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公开(公告)号：US20210305477A1
公开(公告)日：2021-09-30
申请号：US17343182
申请日：2021-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin HONG , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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2.发明授权公开(公告)号：US12218148B2
公开(公告)日：2025-02-04
申请号：US17512126
申请日：2021-10-27
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jeongyun Kim , Hosuk Kang , Jinwoo Jung , Changjoon Lee , Tackmo Lee , Gyun Heo , Soonmin Hong
Abstract: Provided is a display module including a glass substrate, a thin film transistor (TFT) layer provided on a front surface of the glass substrate, a driving circuit provided on a rear surface of the glass substrate and configured to drive the TFT layer, a plurality of light emitting diodes (LED) electrically connected to the TFT layer, a plurality of first connection pads provided at intervals in a portion of the front surface of the glass substrate and electrically connected to a TFT circuit provided in in the TFT layer, a plurality of second connection pads provided at intervals in a portion of the rear surface of the glass substrate and electrically connected to the driving circuit, and a plurality of side wirings extending from the lateral surface of the glass substrate to a portion of an insulating layer and extending to another portion of the insulating layer.
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公开(公告)号：US11646400B2
公开(公告)日：2023-05-09
申请号：US17343182
申请日：2021-06-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin Hong , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
CPC classification number: H01L33/62 , H01L25/167 , H01L27/1262 , H01L2933/0066
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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公开(公告)号：US20230126724A1
公开(公告)日：2023-04-27
申请号：US17896738
申请日：2022-08-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin HONG , Seongho Son , Jongsung Lee , Gunwoo Kim , Seonghwan Shin , Changjoon Lee , Tackmo Lee
Abstract: A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of a side end of the side cover, and including a first portion being in contact with and grounded to the metal plate and a second portion connected to the first portion and positioned on the side end of the side cover.
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公开(公告)号：US12033995B2
公开(公告)日：2024-07-09
申请号：US18134908
申请日：2023-04-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Changkyu Chung , Gyun Heo , Tackmo Lee , Kyungwoon Jang , Soonmin Hong , Daesuck Hwang
CPC classification number: H01L25/167 , G09G3/32 , H01L33/62 , G09G2300/026 , G09G2300/0426 , G09G2300/0452 , G09G2300/0842
Abstract: A display module, including a plurality of pixels, includes: a first substrate; a plurality of micro pixel packages provided on an upper surface of the first substrate; and a driver integrated circuit (IC) configured to transmit a driving signal to the plurality of micro pixel packages. Each of the plurality of micro pixel packages includes a second substrate; a plurality of inorganic light emitting devices provided on an upper surface of the second substrate; and a micro pixel controller provided on a lower surface of the second substrate, the micro pixel controller being configured to control the plurality of inorganic light emitting devices.
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Patent Agency Ranking
公开(公告)号：US20240204149A1
公开(公告)日：2024-06-20
申请号：US18593207
申请日：2024-03-01
Applicant: Samsung Electronics Co., Ltd.
Inventor： Tackmo Lee , Gunwoo Kim , Seonghwan Shin , Gyun Heo , Soonmin Hong
IPC: H01L33/48 , H01L25/075 , H01L25/16 , H01L27/15 , H01L33/62
CPC classification number: H01L33/486 , H01L25/0753 , H01L25/167 , H01L27/156 , H01L33/62 , H01L2933/0066
Abstract: A display module includes a substrate including a mounting surface on which a plurality of inorganic light-emitting devices are mounted, a side surface, and a rear surface opposite to the mounting surface; a front cover covering the mounting surface and extending to an outer area from the mounting surface; a metal plate positioned on the rear surface of the substrate; a side molding covering the side surface and positioned below the outer area from the mounting surface; and a grounding member grounded to the metal plate and adhered to a lower surface of the side molding, where the side molding is injection-molded on the side surface of the substrate and is in contact with the side surface.
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公开(公告)号：US20230299251A1
公开(公告)日：2023-09-21
申请号：US18096332
申请日：2023-01-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin Hong , Tackmo Lee , Gunwoo Kim , Seonghwan Shin
IPC: H01L33/62 , H01L25/075 , G09F9/33 , G09F9/302 , H01L27/15
CPC classification number: H01L33/62 , H01L25/0753 , G09F9/33 , G09F9/3026 , H01L27/156
Abstract: A display module includes: a substrate including a mounting surface on which a plurality of inorganic light-emitting diodes emitting light in a first direction are mounted, a side surface, and a rear surface being opposite to the mounting surface; a front cover bonded with the mounting surface and covering the mounting surface in the first direction; a metal plate bonded with the rear surface; a side cover surrounding the side surface; and a side end member covering at least one portion of the side cover and extending in a second direction being orthogonal to the first direction along the side surface, wherein the side end member includes a body extending in the second direction, and a plurality of ribs extending from the body in the first direction and arranged at intervals along the second direction.
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公开(公告)号：US11658162B2
公开(公告)日：2023-05-23
申请号：US16629768
申请日：2018-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngchul Lee , Taesang Park , Kyoree Lee , Tackmo Lee , Gyun Heo , Youngjun Moon , Won Choi
IPC: H01L25/075 , H01L25/16 , H01L33/00 , H01L33/62 , H01L33/52
CPC classification number: H01L25/0753 , H01L25/167 , H01L33/0095 , H01L33/62 , H01L33/0093 , H01L33/52 , H01L2933/005 , H01L2933/0066
Abstract: The disclosure describes a micro Light Emitting Diode (LED) display. The display may include a Printed Circuit Board (PCB) including a plurality of solder pads, a micro LED package including a plurality of micro LED chips, and a plurality of solder electrodes which bond the micro LED chips onto the solder pads of the PCB. The micro LED package may be re-arranged in an Red Green Blue (RGB) state on a temporary fixing film by using a pickup device in accordance with a display pixel configuration, after the micro LED chips are attached to a carrier film.
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公开(公告)号：US20230090105A1
公开(公告)日：2023-03-23
申请号：US18074075
申请日：2022-12-02
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Seonghwan Shin , Gunwoo Kim , Hyunsun Kim , Yangsoo Son , Tackmo Lee , Jeongin Han , Soonmin Hong
Abstract: A display module is provided. The display module includes a substrate including a mounting surface, on which a plurality of inorganic light emitting devices is mounted, and a side surface; a front cover covering the mounting surface and including a side end that is in a region outwards from the mounting surface; a side cover covering the side surface of the substrate and bonded to a lower surface of the front cover, corresponding to the region outwards from the mounting surface, and the side surface of the substrate; and a light absorbing end member covering the side end of the front cover and configured to prevent light, emitted from the plurality of inorganic light emitting devices, from passing through the side end of the front cover.
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10.发明授权公开(公告)号：US11056630B2
公开(公告)日：2021-07-06
申请号：US16786514
申请日：2020-02-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Soonmin Hong , Gyuhwa Kim , Jeonggen Yoon , Tackmo Lee , Gyun Heo , Youngjun Moon , Kyungwoon Jang
Abstract: A display module includes a glass substrate having a front surface and a back surface opposite to the front surface; a TFT layer; LEDs mounted on the TFT layer; and a plurality of side wirings formed at intervals in an edge area of the glass substrate, and the edge area includes a first area corresponding to a side surface of the glass substrate, a second area adjacent to the side surface, and a third area adjacent to the side surface, and a first chamfered surface formed by chamfering a corner at which the first area and the second area meet, and a second chamfered surface formed by chamfering a corner at which the first area and the third area meet, and each of the plurality of side wirings is disposed along the second area, the first chamfered surface, the first area, the second chamfered surface, and the third area.
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