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    HEAT RADIATING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME
    1.
    发明申请
    HEAT RADIATING MEMBER AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20230008679A1

    公开(公告)日：2023-01-12

    申请号：US17862205

    申请日：2022-07-11

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yunjeong PARK ,  Kyungha KOO ,  Dongku KANG ,  Jihong KIM ,  Haein CHUNG

    IPC: G06F1/20 ,  H05K7/20 ,  G02B27/01

    Abstract: Various embodiments of the disclosure relate to a heat radiating structure and an electronic device including the same. According to various embodiments of the disclosure, it is possible to provide an electronic device including: a housing including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a third surface enclosing an internal space between the first surface and the second surface, wherein at least one portion of the third surface faces a third direction different from the first direction and the second direction, wherein a first opening is formed in the first surface, and a second opening is formed in the third surface; a substrate disposed in the internal space; an electronic component disposed on at least one surface of the substrate; and a mesh member disposed in the internal space and disposed adjacent to the first opening and the second opening.

    HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME
    2.
    发明申请
    HEAT DISSIPATION STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20210392787A1

    公开(公告)日：2021-12-16

    申请号：US17289285

    申请日：2019-11-01

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haein CHUNG ,  Kyungha KOO ,  Seungjae BAE ,  Hyunjoong YOON ,  Jaeho CHUNG ,  Yongwon CHO

    IPC: H05K7/20 ,  G06F1/20 ,  H05K9/00

    Abstract: An embodiment of the present invention discloses a heat dissipation structure and an electronic device including the heat dissipation structure, the heat dissipation structure comprising: at least one heat dissipation plate; at least one rigid plate which forms an opening in one area and is coupled to the upper portion of the at least one heat dissipation plate to support durability of the at least one heat dissipation plate; at least one heat pipe of which at least a portion is accommodated in the opening formed by the at least one rigid plate and is coupled to an area of the at least one heat dissipation plate that faces the at least one heat pipe; and at least one fixing tool which supports the fixing between the at least one heat dissipation plate and the at least one rigid plate. In addition, various embodiments identified through the specification are possible.

    ELECTRONIC DEVICE INCLUDING HINGE MODULE
    3.
    发明公开
    ELECTRONIC DEVICE INCLUDING HINGE MODULE 审中-公开

    公开(公告)号：US20230236626A1

    公开(公告)日：2023-07-27

    申请号：US18175537

    申请日：2023-02-28

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myoungjun CHOI ,  Haein CHUNG

    IPC: G06F1/16 ,  G06F1/20 ,  H05K5/02 ,  H05K5/03 ,  H05K7/20

    CPC classification number: G06F1/1616 ,  G06F1/1681 ,  G06F1/203 ,  H05K5/0226 ,  H05K5/03 ,  H05K7/20136

    Abstract: According to various embodiments of the disclosure, an electronic device may includes: a first housing in which a display module is disposed; a second housing in which a circuit board and a cooling fan connected to the circuit board are accommodated, where a first opening is defined in the second housing to introduce air into the cooling fan; and a hinge module rotatably connected to the first housing and the second housing, and disposed adjacent to the first opening. The hinge module may includes: a hinge housing in which a first hinge opening is defined to be connected to the first opening; a first main gear disposed in the hinge housing and operably connected to the first housing; a second main gear operably connected to the second housing and configured to rotate in correspondence with the first main gear; a driving gear disposed adjacent to at least one of the first main gear or the second main gear and rotatable in correspondence with at least one of the first main gear or the second main gear; and a first cover plate disposed in the hinge housing and including a first rack gear area which meshes with the driving gear. The electronic device may be switchable between a closed state in which an angle formed by the first housing and the second housing is less than a predetermined angle and an open state in which the angle formed by the first housing and the second housing is equal to or greater than the predetermined angle. When the electronic device is in the closed state, the first cover plate is disposed to overlap with at least part of the first hinge opening. When the electronic device is in the open state, the first cover plate may be spaced apart from the first hinge opening, and the first hinge opening may be opened.

    HINGE STRUCTURE WITH AIR VENT AND ELECTRONIC DEVICE HAVING THE SAME
    6.
    发明公开
    HINGE STRUCTURE WITH AIR VENT AND ELECTRONIC DEVICE HAVING THE SAME 审中-公开

    公开(公告)号：US20230280804A1

    公开(公告)日：2023-09-07

    申请号：US18318003

    申请日：2023-05-16

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Haein CHUNG ,  Hansang KIM ,  Kunwoo BAEK ,  Giyeon KO ,  Jonghyun LIM ,  Chihwan JEONG ,  Hui JEONG ,  Myoungjun CHOI

    IPC: G06F1/20 ,  H05K7/20 ,  G06F1/16

    CPC classification number: G06F1/20 ,  G06F1/1616 ,  G06F1/1681 ,  H05K7/20145

    Abstract: An electronic device includes first and second housings rotatable relative to each other, a fan inside the housing, and a hinge structure rotatably connecting the first and second housings to each other. The hinge structure includes a vent member rotating together with rotation of the first and second housings. The vent member includes first and second portions which guide first air flow between intake and exhaust openings together with operation of the fan. The first and second housings which face each other define a first angle therebetween, the first and second housings which are maximally rotated define a second angle therebetween, and the first and second housings forming a third angle between the first angle and the second angle, rotates the vent member to dispose the first and second vent portions together guiding air flow in different directions, relative to the front side of the electronic device.

    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION SHEET
    7.
    发明申请
    ELECTRONIC DEVICE INCLUDING HEAT DISSIPATION SHEET 有权

    公开(公告)号：US20230039881A1

    公开(公告)日：2023-02-09

    申请号：US17975169

    申请日：2022-10-27

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Haein CHUNG ,  Kyungha KOO ,  Kangsik KIM ,  Wonmin KIM

    IPC: H05K7/20 ,  F16F15/04 ,  H04M1/02

    Abstract: An electronic device includes a first electrical element, a heat dissipation sheet having a heat diffusion member for diffusing the heat generated from the first electrical element, and an anti-shock member arranged to be stacked with at least a part of the heat diffusion member; and a bracket which provides a space for accommodating the heat dissipation sheet. The heat dissipation sheet includes a first area, a second area, and a third area arranged between the first area and the second area.

    CAMERA MODULE PROVIDING OIS FUNCTION AND ELECTRONIC DEVICE COMPRISING THE SAME
    8.
    发明申请
    CAMERA MODULE PROVIDING OIS FUNCTION AND ELECTRONIC DEVICE COMPRISING THE SAME 审中-公开

    公开(公告)号：US20180180900A1

    公开(公告)日：2018-06-28

    申请号：US15857027

    申请日：2017-12-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Haein CHUNG ,  Jinwon LEE ,  Chongsam Chung

    IPC: G02B27/64 ,  G03B5/02

    CPC classification number: G02B27/646 ,  G02B7/00 ,  G03B5/02 ,  G03B2205/0015 ,  H04N5/2328

    Abstract: A camera module providing an OIS function is disclosed and includes a camera device configured to rotate in a first direction perpendicular to an optical axis, a first rotation support configured to provide support so that the first direction becomes a central axis for rotating the camera device, and a flexible printed circuit board (FPCB) configured to connect the camera device and the first rotation support physically at two or more separate points. A cross sectional shape of the camera module in the direction of a center point of the central axis is configured so that line segments connecting the center point to the two or more separate points, and the cross sectional shape of the flexible printed circuit board form a closed loop, and at least one line segment connecting two random points in the closed loop passes outside of the closed loop.

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