公开(公告)号：US10607965B2

公开(公告)日：2020-03-31

申请号：US16044886

申请日：2018-07-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Haesuk Lee ,  So-Young Kim ,  Seung-Han Woo

IPC: H01L25/065 ,  H01L23/538 ,  G11C5/02 ,  G11C5/06

Abstract: A stacked semiconductor device includes a plurality of semiconductor dies stacked in a first direction, M data paths electrically connecting the plurality of semiconductor dies, one data path including one or more through-silicon vias, where M is a positive integer, a transmission circuit including M serialization units configured to serialize P transmission signals to M serial signals and output the M serial signals to the M data paths, respectively, where P is a positive integer greater than M and a reception circuit including M parallelization units configured to receive the M serial signals from the M data paths and parallelize the M serial signals to P reception signals corresponding to the P transmission signals. The number of the through-silicon vias is reduced by serializing the transmission signals, transferring the serialized signals through the smaller number of data paths between the stacked semiconductor dies and then parallelizing the transferred signals.

公开(公告)号：US10373661B2

公开(公告)日：2019-08-06

申请号：US15479971

申请日：2017-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hae-Suk Lee ,  Reum Oh ,  Jin-Seong Park ,  Seung-Han Woo

IPC: G11C5/02 ,  G11C5/06 ,  G11C7/06 ,  G11C7/10 ,  H04L7/033 ,  H03K19/21 ,  G11C7/22 ,  G11C7/12 ,  H03K3/356 ,  H01L25/065

Abstract: A stacked semiconductor device includes a plurality of semiconductor dies stacked in a vertical direction, first and second signal paths, a transmission unit and a reception unit. The first and second signal paths electrically connect the plurality of semiconductor dies, where each of the first signal path and the second signal path includes at least one through-substrate via. The transmission unit generates a first driving signal and a second driving signal in synchronization with transitioning timing of a transmission signal to output the first driving signal to the first signal path and output the second driving signal to the second signal path. The reception unit receives a first attenuated signal corresponding to the first driving signal from the first signal path and receives a second attenuated signal corresponding to the second driving signal from the second signal path to generate a reception signal corresponding to the transmission signal.