Abstract:
A semiconductor memory package includes a base layer that communicates with a memory controller; at least one memory layer that is stacked on the base layer; and at least one through silicon via that penetrates through the at least one memory layer, wherein at least one signal bump for exchanging a signal with the memory controller is disposed in a first area of the base layer located to be adjacent to the memory controller, and wherein the first area corresponds to an edge area of the base layer, and a power bump for receiving power from outside of the semiconductor memory package for performing a signal processing operation on the signal is disposed in a second area of the base layer contacting the at least one through silicon via, wherein the second area corresponds to an area other than edge areas of the base layer.
Abstract:
A phase-rotating phase locked loop (PLL) may include first and second loops that share a loop filter and a voltage controlled oscillator in order to perform the operation of a phase-rotating PLL, the first and second loops configured to activate in response to an enable signal. The PLL may further include a phase frequency detection controller configured to provide the enable signal to the first and second loops in response to a transition of a coarse signal that may be applied as a digital code.
Abstract:
A phase-rotating phase locked loop (PLL) may include first and second loops that share a loop filter and a voltage controlled oscillator in order to perform the operation of a phase-rotating PLL, the first and second loops configured to activate in response to an enable signal. The PLL may further include a phase frequency detection controller configured to provide the enable signal to the first and second loops in response to a transition of a coarse signal that may be applied as a digital code.
Abstract:
A semiconductor memory package includes a base layer that communicates with a memory controller; at least one memory layer that is stacked on the base layer; and at least one through silicon via that penetrates through the at least one memory layer, wherein at least one signal bump for exchanging a signal with the memory controller is disposed in a first area of the base layer located to be adjacent to the memory controller, and wherein the first area corresponds to an edge area of the base layer, and a power bump for receiving power from outside of the semiconductor memory package for performing a signal processing operation on the signal is disposed in a second area of the base layer contacting the at least one through silicon via, wherein the second area corresponds to an area other than edge areas of the base layer.