号：US20240324218A1

公开(公告)日：2024-09-26

申请号：US18601245

申请日：2024-03-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jehong OH ,  Younghwan JO ,  Seulye KIM ,  Moohyun KIM ,  Sunggil KIM

IPC: H10B43/27 ,  H10B41/27 ,  H10B41/35 ,  H10B41/41 ,  H10B43/35 ,  H10B43/40

CPC classification number: H10B43/27 ,  H10B41/27 ,  H10B41/35 ,  H10B41/41 ,  H10B43/35 ,  H10B43/40

Abstract: A non-volatile memory device includes a substrate including a memory cell region and a connection region, a mold structure including a plurality of gate electrodes sequentially stacked on the memory cell region and stacked stepwise on the connection region, and a plurality of mold insulating layers alternately stacked with the plurality of gate electrodes, a channel hole vertically passing through the mold structure on the memory cell region, and a channel structure disposed in the channel hole, wherein the channel structure includes a gate insulating layer, a channel layer, and a buried insulating layer sequentially disposed in the channel hole, and the channel layer includes a grain having a size of about 20 nm to about 17 μm.

公开(公告)号：US20240206174A1

公开(公告)日：2024-06-20

申请号：US18498696

申请日：2023-10-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seulye KIM ,  Sunhwa LIM ,  Moohyun KIM ,  Sunggil KIM ,  Yunji PARK ,  Younghwan JO

IPC: H10B43/27 ,  H01L25/065 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B43/10 ,  H10B43/35 ,  H10B80/00

CPC classification number: H10B43/27 ,  H01L25/0652 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B43/10 ,  H10B43/35 ,  H10B80/00 ,  H01L2225/06524

Abstract: A semiconductor device may include a gate stack including insulating and conductive patterns, which are alternately stacked on top of each other, a memory channel structure penetrating the gate stack, a selection line structure on the gate stack, and a selection channel structure penetrating the selection line structure. The selection channel structure may include a selection channel layer, which is electrically connected to the memory channel layer, and a selection insulating structure, which encloses the selection channel layer. The selection channel layer may include a connecting portion on the memory channel structure and a pillar portion on the connecting portion, and an average size of grains in the connecting portion may be less than an average size of grains in the pillar portion.

公开(公告)号：US20230141055A1

公开(公告)日：2023-05-11

申请号：US18093586

申请日：2023-01-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Moohyun KIM ,  Jongwon LEE ,  Gajin SONG ,  Sunkee LEE

IPC: G06F9/50 ,  G06F11/30

CPC classification number: G06F9/5072 ,  G06F11/3006

Abstract: An electronic device may include a communication module, a memory, and a processor operatively connected to the communication module and the memory, wherein the processor is configured to: transmit device information of the electronic device to an external server using the communication module; receive, from the external server, first recommendation information including a list of at least one external device which can be connected to the electronic device through edge computing; request transmission of operation state information from the at least one external device included in the first recommendation information; acquire the operation state information of the at least one external device; and, based on the operation state information of the at least one external device, acquire second recommendation information including a list of at least one external device to be connected through edge computing.