公开(公告)号：US20220021589A1

公开(公告)日：2022-01-20

申请号：US17374716

申请日：2021-07-13

Applicant: Samsung Electronics Co., Ltd. ,  Korea University Research and Business Foundation

Inventor： Seongkyu SONG ,  Joonwoo KIM ,  Sangheon PACK ,  Jaewook LEE ,  Taeyun KIM ,  Youbin JEON ,  Jungsoo JUNG

IPC: H04L12/24 ,  H04W88/18 ,  H04W24/02

Abstract: A method, performed by an electronic device, of placing a micro network function, includes: determining at least one micro network function used for a service; predicting control signaling overhead of at least one cell including at least one cell edge cloud, based on a history of control signaling overhead of the at least one cell; and placing the at least one micro network function in the at least one cell edge cloud, based on the predicted control signaling overhead of the at least one cell.

公开(公告)号：US20230098815A1

公开(公告)日：2023-03-30

申请号：US17816759

申请日：2022-08-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minki CHO ,  Jungsoo KIM ,  Dohyun AHN ,  Wonchul CHO ,  Taeyun KIM ,  Wonjun JEONG ,  Kwangsic CHOI ,  Chonguk HEO

IPC: H04N5/225 ,  G03B17/55

Abstract: A camera module includes: a printed circuit board having a conductive pad exposed on one surface of the printed circuit board, an image sensor disposed on the printed circuit board, a conductive plate disposed between the printed circuit board and the image sensor and electrically connected to the conductive pad, an actuator disposed above the image sensor and configured to adjust a position of a lens assembly, and a shield can surrounding the actuator and electrically connected to the conductive plate. The conductive plate is configured to emit heat generated from the image sensor to the outside of the camera module by contact with the image sensor.

公开(公告)号：US20220416880A1

公开(公告)日：2022-12-29

申请号：US17529831

申请日：2021-11-18

Applicant: Samsung Electronics Co., Ltd. ,  KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION

Inventor： Seongkyu SONG ,  Joonwoo KIM ,  Taeyun KIM ,  Sangheon PACK ,  Jaewook LEE ,  Jungsoo JUNG

IPC: H04B7/185 ,  H04W76/12

Abstract: A communication method and an apparatus in a wireless communication system are provided. The communication method includes identifying, by a first satellite including a session management function within a space core network (SCN), a protocol data unit (PDU) session establishment request from a UE, selecting, by the first satellite, a satellite gateway for communicating with a ground gateway, and requesting, by the first satellite, the satellite gateway to allocate a port number which is matched to identification information of a first general packet radio service (GPRS) tunneling protocol-user (GTP-U) tunnel to be used for transmission and reception of packets for a PDU session requested by the UE in a path between a satellite base station which the UE accesses and the satellite gateway, wherein the packets are transmitted or received to and from a terrestrial core network (TCN) by using address information which is converted based on the port number.

公开(公告)号：US20240257862A1

公开(公告)日：2024-08-01

申请号：US18507615

申请日：2023-11-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Taeyun KIM ,  Junmyung WOO ,  Taewon KIM ,  Yanggyoon LOH

IPC: G11C11/4091 ,  G11C11/408 ,  G11C11/4094

CPC classification number: G11C11/4091 ,  G11C11/4087 ,  G11C11/4094

Abstract: An LSA circuit includes a first sensing transistor and a second sensing transistor connected in series between a local I/O line and a complementary local I/O line, a pre-sensing driver configured to drive an LSA sensing voltage to a connection node between the first sensing transistor and the second sensing transistor during a pre-sensing operation of the LSA circuit, and a main-sensing driver configured to drive the LSA sensing voltage to the connection node during a main-sensing operation of the LSA circuit. A driving strength of the pre-sensing driver is set to be weaker than a driving strength of the main-sensing driver, and the pre-sensing driver is driven before the main-sensing driver.

公开(公告)号：US20190208638A1

公开(公告)日：2019-07-04

申请号：US16206029

申请日：2018-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwajoong JUNG ,  Manho KIM ,  Youngseok KIM ,  Hyungjin RHO ,  Chiyoung PARK ,  Taeyun KIM ,  Yonghwan CHOI ,  Kihuk LEE

IPC: H05K1/18 ,  H05K1/11 ,  G02B7/02

CPC classification number: H05K1/181 ,  G02B7/021 ,  G02B7/09 ,  G02B27/646 ,  G03B5/00 ,  G03B13/36 ,  G03B2205/0007 ,  H05K1/111 ,  H05K2201/0314 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A camera module is provided. The camera includes a circuit board to which an image sensor disposed is disposed, one or more first conductive portions at one or more regions of the circuit board, one or more elastic connectors, including an elastic member and a metal film surrounding at least part of an outer portion of the elastic member, the elastic connector is disposed on the first conductive region, a lens device including one or more lenses and a driver capable of moving the lens device, a housing which accommodates the lens device, and a second conductive portion in one or more regions of the housing. The housing may be disposed above the elastic connector such that the second conductive portion is electrically coupled to the first conductive portion due to a contact with the elastic connector.