公开(公告)号：US20190096786A1

公开(公告)日：2019-03-28

申请号：US16204543

申请日：2018-11-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： JaeHong PARK ,  Hanhong LEE ,  Sungwoo JOO ,  Woon-young BAEK

IPC: H01L23/433 ,  H01L23/04 ,  H01L23/427 ,  H01L23/053 ,  H01L25/065 ,  H01L23/544 ,  H01L23/00 ,  H01L23/40

CPC classification number: H01L23/433 ,  H01L23/04 ,  H01L23/053 ,  H01L23/427 ,  H01L23/4334 ,  H01L23/544 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2023/4068 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06589 ,  H01L2924/1434 ,  H01L2924/15162 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/166 ,  H01L2924/18161 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor package includes a package substrate including a fastening section at one end and a connecting terminal section at an opposite end, at least one semiconductor device mounted on the package substrate, at least one heat pipe on the at least one semiconductor device, and a lid on the at least one semiconductor device and the at least one heat pipe. At least one end of the heat pipe is between the at least one semiconductor device and either the fastening section or the connecting terminal section.