公开(公告)号：US20150137285A1

公开(公告)日：2015-05-21

申请号：US14286460

申请日：2014-05-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik SHIM ,  Seog-woo HONG ,  Seok-whan CHUNG ,  Chang-jung KIM

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B06B1/0292 ,  B81C1/00301

Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.

Abstract translation: 提供了一种电容微加工超声波换能器及其制造方法。 电容微加工超声波换能器包括：器件基板，其包括限定对应于元件的多个第一部分的第一沟槽和与第一沟槽间隔开的第二沟槽; 设置在所述装置基板上的支撑单元，所述支撑单元限定多个空腔; 设置在所述支撑单元上以覆盖所述多个空腔的膜; 顶部电极，其通过穿过所述膜的通孔和所述支撑单元电连接到所述第二沟槽中的第二部分; 以及设置在器件基板的底面上的贯穿硅通孔（TSV）基板，所述TSV基板包括连接到与所述元件相对应的所述多个第一部分的第一通孔金属和连接到所述第二部分的第二通孔金属。

公开(公告)号：US20150112181A1

公开(公告)日：2015-04-23

申请号：US14249509

申请日：2014-04-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yong-seop YOON ,  Sung-chan KANG ,  Jong-seok KIM ,  Sang-ha PARK ,  Seok-whan CHUNG

IPC: A61B5/00

CPC classification number: A61B5/0095 ,  A61B8/4477 ,  A61B8/5246

Abstract: Provided are a wideband ultrasonic probe for a photoacoustic image and an ultrasound image. The wideband ultrasonic probe includes a first ultrasonic transducer array and a second ultrasonic transducer array that are disposed on a substrate; and a laser apparatus that comprises a laser irradiator configured to irradiate a laser light onto a diagnosis object, wherein the first ultrasonic transducer array receives a first ultrasonic wave which is generated from the diagnosis object on which the laser light is irradiated, and the second ultrasonic transducer array transmits a high frequency bandwidth ultrasonic wave toward the diagnosis object and receives a second ultrasonic wave that is reflected by the diagnosis object.

Abstract translation: 提供了一种用于光声图像和超声图像的宽带超声波探头。 宽带超声波探头包括设置在基板上的第一超声换能器阵列和第二超声换能器阵列; 以及激光装置，其包括被配置为将激光照射到诊断对象上的激光照射器，其中，所述第一超声波换能器阵列接收从其上照射所述激光的诊断对象产生的第一超声波，以及所述第二超声波 换能器阵列向诊断对象发送高频带宽超声波，并接收被诊断对象反射的第二超声波。

公开(公告)号：US20150230029A1

公开(公告)日：2015-08-13

申请号：US14317135

申请日：2014-06-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seog-woo HONG ,  Hyung-jae SHIN ,  Dong-sik SHIM ,  Byung-gil JEONG ,  Seok-whan CHUNG

IPC: H04R23/00

CPC classification number: H04R23/00 ,  B06B1/0292 ,  B06B1/0685 ,  G10K11/002 ,  H04R2201/003

Abstract: An electro-acoustic transducer includes a conductive substrate provided with at least one cell and at least one electrode, and a pad substrate disposed corresponding to the conductive substrate and provided with at least one pad corresponding to the electrode, in which at least one of the electrode and the pad includes an electric pattern for electric connection and at least one dummy pattern that is provided around the electric pattern to be separated the electric pattern.

Abstract translation: 一种电声换能器包括设置有至少一个电池和至少一个电极的导电衬底以及与该导电衬底相对设置并且设置有至少一个对应于该电极的焊盘的焊盘衬底，其中至少一个电极 电极和焊盘包括用于电连接的电图案和设置在电图案周围以分离电图案的至少一个虚设图案。

公开(公告)号：US20140061826A1

公开(公告)日：2014-03-06

申请号：US14012350

申请日：2013-08-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seog-woo HONG ,  Dong-kyun KIM ,  Byung-gil JEONG ,  Seok-whan CHUNG

IPC: B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0027 ,  A61B8/4483 ,  B06B1/0292 ,  B06B2201/76 ,  B81C1/00158

Abstract: An ultrasonic transducer and a method of manufacturing the same are disclosed. The ultrasonic transducer includes a first electrode layer which is disposed to cover a conductive substrate and an inner wall and a top of a via hole penetrating a membrane and has a top surface at a same height as a top surface of the membrane; a second electrode layer which is disposed on a bottom surface of the conductive substrate to be spaced apart from the first electrode layer; and a top electrode which is disposed on the top surface of the membrane and which contacts the top surface of the first electrode layer.

Abstract translation: 公开了一种超声换能器及其制造方法。 超声波换能器包括：第一电极层，其设置成覆盖导电基底;内壁和通孔的顶部穿透膜，并且具有与膜的顶表面相同高度的顶表面; 第二电极层，设置在与第一电极层间隔开的导电基板的底表面上; 以及顶部电极，其设置在所述膜的顶表面上并与所述第一电极层的顶表面接触。

公开(公告)号：US20180201501A1

公开(公告)日：2018-07-19

申请号：US15922972

申请日：2018-03-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik SHIM ,  Seog-woo HONG ,  Seok-whan CHUNG ,  Chang-jung KIM

IPC: B81B7/00 ,  B06B1/02 ,  B81C1/00

CPC classification number: B81B7/007 ,  B06B1/0292 ,  B81C1/00301

Abstract: A capacitive micromachined ultrasonic transducer and a method of fabricating the same are provided. The capacitive micromachined ultrasonic transducer includes a device substrate including a first trench defining a plurality of first portions corresponding to an element and a second trench spaced apart from the first trench; a supporting unit provided on the device substrate, the supporting unit defining a plurality of cavities; a membrane provided on the supporting unit to cover the plurality of cavities; a top electrode electrically connected to a second portion in the second trench through a via hole penetrating through the membrane and the supporting unit; and a through silicon via (TSV) substrate provided on a bottom surface of the device substrate, the TSV substrate including a first via metal connected to the plurality of first portions corresponding to the element and a second via metal connected to the second portion.

公开(公告)号：US20150156571A1

公开(公告)日：2015-06-04

申请号：US14280725

申请日：2014-05-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Dong-sik SHIM ,  Seog-woo HONG ,  Seok-whan CHUNG ,  Chang-jung KIM

IPC: H04R1/00 ,  H01L21/02 ,  H01L23/48 ,  H01L21/768 ,  H01L21/304

CPC classification number: H04R1/00 ,  B06B1/0292 ,  H01L21/0237 ,  H01L21/3043 ,  H01L21/768 ,  H01L23/481 ,  H01L2924/0002 ,  H04R19/005 ,  H01L2924/00

Abstract: A capacitive micromachined ultrasonic transducer includes a device substrate including a first trench confining a plurality of first parts corresponding to a plurality of elements and a second trench confining a second part separated from the plurality of first parts, a supporting unit provided on the device substrate for confining a plurality of cavities corresponding to each of the plurality of elements, a membrane provided on the supporting unit to cover the plurality of cavities, an upper electrode provided on the membrane and electrically connected to the second part in the second trench through a via hole passing through the membrane and the supporting unit, and a through-silicon via (TSV) substrate provided on a lower surface of the device substrate, and including a plurality of first via metals connected to the plurality of first parts and a second via metal connected to the second part.

Abstract translation: 一种电容微加工超声波换能器包括：器件基板，包括限定对应于多个元件的多个第一部分的第一沟槽和限制与多个第一部分分离的第二部分的第二沟槽;设置在器件基板上的支撑单元， 限制与所述多个元件中的每一个相对应的多个空腔;设置在所述支撑单元上以覆盖所述多个空腔的膜;设置在所述膜上并通过通孔电连接到所述第二沟槽中的所述第二部分的上电极 穿过膜和支撑单元，以及设置在器件衬底的下表面上的穿硅通孔（TSV）衬底，并且包括连接到多个第一部分的多个第一通孔金属和连接到多个第一通孔的第二通孔金属 到第二部分。

公开(公告)号：US20150141795A1

公开(公告)日：2015-05-21

申请号：US14338507

申请日：2014-07-23

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jong-seok KIM ,  Sung-chan KANG ,  Hyung-joo KIM ,  Hyung-jae SHIN ,  Yong-seop YOON ,  Byung-gil JEONG ,  Seok-whan CHUNG ,  Chang-jung KIM

IPC: A61B5/00

CPC classification number: A61B5/0095 ,  A61B5/0091 ,  A61B5/708 ,  A61B8/0825 ,  A61B8/406 ,  A61B8/42

Abstract: A breast scanning apparatus which uses photoacoustic ultrasonic waves is provided. The breast scanning apparatus includes a body which includes a first hole and a second hole which are horizontally parallel to each other; a first compression plate and a second compression plate, at least one of which is movable in a vertical direction with respect to the body; a first sliding plate and a second sliding plate, which are respectively installed on surfaces of the first compression plate and the second compression plate and are facing each other and are movable in a first direction; a first ultrasonic transducer array in the first compression plate and facing the first sliding plate; and a first laser head in the first compression plate, which is movable in a second direction which is perpendicular to the first direction.

Abstract translation: 提供了使用光声超声波的乳房扫描装置。 乳房扫描装置包括：主体，其包括彼此水平平行的第一孔和第二孔; 第一压缩板和第二压缩板，其中至少一个可相对于主体在垂直方向上移动; 第一滑动板和第二滑动板，其分别安装在第一压缩板和第二压缩板的表面上并且彼此面对并且可沿第一方向移动; 第一超声波换能器阵列在第一压缩板中并面向第一滑板; 以及第一压缩板中的第一激光头，其可沿与第一方向垂直的第二方向移动。

公开(公告)号：US20140073927A1

公开(公告)日：2014-03-13

申请号：US14023821

申请日：2013-09-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-whan CHUNG

IPC: A61B8/00 ,  H01L29/84

CPC classification number: A61B8/4483 ,  B06B1/0292 ,  H01L29/84

Abstract: An ultrasonic transducer includes: a first electrode layer disposed on an upper substrate and a support; a second electrode layer which is disposed on a lower surface of the upper substrate and is separated from the first electrode layer; an upper electrode disposed on an upper surface of a membrane to contact an upper surface of the first electrode layer; a trench formed through the upper electrode, the membrane, the support, and the upper substrate; and a pad substrate disposed under the upper substrate and including bonding pads that electrically connect to the first and second electrode layers, respectively.

Abstract translation: 超声波换能器包括：设置在上基板和支撑体上的第一电极层; 第二电极层，其设置在所述上​​基板的下表面上并与所述第一电极层分离; 设置在膜的上表面上以接触第一电极层的上表面的上电极; 通过上电极，膜，支撑体和上基板形成的沟槽; 以及衬底基板，其设置在所述上​​基板下方，并且分别包括电连接到所述第一电极层和所述第二电极层的接合焊盘。

公开(公告)号：US20130062310A1

公开(公告)日：2013-03-14

申请号：US13669158

申请日：2012-11-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seok-whan CHUNG ,  Seok-jin KANG ,  Hyun-koo JEONG

IPC: B44C1/22

CPC classification number: B81C1/00396 ,  B81C2201/0198

Abstract: A shadow mask, a method of manufacturing the shadow mask, and a method of forming a thin film using the shadow mask are provided. The shadow mask includes an upper layer and a lower layer. The upper layer includes a first opening. The lower layer is formed on a lower surface of the upper layer around the first opening and includes an opening having the same size as the first opening. When the thin film is formed using the shadow mask, the lower layer of the shadow mask is close to the edge of a cavity of a substrate, and a position on which the thin film may be formed as defined by the lower layer of the shadow mask. Therefore, the thickness of the thin film can be uniform.

Abstract translation: 提供荫罩，荫罩的制造方法以及使用荫罩形成薄膜的方法。 荫罩包括上层和下层。 上层包括第一开口。 下层形成在第一开口周围的上层的下表面上，并且包括具有与第一开口相同尺寸的开口。 当使用荫罩形成薄膜时，荫罩的下层靠近基板的空腔的边缘，并且可以由薄膜的下层限定薄膜的位置 面具。 因此，薄膜的厚度可以是均匀的。