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公开(公告)号：US20190320050A1
公开(公告)日：2019-10-17
申请号：US16387059
申请日：2019-04-17
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jinho LIM , Seungjae BAE , Yonghwa KIM , Jinyoung PARK , Bokyung SIM , Byounguk YOON
Abstract: A conduit structure of an electronic device and an electronic device are provided. The conduit structure includes an inner structure including a front surface and a rear surface, wherein the front surface includes a first region configured to receive a display and a second region, which is a remaining area of the front surface of the inner structure; a receiver hole configured to penetrate the second region and to connect a receiver receiving space and an external space of the inner structure; a first through-hole configured to penetrate the first region and to connect the receiver receiving space and the front surface of the inner structure; a second through-hole, which is spaced apart from the first through-hole, configured to penetrate the first region and to connect the rear surface of the inner structure; and a flow path configured to connect the first through-hole and the second through-hole at the front surface of the inner structure.
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公开(公告)号：US20210392787A1
公开(公告)日：2021-12-16
申请号：US17289285
申请日：2019-11-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Haein CHUNG , Kyungha KOO , Seungjae BAE , Hyunjoong YOON , Jaeho CHUNG , Yongwon CHO
Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.
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公开(公告)号：US20200014781A1
公开(公告)日：2020-01-09
申请号：US16482401
申请日：2018-01-05
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yongseok LEE , Minsu JUNG , Seungjae BAE , Jongkyun IM , Jina MOCK , Jinyoung PARK
IPC: H04M1/02
Abstract: Disclosed is an electronic device comprising: a housing including a first plate, a second plate and a lateral member for covering a gap between the first plate and the second plate; a touch screen display exposed through a first part of the first plate; a sensor exposed through the first plate; a wireless communication circuit arranged inside the housing; and a processor which is arranged inside the housing and is electrically connected to the touch screen display, the sensor and the wireless communication circuit. In addition, other embodiments are possible.
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Patent Agency Ranking
公开(公告)号：US20230209701A1
公开(公告)日：2023-06-29
申请号：US18115333
申请日：2023-02-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seungjae BAE , Moohyun BAEK , Soonwoong YANG , Changmin LEE , Jongchul CHOI
CPC classification number: H05K1/0243 , H05K1/145 , H05K1/147 , H05K2201/10098 , H05K2201/10037
Abstract: An electronic device may include: a housing forming at least a portion of the exterior of the electronic device; a first printed circuit board (PCB) disposed in a first region formed by the housing; a second printed circuit board disposed in a second region formed by the housing; a first antenna module disposed in a third region formed by the housing and adjacent to at least a portion of the exterior; a bracket which fixes the first antenna module to the housing; a flexible printed circuit board (FPCB) which electrically connects the first printed circuit board to the first antenna module; and at least one coaxial cable which electrically connects the first printed circuit board to the second printed circuit board, wherein the at least one coaxial cable may be disposed so as to be stacked with the first antenna module with respect to the direction perpendicular to the rear surface of the electronic device and may be fixed to the bracket. Other various embodiments are possible.
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公开(公告)号：US20230063624A1
公开(公告)日：2023-03-02
申请号：US17985596
申请日：2022-11-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junhee HAN , Hanul MOON , Soohwan KIM , Seungjae BAE , Inho SHIN , Jiyoung LIM , Yongwon CHO , Jiwoo LEE
Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.
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公开(公告)号：US20240290129A1
公开(公告)日：2024-08-29
申请号：US18655939
申请日：2024-05-06
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Junhee HAN , Hanul MOON , Soohwan KIM , Seungjae BAE , Inho SHIN , Jiyoung LIM , Yongwon CHO , Jiwoo LEE
CPC classification number: G06V40/13 , G06F1/1633
Abstract: According to various embodiments, an electronic device is provided and includes a housing, a support frame which is arranged in an internal space of the housing and has a first surface, a second surface facing a direction opposite to the first surface, and a through hole, a display supported by the first surface and arranged to be seen from outside through at least a part of the housing, and an optical sensor module arranged in the second surface to face the through hole.
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公开(公告)号：US20170142239A1
公开(公告)日：2017-05-18
申请号：US15351055
申请日：2016-11-14
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungjae BAE , Taedoo CHOUNG
CPC classification number: H04M1/0202 , G06F1/1626 , G06F1/1635 , G06F1/1656 , G06F1/1658 , G06F1/1698
Abstract: An electronic device is provided. The electronic device includes a first plate, a second plate having a flat surface and being at least partially formed of a polymer material, a housing, which encloses a space between the first plate and the second plate, is at least partially formed of a metal material, and includes a side member that is integrally formed with the second plate, wherein the side member has a first portion adjacent to a peripheral portion of the second plate, and the first portion has a first surface substantially facing in the second direction, contacts the peripheral portion of the second plate, and has a second surface facing in a third direction different from the first direction and the second direction.
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公开(公告)号：US20160065801A1
公开(公告)日：2016-03-03
申请号：US14837996
申请日：2015-08-27
Applicant: Samsung Electronics Co., Ltd.
Inventor： Seungjae BAE , Soonwoong YANG , Seungki CHOI
IPC: H04N5/225
CPC classification number: H04N5/2257 , H04N5/23258
Abstract: An electronic device having a camera module. The electronic device comprises: a Printed Circuit Board (PCB) located on a surface of the camera module; a lens module mounted on a first area of the PCB; fixing maintaining components mounted on a second area of the PCB; and a third area located between the first area and the second area, and having at least one opening.
Abstract translation: 具有相机模块的电子设备。 电子设备包括：位于相机模块表面上的印刷电路板（PCB）; 安装在PCB的第一区域上的透镜模块; 固定保持组件安装在PCB的第二区域上; 以及位于所述第一区域和所述第二区域之间的第三区域，并且具有至少一个开口。
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