公开(公告)号：US20240353795A1

公开(公告)日：2024-10-24

申请号：US18736084

申请日：2024-06-06

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungbeom PARK ,  Sungmin Park ,  Jaehyeon Son ,  Heejun Ahn ,  Myungjun Lee

IPC: G03H1/00 ,  G01N21/95 ,  G02B21/00 ,  G03H1/04 ,  G03H1/16 ,  H01L21/66

CPC classification number: G03H1/0005 ,  G01N21/9501 ,  G01N21/9503 ,  G02B21/0016 ,  G03H1/0443 ,  G03H1/16 ,  H01L22/12 ,  G03H2001/005 ,  G03H2001/045 ,  G03H2001/0452

Abstract: Provided is a holographic microscope including an input optical system configured to emit polarized input beam, a first beam splitter configured to emit an object beam by reflecting a portion of the polarized input beam, and emit a reference beam by transmitting a remaining portion of the polarized input beam, a reference optical system configured to separate the reference beam into a first reference beam and a second reference beam, a camera configured to receive the first reference beam and the second reference beam and the object beam that is reflected by an inspection object, the camera including a micro polarizer array, wherein a first polarization axis of the first reference beam is perpendicular to a second polarization axis of the second reference beam.

公开(公告)号：US20240272561A1

公开(公告)日：2024-08-15

申请号：US18373030

申请日：2023-09-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junho SHIN ,  Seungbeom PARK ,  Jangwoon SUNG ,  Hojun LEE ,  Wookrae KIM ,  Myungjun LEE

IPC: G03F7/00 ,  G06T7/00

CPC classification number: G03F7/706839 ,  G03F7/706 ,  G03F7/70641 ,  G06T7/001 ,  G06T2207/30148

Abstract: Provided is a method of managing a semiconductor processing apparatus, including irradiating, by a light source, a plurality of regions included in a diffuser on a mask stage with extreme ultraviolet (EUV) light, reflecting or transmitting, by the diffuser, the EUV light, transmitting, by an optical system, the EUV light from the diffuser, receiving, by an image sensor, the EUV light from the optical system, obtaining, by the image sensor, a plurality of original images corresponding to the plurality of regions, generating, based on an optical prediction model, a plurality of predictive images estimating a diffraction pattern in the image sensor, adjusting an optical prediction model by comparing the plurality of predictive images with the plurality of original images, and generating, based on the optical prediction model, a plurality of wavefront images corresponding to optical characteristics of each of the plurality of mirrors.

公开(公告)号：US20230207356A1

公开(公告)日：2023-06-29

申请号：US17980723

申请日：2022-11-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seungbeom PARK ,  Seunghwa HYUN ,  Kijoo HONG ,  Taejoong KIM ,  Youngkyu PARK

IPC: H01L21/67 ,  H04N5/247 ,  G06T7/00 ,  G06T7/70 ,  H04N5/225 ,  G03F7/20

CPC classification number: H01L21/67259 ,  G03F7/7065 ,  G06T7/0004 ,  G06T7/70 ,  H01L21/67288 ,  H04N5/247 ,  H04N5/2256 ,  G06T2207/10056 ,  G06T2207/30148

Abstract: A wafer processing apparatus includes an X-θ stage unit having a rotary chuck capable of moving in an X direction and rotating in a θ direction, wherein a wafer is mounted on the rotary chuck and the wafer includes an edge portion adjacent to an edge of the wafer. In addition, the wafer processing apparatus includes: an edge bead removal (EBR) measurement and eccentricity measurement unit which is capable of inspecting a bead removal state of the edge portion of the wafer, and measuring eccentricity between the center of the rotary chuck and the center of the wafer; and an edge exposure of wafer (EEW) process unit which exposes the edge portion of the wafer after correcting the eccentricity between the center of the rotary chuck and the center of the wafer measured by the EBR measurement and eccentricity measurement unit.