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公开(公告)号：US10199366B2
公开(公告)日：2019-02-05
申请号：US15627536
申请日：2017-06-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seungwon Kim , Su-Jin Kwon , Junwon Han , Hyunwoo Kim , Byung Lyul Park
Abstract: A method of manufacturing a semiconductor package, the method including forming a hole that penetrates an interconnect substrate; providing a first carrier substrate below the interconnect substrate; providing a semiconductor chip in the hole; forming a molding layer by coating a molding composition on the semiconductor chip and the interconnect substrate; adhering a second carrier substrate onto the molding layer with an adhesive layer; removing the first carrier substrate to expose a bottom surface of the semiconductor chip and a bottom surface of the interconnect substrate; forming a redistribution substrate below the semiconductor chip and the interconnect substrate; detaching the second carrier substrate from the adhesive layer; and removing the adhesive layer.
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公开(公告)号：US09627205B2
公开(公告)日：2017-04-18
申请号：US14511191
申请日：2014-10-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jun Won Han , Su-Jin Kwon , Hye-Ryun Kim , Jae-Hyun Kim , Jung-Sik Choi
IPC: H01L21/4763 , H01L21/033 , C08L53/00 , H01L21/311 , C08F297/02 , H01L21/768 , G03F7/00
CPC classification number: H01L21/0337 , C08F297/026 , C08L53/00 , G03F7/0002 , H01L21/0332 , H01L21/31144 , H01L21/76816
Abstract: In a method of manufacturing a semiconductor device, a blend solution that includes a block copolymer and an adsorbent is prepared. The block copolymer is synthesized by a copolymerization between a first polymer unit and a second polymer unit having a hydrophilicity greater than that of the first polymer unit. The adsorbent on which the block copolymer is adsorbed is extracted. The block copolymer is separated from the adsorbent. The block copolymer is collected. The block copolymer may be used to form a mask on an object layer on a substrate and the mask used to etch the object layer.
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