公开(公告)号：US20240072020A1

公开(公告)日：2024-02-29

申请号：US18188627

申请日：2023-03-23

申请人： Samsung Electronics Co., Ltd.

发明人： JAE CHOON KIM ,  Hwanjoo PARK ,  Sunggu KANG ,  SUNG-HO MUN

IPC分类号： H01L25/10 ,  H10B80/00 ,  H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L23/00

CPC分类号： H01L25/105 ,  H10B80/00 ,  H01L23/3157 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/5386 ,  H01L23/49822 ,  H01L24/08 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/08112 ,  H01L2224/16227 ,  H01L2224/48221 ,  H01L2924/1436 ,  H01L2924/1432 ,  H01L2225/1058

摘要： A semiconductor package may include a lower structure, a first semiconductor chip on the lower structure, the first semiconductor chip including a hot spot, a second semiconductor chip horizontally spaced apart from the first semiconductor chip on the lower structure, and a connection chip in the lower structure and connecting the first and second semiconductor chips to each other. The hot spot may vertically overlap the connection chip.

公开(公告)号：US20240321669A1

公开(公告)日：2024-09-26

申请号：US18380854

申请日：2023-10-17

申请人： Samsung Electronics Co., Ltd.

发明人： Sunggu Kang ,  JAE CHOON KIM ,  SUNG-HO MUN ,  Hwanjoo Park

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10 ,  H10B80/00

CPC分类号： H01L23/367 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L24/32 ,  H01L25/0657 ,  H01L25/105 ,  H10B80/00 ,  H01L24/16 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/32245

摘要： A semiconductor package includes a substrate, a semiconductor die on the substrate, a heat spreader covering the semiconductor die. The heat spreader includes an upper plate portion, a base portion, and a sidewall portion connecting the upper plate portion to the base portion. The upper plate portion and the sidewall portion define an underlying cavity. The base portion is disposed on the substrate, extends from an exterior side of the sidewall portion in a horizontal direction, includes a plurality of first through holes, has a bottom surface at the same level as a bottom surface of the sidewall portion, and has a height in a vertical direction from a lowermost portion to an uppermost portion thereof less than or equal to that of the sidewall portion.